Patents by Inventor Bin Mu
Bin Mu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250228919Abstract: Disclosed is an acylated insulin, a pharmaceutical formulation thereof, a pharmaceutical composition thereof with a long-acting GLP-1 compound, and a medical use of the acylated insulin, the pharmaceutical formulation and the pharmaceutical composition. Compared with insulin degludec or other insulin derivatives, the acylated insulin has an unexpected, significantly increased drug effect, a longer duration of action, a longer in vivo half-life, an excellent bioavailability, as well as better physical and chemical stabilities.Type: ApplicationFiled: February 12, 2025Publication date: July 17, 2025Inventors: Zhongru Gan, Wei Chen, Yining Zhang, Fangkai Xue, Lingyu Cai, Jianghong Niu, Bin Mu
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Publication number: 20250222059Abstract: The present disclosure provides use of an effective part extract of Monochasma savatieri in preparation of a drug for treating an inflammatory disease or a tumor. In the present disclosure, an effective part of Monochasma savatieri is separated and purified by various separation and purification methods (including solvent extraction, macroporous resin column chromatography, MCI column separation, and Sephadex LH-20 gel column separation) separately, to obtain the effective part extract of Monochasma savatieri. The effective part extract of Monochasma savatieri is capable of significantly inhibiting secretion of TNF-?, and significantly inhibiting proliferation of breast cancer cells and lung cancer cells, thereby effectively treating the inflammatory disease or the tumor. The present disclosure provides a favorable theoretical basis for finding a drug that can effectively treat the inflammatory disease or the tumor from the Monochasma savatieri, which is of great significance to development of novel drugs.Type: ApplicationFiled: March 31, 2025Publication date: July 10, 2025Applicants: YICHUN BINGCHEN AGRICULTURAL TECHNOLOGY DEVELOPMENT CO., LTD, HARBIN KANGLONG PHARMACEUTICAL CO., LTDInventors: Bin Mu, Jiangong Shi, Tiantai Zhang, Qinglan Guo, Weiquan Li
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Publication number: 20250218880Abstract: Methods for fabricating glass cores with conductive vias (e.g., TGVs), as well as related devices, are disclosed. Methods described herein are based on fabricating pillars of conductive materials (e.g., metals or metal alloys) on a temporary support, inserting the pillars into corresponding via openings in a glass core, and at least partially filling the remaining space in the openings with a filler material.Type: ApplicationFiled: December 29, 2023Publication date: July 3, 2025Inventors: Bohan Shan, Hongxia Feng, Haobo Chen, Jose Waimin, Ryan Carrazzone, Bin Mu, Ziyin Lin, Yiqun Bai, Kyle Jordan Arrington, Srinivas Venkata Ramanuja Pietambaram, Gang Duan, Dingying Xu, Jeremy Ecton, Brandon C. Marin, Xiaoying Guo
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Publication number: 20250218998Abstract: Embodiments disclosed herein include an apparatus that comprises a first substrate and a second substrate over the first substrate. In an embodiment, an array of interconnects is provided between the first substrate and the second substrate. The array of interconnects comprises a first interconnect with a first material composition, and a second interconnect with a second material composition that is different than the first material composition.Type: ApplicationFiled: December 29, 2023Publication date: July 3, 2025Inventors: Bohan SHAN, Shripad GOKHALE, Rui ZHANG, Mine KAYA, Haobo CHEN, Steve S. CHO, Timothy GOSSELIN, Kartik SRINIVASAN, Edvin CETEGEN, Kyle ARRINGTON, Nicholas S. HAEHN, Ryan CARRAZZONE, Hongxia FENG, Srinivas Venkata Ramanuja PIETAMBARAM, Gang DUAN, Ashay DANI, Yoshihiro TOMITA, Ziyin LIN, Yiqun BAI, Jose WAIMIN, Dingying David XU, Bin MU, Mohit GUPTA, Jeremy D. ECTON, Brandon C. MARIN, Xiaoying GUO, Jung Kyu HAN, Liang HE
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Publication number: 20250218926Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a substrate having a material and conductive pathways through the material, wherein the material includes an organic dielectric material; and a microelectronic component having a first surface and an opposing second surface, wherein the first surface of the microelectronic component is electrically coupled to the conductive pathways in the material by interconnects, wherein the interconnects include solder and are surrounded by a capillary underfill material, and wherein the microelectronic component and the capillary underfill material are surrounded by the material of the substrate.Type: ApplicationFiled: December 28, 2023Publication date: July 3, 2025Applicant: Intel CorporationInventors: Minglu Liu, Bohan Shan, Ziyin Lin, Haobo Chen, Yiqun Bai, Kyle Jordan Arrington, Jose Waimin, Ryan Carrazzone, Hongxia Feng, Srinivas Venkata Ramanuja Pietambaram, Gang Duan, Dingying Xu, Bin Mu, Mohit Gupta, Jeremy Ecton, Brandon C. Marin, Xiaoying Guo, Ashay Dani, Yosuke Kanaoka
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Publication number: 20250210426Abstract: Various techniques for alleviating crack formation and propagation in glass cores of microelectronic assemblies, and related devices and methods, are disclosed. The techniques are based on including fillers into glass cores and/or in layers provided on top and/or bottom of glass cores. The fillers have at least one characteristic indicative of material's resistance to breaking under stress being higher than that of glass, which may provide reinforcement and/or increase stiffness of glass, thereby strengthening glass cores. Examples of such characteristics include material strength, fracture toughness, or elastic modulus.Type: ApplicationFiled: December 20, 2023Publication date: June 26, 2025Applicant: Intel CorporationInventors: Bohan Shan, Mahdi Mohammadighaleni, Hiroki Tanaka, Kyle Jordan Arrington, Yiqun Bai, Whitney Bryks, Ryan Carrazzone, Haobo Chen, Gang Duan, Jeremy Ecton, Hongxia Feng, Xiaoying Guo, Shayan Kaviani, Ziyin Lin, Brandon C. Marin, Robert Alan May, Bin Mu, Bai Nie, Ala Omer, Srinivas Venkata Ramanuja Pietambaram, Dilan Seneviratne, Jose Waimin, Dingying Xu, Ehsan Zamani
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Publication number: 20250192070Abstract: Various techniques for alleviating crack formation and propagation in glass, and related devices and methods, are disclosed. The techniques are based on providing various edge features during or after singulation of a glass panel into individual glass units. In one aspect, a microelectronic assembly includes a glass core (e.g., a layer of glass including a rectangular prism volume) having a first face, a second face opposite the first face, and an edge between an end of the first face and an end of the second face, and further includes a protection coating on the edge. In another aspect, a microelectronic assembly includes a glass core as in the first aspect and further includes a frame around the edge. In yet another aspect, a microelectronic assembly includes a glass core with edges that have undergone thermal and/or chemical treatment.Type: ApplicationFiled: December 12, 2023Publication date: June 12, 2025Applicant: Intel CorporationInventors: Jesse C. Jones, Bohan Shan, Yuqin Li, Bin Mu, Brandon C. Marin, Dingying Xu, Gang Duan, Haobo Chen, Hiroki Tanaka, Hongxia Feng, Ibrahim El Khatib, Jeremy Ecton, Jose Waimin, Pramod Malatkar, Praveen Sreeramagiri, Ryan Carrazzone, Sivareddy Dondeti, Srinivas Venkata Ramanuja Pietambaram, Xiao Liu, Xiaoying Guo, Xiyu Hu, Yi Li, Hanyu Song, Yonggang Li
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Publication number: 20250186530Abstract: The present disclosure provides use of an effective part extract of Monochasma savatieri in preparation of a drug for treating an inflammatory disease or a tumor. In the present disclosure, an effective part of Monochasma savatieri is separated and purified by various separation and purification methods (including solvent extraction, macroporous resin column chromatography, MCI column separation, and Sephadex LH-20 gel column separation) separately, to obtain the effective part extract of Monochasma savatieri. The effective part extract of Monochasma savatieri is capable of significantly inhibiting secretion of TNF-?, and significantly inhibiting proliferation of breast cancer cells and lung cancer cells, thereby effectively treating the inflammatory disease or the tumor. The present disclosure provides a favorable theoretical basis for finding a drug that can effectively treat the inflammatory disease or the tumor from the Monochasma savatieri, which is of great significance to development of novel drugs.Type: ApplicationFiled: February 20, 2025Publication date: June 12, 2025Applicants: HARBIN KANGLONG PHARMACEUTICAL CO., LTD, YICHUN BINGCHEN AGRICULTURAL TECHNOLOGY DEVELOPMENT CO., LTDInventors: Bin Mu, Jiangong Shi, Tiantai Zhang, Qinglan Guo, Weiquan Li
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Publication number: 20250192059Abstract: Embodiments disclosed herein include bridge structures for package substrates. In an embodiment, a package substrate comprises a substrate that is a dielectric material. In an embodiment, a cavity is formed into the substrate. A first pad is on a bottom surface of the cavity, and a die is at least partially in the cavity. In an embodiment, a via passes through at least a portion of a thickness of the die, and a second pad is on the die. In an embodiment, the second pad directly contacts the first pad, and the first pad is the only electrically conductive structure between the via and the second pad.Type: ApplicationFiled: December 6, 2023Publication date: June 12, 2025Inventors: Brandon C. MARIN, Minglu LIU, Bohan SHAN, Bainye Francoise ANGOUA, Srinivas Venkata Ramanuja PIETAMBARAM, Gang DUAN, Numair AHMED, Jeremy D. ECTON, Benjamin DUONG, Hongxia FENG, Bai NIE, Haobo CHEN, Ziyin LIN, Yiqun BAI, Kyle ARRINGTON, Jose WAIMIN, Ryan CARRAZZONE, Dingying David XU, Bin MU, Mohit GUPTA, Xiaoying GUO, Andrey GUNAWAN, Yingying ZHANG, Yosuke KANAOKA, Yosef KORNBLUTH, Aaditya Anand CANDADAI, Daniel ROSALES-YEOMANS, Jieying KONG, Shuqi LAI, Ao WANG, Joshua STACEY, Dilan SENEVIRATNE, Jade Sharee LEWIS
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Publication number: 20250192069Abstract: Various techniques for alleviating crack formation and propagation in glass, and related devices and methods, are disclosed. The techniques are based on providing various edge features before singulation of a glass panel into individual glass units. In one aspect, an edge feature may be an opening in an edge region of a glass core, the opening extending from one of the faces of the glass core towards the opposite face of the glass core and comprising a fill material such as an insulator material, a polymer, or a conductive material. In another aspect, an edge feature may be an anchor comprising a first pad over one of the faces of a glass core, a second pad over the opposite face of the glass core, and a pin, wherein the pin is attached to the first pad and extends from the first pad into the glass core.Type: ApplicationFiled: December 12, 2023Publication date: June 12, 2025Inventors: Bohan Shan, Jesse C. Jones, Bai Nie, Whitney Bryks, Benjamin T. Duong, Pratyush Mishra, Jeremy Ecton, Yuqin Li, Pramod Malatkar, Yuvraj Singh, Yosef Kornbluth, Travis Palmer, Joshua Stacey, Mahdi Mohammadighaleni, Brandon C. Marin, Gang Duan, Suddhasattwa Nad, Srinivas Venkata Ramanuja Pietambaram, Pratyasha Mohapatra, Soham Agarwal, Kari Hernandez, Praveen Sreeramagiri, Yi Li, Ibrahim El Khatib, Hongxia Feng, Haobo Chen, Hiroki Tanaka, Aaron Michael Garelick, Sairam Agraharam, Rahul N. Manepalli, Bin Mu, Jose Waimin, Ryan Carrazzone, Dingying Xu, Xiaoying Guo, Xiao Liu, Xiyu Hu, Yi Cao
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Publication number: 20250183182Abstract: Various techniques for alleviating (e.g., mitigating or reducing) stresses between glass core materials and electrically conductive materials deposited in through-glass vias (TGVs) and related devices and methods are disclosed. In one aspect, a microelectronic assembly includes a glass core having a first face and a second face opposite the first face, and a TGV extending through the glass core between the first face and the second face, wherein the TGV includes a conductive material and a buffer layer between the conductive material and the glass core, wherein a CTE of the buffer layer is smaller than a CTE of the conductive material.Type: ApplicationFiled: November 30, 2023Publication date: June 5, 2025Inventors: Bohan Shan, Mahdi Mohammadighaleni, Joshua Stacey, Ehsan Zamani, Aaditya Candadai, Jacob Vehonsky, Daniel Wandera, Mitchell Page, Srinivas Venkata Ramanuja Pietambaram, Gang Duan, Jeremy Ecton, Brandon C. Marin, Onur Ozkan, Vinith Bejugam, Dhruba Pattadar, Amm Hasib, Nicholas Haehn, Makoyi Watson, Sanjay Tharmarajah, Jason M. Gamba, Yuqin Li, Astitva Tripathi, Mohammad Mamunur Rahman, Haifa Hariri, Shayan Kaviani, Logan Myers, Darko Grujicic, Elham Tavakoli, Whitney Bryks, Dilan Seneviratne, Bainye Angoua, Peumie Abeyratne Kuragama, Hongxia Feng, Kyle Jordan Arrington, Bai Nie, Jose Waimin, Ryan Carrazzone, Haobo Chen, Dingying Xu, Ziyin Lin, Yiqun Bai, Xiaoying Guo, Bin Mu, Thomas S. Heaton, Rahul N. Manepalli
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Publication number: 20250183180Abstract: Embodiments disclosed herein include package substrates with bridge dies. In an embodiment, an apparatus comprises a first layer that is a glass layer. A via is provided through the first layer, where the via is electrically conductive. In an embodiment, a second layer is over the first layer, and the second layer comprises an organic dielectric material. In an embodiment, a cavity is provided in the second layer, where the via is within a footprint of the cavity. In an embodiment, a die is in the cavity. In an embodiment, the die is electrically coupled to the via.Type: ApplicationFiled: December 5, 2023Publication date: June 5, 2025Inventors: Brandon C. MARIN, Robert Alan MAY, Minglu LIU, Bohan SHAN, Jason M. GAMBA, Lilia MAY, Tarek A. IBRAHIM, Hiroki TANAKA, Srinivas Venkata Ramanuja PIETAMBARAM, Jeremy D. ECTON, Gang DUAN, Suddhasattwa NAD, Benjamin DUONG, Haobo CHEN, Xiao LIU, Xiyu HU, Wei WEI, Bai NIE, Ziyin LIN, Kyle ARRINGTON, Jose WAIMIN, Ryan CARRAZZONE, Hongxia FENG, Dingying David XU, Bin MU, Mohit GUPTA, Xiaoying GUO, Yiqun BAI
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Publication number: 20250112085Abstract: An apparatus is provided which comprises: a plurality of interconnect layers within a substrate, organic dielectric material over the plurality of interconnect layers, copper pads on a surface of a cavity within the organic dielectric material, an integrated circuit bridge device coupled with the copper pads, wherein a surface of the integrated circuit bridge device is elevated above an opening of the cavity, underfill material between the integrated circuit bridge device and the surface of the cavity, and build-up layers formed over the organic dielectric material around the integrated circuit bridge device. Other embodiments are also disclosed and claimed.Type: ApplicationFiled: September 29, 2023Publication date: April 3, 2025Applicant: Intel CorporationInventors: Bohan Shan, Ziyin Lin, Haobo Chen, Yiqun Bai, Kyle Arrington, Jose Waimin, Ryan Carrazzone, Hongxia Feng, Dingying Xu, Srinivas Pietambaram, Minglu Liu, Seyyed Yahya Mousavi, Xinyu Li, Gang Duan, Wei Li, Bin Mu, Mohit Gupta, Jeremy Ecton, Brandon C. Marin, Xiaoying Guo, Ashay Dani
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Publication number: 20250112164Abstract: A device comprises a substrate comprising a plurality of build-up layers and a cavity. A bridge die is located within the cavity and a plurality of cavity side bumps are on one side of the bridge die. A plurality of interconnect pads with variable heights are on one of the build-up layers of the substrate coupled to the plurality of the cavity side bumps to bond the bridge die to the substrate.Type: ApplicationFiled: September 29, 2023Publication date: April 3, 2025Inventors: Bohan SHAN, Onur OZKAN, Ryan CARRAZZONE, Rui ZHANG, Haobo CHEN, Ziyin LIN, Yiqun BAI, Kyle ARRINGTON, Jose WAIMIN, Hongxia FENG, Srinivas Venkata Ramanuja PIETAMBARAM, Gang DUAN, Dingying David XU, Bin MU, Mohit GUPTA, Jeremy D. ECTON, Brandon C. MARIN, Xiaoying GUO, Steve S. CHO, Ali LEHAF, Venkata Rajesh SARANAM, Shripad GOKHALE, Kartik SRINIVASAN, Edvin CETEGEN, Mine KAYA, Nicholas S. HAEHN, Deniz TURAN
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Publication number: 20250112136Abstract: Embodiments disclosed herein include apparatuses with glass core package substrates. In an embodiment, an apparatus comprises a substrate with a first surface and a second surface opposite from the first surface. A sidewall is between the first surface and the second surface, and the substrate comprises a glass layer. In an embodiment, a via is provided through the substrate between the first surface and the second surface, and the via is electrically conductive. In an embodiment, a layer in contact with the sidewall of the substrate surrounds a perimeter of the substrate.Type: ApplicationFiled: September 29, 2023Publication date: April 3, 2025Inventors: Bohan SHAN, Jesse JONES, Zhixin XIE, Bai NIE, Shaojiang CHEN, Joshua STACEY, Mitchell PAGE, Brandon C. MARIN, Jeremy D. ECTON, Nicholas S. HAEHN, Astitva TRIPATHI, Yuqin LI, Edvin CETEGEN, Jason M. GAMBA, Jacob VEHONSKY, Jianyong MO, Makoyi WATSON, Shripad GOKHALE, Mine KAYA, Kartik SRINIVASAN, Haobo CHEN, Ziyin LIN, Kyle ARRINGTON, Jose WAIMIN, Ryan CARRAZZONE, Hongxia FENG, Srinivas Venkata Ramanuja PIETAMBARAM, Gang DUAN, Dingying David XU, Hiroki TANAKA, Ashay DANI, Praveen SREERAMAGIRI, Yi LI, Ibrahim EL KHATIB, Aaron GARELICK, Robin MCREE, Hassan AJAMI, Yekan WANG, Andrew JIMENEZ, Jung Kyu HAN, Hanyu SONG, Yonggang Yong LI, Mahdi MOHAMMADIGHALENI, Whitney BRYKS, Shuqi LAI, Jieying KONG, Thomas HEATON, Dilan SENEVIRATNE, Yiqun BAI, Bin MU, Mohit GUPTA, Xiaoying GUO
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Publication number: 20250106983Abstract: Embodiments disclosed herein include glass core package substrates with a stiffener. In an embodiment, an apparatus comprises a substrate with a first layer with a first width, where the first layer is a glass layer, a second layer under the first layer, where the second layer has a second width that is smaller than the first width, and a third layer over the first layer, where the third layer has a third width that is smaller than the first width. In an embodiment, the apparatus further comprises a metallic structure with a first portion and a second portion, where the first portion is over a top surface of the substrate and the second portion extends away from the first portion and covers at least a sidewall of the first layer.Type: ApplicationFiled: September 27, 2023Publication date: March 27, 2025Inventors: Bohan SHAN, Kyle ARRINGTON, Dingying David XU, Ziyin LIN, Timothy GOSSELIN, Elah BOZORG-GRAYELI, Aravindha ANTONISWAMY, Wei LI, Haobo CHEN, Yiqun BAI, Jose WAIMIN, Ryan CARRAZZONE, Hongxia FENG, Srinivas Venkata Ramanuja PIETAMBARAM, Gang DUAN, Bin MU, Mohit GUPTA, Jeremy D. ECTON, Brandon C. MARIN, Xiaoying GUO, Ashay DANI
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Patent number: 12251413Abstract: The present disclosure provides use of an effective part extract of Monochasma savatieri in preparation of a drug for treating an inflammatory disease or a tumor. In the present disclosure, an effective part of Monochasma savatieri is separated and purified by various separation and purification methods (including solvent extraction, macroporous resin column chromatography, MCI column separation, and Sephadex LH-20 gel column separation) separately, to obtain the effective part extract of Monochasma savatieri. The effective part extract of Monochasma savatieri is capable of significantly inhibiting secretion of TNF-?, and significantly inhibiting proliferation of breast cancer cells and lung cancer cells, thereby effectively treating the inflammatory disease or the tumor. The present disclosure provides a favorable theoretical basis for finding a drug that can effectively treat the inflammatory disease or the tumor from the Monochasma savatieri, which is of great significance to development of novel drugs.Type: GrantFiled: September 5, 2022Date of Patent: March 18, 2025Assignees: HARBIN KANGLONG PHARMACEUTICAL CO., LTD, YICHUN BINGCHEN AGRICULTURAL TECHNOLOGY DEVELOPMENT CO., LTD.Inventors: Bin Mu, Jiangong Shi, Tiantai Zhang, Qinglan Guo, Weiquan Li
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Publication number: 20250032589Abstract: Disclosed is an acylated insulin, a pharmaceutical formulation thereof, a pharmaceutical composition thereof with a long-acting GLP-1 compound, and a medical use of the acylated insulin, the pharmaceutical formulation and the pharmaceutical composition. Compared with insulin degludec or other insulin derivatives, the acylated insulin has an unexpected, significantly increased drug effect, a longer duration of action, a longer in vivo half-life, an excellent bioavailability, as well as better physical and chemical stabilities.Type: ApplicationFiled: September 18, 2024Publication date: January 30, 2025Inventors: Zhongru Gan, Wei Chen, Yining Zhang, Fangkai Xue, Lingyu Cai, Jianghong Niu, Bin Mu
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Publication number: 20250011385Abstract: GLP-1 derivatives are described. Also described are pharmaceutical compositions and uses of the GLP-1 derivatives.Type: ApplicationFiled: September 12, 2024Publication date: January 9, 2025Inventors: Zhongru Gan, Wei Chen, Yining Zhang, Fangkai Xue, Lingyu Cai, Jianghong Niu, Bin Mu
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Publication number: 20240239862Abstract: Provided is an insulin derivative, a pharmaceutical formulation thereof, a pharmaceutical composition of same with a long-acting GLP-1 compound, and a medical use of the acylated insulin, said pharmaceutical formulation, and said pharmaceutical composition. In comparison with insulin degludec or other insulin derivatives, the insulin derivative has unexpectedly significantly increased efficacy, longer duration of action, longer half-life in vivo, good bioavailability, and better physical and chemical stability.Type: ApplicationFiled: December 29, 2020Publication date: July 18, 2024Inventors: Zhongru Gan, Wei Chen, Yining Zhang, Fangkai Xue, Lingyu Cai, Jianghong Niu, Bin Mu