Patents by Inventor Bin Tan

Bin Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070144709
    Abstract: A heat dissipation device includes a fin set, first and second base plates and first and second heat pipes. The first base plate has a face for contacting to a heat generating electronic device. The first heat pipe includes first and second sections sandwiching the fin set therebetween and thermally engaging with the fin set. The first and second base plates sandwich the first heat pipe and the fin set therebetween and thermally engaging with the first heat pipe and the fin set. The second heat pipe includes first and second sections sandwiching the first heat pipe, the fin set, the first and second base plates therebetween and thermally engaging with the first and second base plates.
    Type: Application
    Filed: December 25, 2005
    Publication date: June 28, 2007
    Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Bin Tan, Zhi-Yong Zhou, Jiang-Jian Wen
  • Publication number: 20070095509
    Abstract: A heat dissipation device includes a heat sink (10) and a heat pipe (20). The heat sink includes a base (12), a fins group (16) extending from the base, and a cover (14) contacting with the fins group. The heat pipe surrounds top and bottom and two opposite sides of the fins group and thermally connects with the base and the cover.
    Type: Application
    Filed: November 2, 2005
    Publication date: May 3, 2007
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Bin Tan, Zhi-Yong Zhou, Jiang-Jian Wen
  • Publication number: 20060289150
    Abstract: A heat dissipation device includes a heat sink (10) and at least a serpent heat pipe (22). The heat sink (10) comprises a base (12) contacting with an electrical component, a heat dissipation fins group (14) secured to the base (12) and a cover (16) attached to a top of the heat dissipation fins group (14). The heat dissipating fins group (14) defines a notch (148) at one side thereof. Two end portions of the heat pipe (22) are respectively connected to the base (12) and the cover (16), and a middle portion of the heat pipe (22) is accommodated in the notch (148).
    Type: Application
    Filed: June 24, 2005
    Publication date: December 28, 2006
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Bin Tan
  • Patent number: 7110259
    Abstract: A heat dissipating device incorporating heat pipes includes a heat sink (10), a first heat pipe (50) and a second heat pipe (70). The heat sink has a first base (11), a second base (21) and a plurality of fins sandwiched between the first and second bases. Each of the heat pipes has a heat-absorption end (51, 71) and a heat-dissipation end (52, 72). The heat-absorption ends of the first and second heat pipes contact the first base of the heat sink. The heat-dissipation end of the first heat pipe is inserted in the substantial middle portion of the fins, and the heat-dissipation end of the second heat pipe is inserted between the second base and the fins.
    Type: Grant
    Filed: September 21, 2004
    Date of Patent: September 19, 2006
    Assignee: Hon Hai Precision Ind. Co., LTD
    Inventors: Hsieh Kun Lee, Cheng-Tien Lai, Zhi-Bin Tan
  • Publication number: 20050141198
    Abstract: A heat dissipating device incorporating heat pipes includes a heat sink (10), a first heat pipe (50) and a second heat pipe (70). The heat sink has a first base (11), a second base (21) and a plurality of fins sandwiched between the first and second bases. Each of the heat pipes has a heat-absorption end (51, 71) and a heat-dissipation end (52, 72). The heat-absorption ends of the first and second heat pipes contact the first base of the heat sink. The heat-dissipation end of the first heat pipe is inserted in the substantial middle portion of the fins, and the heat-dissipation end of the second heat pipe is inserted between the second base and the fins.
    Type: Application
    Filed: September 21, 2004
    Publication date: June 30, 2005
    Inventors: Hsieh Lee, Cheng-Tien Lai, Zhi-Bin Tan
  • Patent number: 5773370
    Abstract: An entangled multifilament yarn made from high strength filaments having a tenacity of at least about 7 g/d, a tensile modulus of at least about 150 g/d and an energy-to-break of at least about 8 J/g. The yarn is used to make ballistic resistant articles.
    Type: Grant
    Filed: February 15, 1996
    Date of Patent: June 30, 1998
    Assignee: AlliedSignal Inc.
    Inventors: James Jay Dunbar, Chok Bin Tan, Gene Clyde Weedon, Thomas Yiu-Tai Tam, Alfred Lewis Cutrone, Elizabeth Stroud Bledsoe