Patents by Inventor Bin Wei

Bin Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070199678
    Abstract: This invention discloses a manufacturing method and the structure for a surface coating film on a heat dissipation metal. The surface coating film structure on the heat dissipation metal includes a heat dissipation metal and a thin film. The surface coating film structure on the heat dissipation metal is often used in dissipation the waste heat from the electronic apparatuses. The thin film is composed of a bracket structure of carbon element which has high thermal conductivity, so as to improve the efficiency of heat dissipation of the heat dissipation metal. The corresponding manufacturing method for the thin film can be made with chemical vapor deposition, physical vapor deposition or the other material preparation methods.
    Type: Application
    Filed: February 24, 2006
    Publication date: August 30, 2007
    Inventors: Ming-Hang Hwang, Yu-Chiang Cheng, Chao-Yi Chen, Hsin-Lung Kuo, Bin-Wei Lee, Wei-Chung Hsiao
  • Publication number: 20070199682
    Abstract: This invention discloses a manufacturing method and the structure for a dissipation heat pipe. The dissipation heat pipe includes a hollow closed pipe, a column, a type of fluid and a wick structure. The dissipation heat pipe is often used in conducting the heat from the chip. The dissipation heat pipe can be made of a special thermal conduction material, including the metal and a bracket structure of carbon element which have high thermal conductivity so as to improve the heat conduction efficiency. The corresponding manufacturing method for this thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can coat on the metal surface and also can be mixed into the metal.
    Type: Application
    Filed: February 24, 2006
    Publication date: August 30, 2007
    Inventors: Ming-Hang Hwang, Yu-Chiang Cheng, Chao-Yi Chen, Hsin-Lung Kuo, Bin-Wei Lee, Wei-Chung Hsiao
  • Publication number: 20070190148
    Abstract: Compositions including a liquid or liquid-like carrier and first and second particles dispersed therein. The first and second particles differ from each other in at least one surface chemistry property, such as hydrophobicity. The gel compositions can be used in a variety of applications, including the separation of blood samples into component fractions. Processes for producing gel compositions having desirable properties are also provided.
    Type: Application
    Filed: February 14, 2006
    Publication date: August 16, 2007
    Inventors: Peter Cronin, Daniel Halbert, Richard Spontak, Bin Wei
  • Publication number: 20070175751
    Abstract: In an electrochemical machining tool assembly having at least one electrode arranged across a gap from a workpiece, the electrode being energized by application of a potential difference ?V between the electrode and the workpiece, a method of monitoring machining includes exciting at least one ultrasonic sensor to direct an ultrasonic wave toward a surface of the electrode and receiving a reflected ultrasonic wave from the surface of the electrode using the ultrasonic sensor. The reflected ultrasonic wave includes a number of reflected waves from the surface of the electrode and from a surface of the workpiece. The method further includes delaying the excitation of the ultrasonic sensor a dwell time Td after a reduction of the potential difference ?V across the electrode and the workpiece occurs.
    Type: Application
    Filed: April 10, 2007
    Publication date: August 2, 2007
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Thomas Batzinger, Wei Li, Michael Lamphere, Thomas Rogenski, Bin Wei, Carl Lester, Robert Filkins
  • Patent number: 7200336
    Abstract: An optical transceiver module includes an optical-to-electrical converter configured to convert a first optical signal to a first electric signal, a first amplifier configured to amplify the first electric signal, a bandwidth controller coupled to the first amplifier, configured to control the frequency response characteristics of the amplification of the first amplifier to produce a first amplified electric signal, a driver circuit configured to receive a second electric signal and to produce a second amplified electric signal in response to the second electric signal and an optical feedback signal, an electrical-to-optical converter coupled to the micro-controller and configured to convert the second amplified electrical signal to a second optical signal, and a photo diode configured to detect the second optical signal and to produce the optical feedback signal to be received by the driver circuit.
    Type: Grant
    Filed: October 25, 2005
    Date of Patent: April 3, 2007
    Assignee: Fiberxon, Inc.
    Inventors: Rangchen Yu, Yuanjun Huang, Mingshou He, Bin Wei, Jiang Tian
  • Publication number: 20060256528
    Abstract: This invention discloses a manufacturing method and a device for an air blown chip heat dissipation. This heat dissipation device includes an air stream produce device, a plurality of heat sink fins, a heat dissipation slip and a heat pipe. The heat dissipation slip is often used in conducting the heat from a chip. The heat dissipation slip can be made of a special thermal conduction material, including the metal and a bracket structure of carbon element which have high thermal conductivity so as to improve the heat conduction efficiency. The corresponding manufacturing method for this thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can coat on the metal surface and also can be mixed into the metal.
    Type: Application
    Filed: February 23, 2006
    Publication date: November 16, 2006
    Inventors: Ming-Hang Hwang, Yu-Chiang Chen, Chao-Yi Chen, Ping-Feng Lee, Hsin-Lung Kuo, Bin-Wei Lee, Wei-Chung Hsiao
  • Publication number: 20060257664
    Abstract: This invention discloses a manufacturing method and a structure for printed circuit boards. The printed circuit boards are often used for supporting electronic components in circuit and conducting the heat from electronic components. The printed circuit board structure includes a laminated structure. The laminated structure comprises an electric conduction layer and an insulation layer. The electric conduction layer can be made of a special thermal conduction material, including a metal and a bracket structure of carbon element. The insulation layer can be made of thermal conduction material as well, combining a bracket structure of carbon element. The bracket structure of carbon element has high thermal conductivity so as to improve the heat conduction efficiency. The corresponding manufacturing method for this thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method.
    Type: Application
    Filed: February 24, 2006
    Publication date: November 16, 2006
    Inventors: Ming-Hang Hwang, Yu-Chiang Cheng, Chao-Yi Chen, Hsin-Lung Kuo, Bin-Wei Lee, Wei-Chung Hsiao
  • Publication number: 20060255451
    Abstract: This invention discloses a manufacturing process method and a structure for a heat conduction interface material. This heat conduction interface material is often used as a buffer interface between chips and heat dissipation devices and is conducted the waste heat from the chips. The heat conduction interface material can be combined a plastic material and a bracket structure of carbon element. The corresponding manufacturing process method for this heat conduction interface material comprises a mixed process that is composed of a plastic material and a bracket structure of carbon element. The bracket structure of carbon element has high thermal conductivity, so as to improve the efficiency of heat conduction. The bracket structure of carbon element can be mixed into the metal and resins.
    Type: Application
    Filed: February 24, 2006
    Publication date: November 16, 2006
    Inventors: Ming-Hang Hwang, Yu-Chiang Cheng, Chao-Yi Chen, Hsin-Lung Kuo, Bin-Wei Lee, Wei-Chung Hsiao
  • Publication number: 20060205118
    Abstract: This invention discloses a manufacturing method and a structure for a chip heat dissipation. This heat dissipation structure includes a bottom plate of circuit structure, a die of central processing unit and a cap. The cover is often used in conducting the waste heat generated from the chip. The cover can be made of a special thermal conduction material, including a metal and a bracket structure of carbon element which have high thermal conductivity so as to improve the efficiency of heat conduction. The corresponding manufacturing method for this heat conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can be coated on the metal surface and also can be mixed into the metal.
    Type: Application
    Filed: February 17, 2006
    Publication date: September 14, 2006
    Inventors: Ming-Hang Hwang, Yu-Chiang Cheng, Chao-Yi Chen, Ping-Feng Lee, Hsin-Lung Kuo, Bin-Wei Lee, Wei-Chung Hsiao
  • Publication number: 20060117040
    Abstract: Described is a system and method for automatic monitoring and dissemination of media content. The system and method include a content acquisition platform receiving media content from at least one source and storing the media content in a media storage platform, a media processing platform segmenting the media content based upon predetermined criteria defined by a user and storing metadata corresponding to the segmented media content in the media storage platform, an alert platform providing the user with an alert identifying the segmented media content, the alert including at least a portion of the metadata stored in the media storage platform and a content delivery platform sending the segmented media content to a device of the user.
    Type: Application
    Filed: October 24, 2005
    Publication date: June 1, 2006
    Inventors: Lee Begeja, Yih-Farn Chen, David Gibbon, Huale Huang, Rittwik Jana, Zhu Liu, Bernard Renger, Behzad Shahraray, Bin Wei
  • Publication number: 20060108328
    Abstract: A method for monitoring machining in an electroerosion assembly having a power supply and an electrode arranged across a gap from a workpiece, includes measuring a voltage at a point in a voltage waveform after a time delay td of one half of a pulse width of the voltage waveform. The measurements are repeated for multiple pulses of the voltage waveform to obtain multiple voltages, each of the voltages corresponding to a point in respective pulses. The voltages are averaged to obtain an average voltage, which is compared with at least one threshold voltage, to determine whether the machining is in control. A control signal is generated if the comparison indicates that the process is not in control, the control signal being configured to regulate an operating parameter of the power supply, and the control signal is supplied to the power supply, if generated.
    Type: Application
    Filed: November 23, 2004
    Publication date: May 25, 2006
    Inventors: Yuanfeng Luo, Renwei Yuan, Kelvin Wang, Bin Wei, Michael Lamphere
  • Publication number: 20060034612
    Abstract: An optical transceiver module includes an optical-to-electrical converter configured to convert a first optical signal to a first electric signal, a first amplifier configured to amplify the first electric signal, a bandwidth controller coupled to the first amplifier, configured to control the frequency response characteristics of the amplification of the first amplifier to produce a first amplified electric signal, a driver circuit configured to receive a second electric signal and to produce a second amplified electric signal in response to the second electric signal and an optical feedback signal, an electrical-to-optical converter coupled to the micro-controller and configured to convert the second amplified electrical signal to a second optical signal, and a photo diode configured to detect the second optical signal and to produce the optical feedback signal to be received by the driver circuit.
    Type: Application
    Filed: October 25, 2005
    Publication date: February 16, 2006
    Inventors: Rangchen Yu, Yuanjun Huang, Mingshou He, Bin Wei, Jiang Tian
  • Publication number: 20050273999
    Abstract: A method for fabricating a component includes providing a workpiece, an electroerosion apparatus comprising an electrode tool. The electroerosion apparatus is operated on the workpiece, for removing a portion thereof. A method for fabricating a composite magnet includes a workpiece comprising a composite material including a magnetizable material and an epoxy resin. An electroerosion apparatus, comprising an electrode tool having an abrasive material, removes a portion of the workpiece by an abrasive action of the electrode tool on the workpiece.
    Type: Application
    Filed: June 9, 2004
    Publication date: December 15, 2005
    Inventors: Juliana Shei, Judson Marte, Bin Wei
  • Patent number: 6969457
    Abstract: An electrochemical process for selectively stripping at least one coating from the surface of a substrate is disclosed. The substrate (often a turbine engine component) is immersed in a composition through which electrical current flows. The composition includes a halide salt, such as sodium chloride, ammonium chloride, and potassium chloride. In preferred embodiments, the electrical current is direct current (DC). The process is especially useful for selectively removing portions of diffusion aluminide coatings. For example, the additive layer can efficiently be removed, without substantially affecting the underlying diffusion layer or substrate. Related stripping compositions and apparatuses are also described.
    Type: Grant
    Filed: October 21, 2002
    Date of Patent: November 29, 2005
    Assignee: General Electric Company
    Inventors: Leo Spitz MacDonald, Bin Wei, Michel Joseph Shaw, John Robert LaGraff, Warren Davis Grossklaus, Stephen Joseph Ferrigno, Tris Colaizzi
  • Patent number: 6968290
    Abstract: An electrochemical machining tool assembly includes first and second tools that are spaced apart from one another so that a workpiece can be located therebetween. The assembly also includes a first ultrasonic transducer mounted in the first tool and a second ultrasonic transducer mounted in the second tool. The electrochemical machining process is monitored by generating ultrasonic waves with the first and second ultrasonic transducers, and then detecting the arrival times, at the first and second ultrasonic transducers, of certain reflections of the ultrasonic waves. The detected arrival times are then used to calculate parameters such as the gap sizes between the first and second tools and a workpiece situated therebetween and the thickness of the workpiece.
    Type: Grant
    Filed: March 27, 2001
    Date of Patent: November 22, 2005
    Assignee: General Electric Company
    Inventors: Bin Wei, Wei Li, Michael Scott Lamphere
  • Publication number: 20050247569
    Abstract: An electroerosion apparatus includes a tubular electrode supported in a tool head in a multiaxis machine. The machine is configured for spinning the electrode along multiple axes of movement relative to a workpiece supported on a spindle having an additional axis of movement. A power supply powers the electrode as a cathode and the workpiece as an anode. Electrolyte is circulated through the tubular electrode during operation. And, a controller is configured to operate the machine and power supply for distributing multiple electrical arcs between the electrode and workpiece for electroerosion thereof as the spinning electrode travels along its feedpath.
    Type: Application
    Filed: May 7, 2004
    Publication date: November 10, 2005
    Inventors: Michael Lamphere, Bin Wei, Renwei Yuan, Jeffrey Wessels
  • Publication number: 20050218089
    Abstract: A flushing and filtering system for an electroerosion machine includes a work tank configured to maintain a workpiece therein, a first filtering stage for roughly filtering residue-containing machining liquid exiting from the work tank, and a second filtering stage for finely filtering roughly-filtered machining liquid exiting from the first filtering stage.
    Type: Application
    Filed: March 30, 2004
    Publication date: October 6, 2005
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Bin Wei, Michael Lamphere, Renwei Yuan, Andy Ji
  • Patent number: 6912446
    Abstract: A method for repairing an airfoil comprising creating a nominal numerically-controlled tool path based on a nominal shape of the airfoil, measuring the airfoil using a displacement sensor, capturing differences in the airfoil shape as compared to the nominal shape, creating a three-dimensional map by synchronizing x, y and z coordinates and readings from the sensor, modifying the tool path based on the three-dimensional map, and machining the airfoil. A system for measuring and machining an airfoil comprising a computer operable for data acquisition and numerically-controlled tool path generation, a numerically-controlled machine, a cutting tool holder comprising a plurality of cutting tools, and a displacement-sensing probe.
    Type: Grant
    Filed: October 23, 2002
    Date of Patent: June 28, 2005
    Assignee: General Electric Company
    Inventors: Weiping Wang, Martin Kin-Fei Lee, Bin Wei
  • Patent number: 6897400
    Abstract: A guide bushing for use in association with electrical discharge machining (EDM) apparatus including a rotatable electrode defining a longitudinal axis, is provided. The guide bushing includes a body portion defining a bore therethrough for receiving at least a portion of the electrode therein. The bore includes a proximal portion sized to be in contact with an outer surface of the electrode, an intermediate portion sized to be spaced from the electrode, and a distal portion sized to be at least partially in contact with the outer surface of the electrode.
    Type: Grant
    Filed: March 16, 2004
    Date of Patent: May 24, 2005
    Assignee: General Electric Company
    Inventors: Renwei Yuan, Michael Scott Lamphere, Bin Wei, Andy Ji
  • Publication number: 20050098445
    Abstract: In an electrochemical machining tool assembly having at least one electrode arranged across a gap from a workpiece, the electrode being energized by application of a potential difference ?V between the electrode and the workpiece, a method of monitoring machining includes exciting at least one ultrasonic sensor to direct an ultrasonic wave toward a surface of the electrode and receiving a reflected ultrasonic wave from the surface of the electrode using the ultrasonic sensor. The reflected ultrasonic wave includes a number of reflected waves from the surface of the electrode and from a surface of the workpiece. The method further includes delaying the excitation of the ultrasonic sensor a dwell time Td after a reduction of the potential difference ?V across the electrode and the workpiece occurs.
    Type: Application
    Filed: November 10, 2003
    Publication date: May 12, 2005
    Inventors: Thomas Batzinger, Wei Li, Michael Lamphere, Thomas Rogenski, Bin Wei, Carl Lester, Robert Filkins