Abstract: A method, a structure, and a computer system for a modular sensing unit. The structure comprises a sensor module, a power cable ribbon, and a component module, wherein the component module is in communication with and detachable from the sensor module via the power cable ribbon.

Abstract: Electromechanical substance delivery devices are provided which implement low-power electromechanical release mechanisms for controlled delivery of substances such as drugs and medication. For example, an electromechanical device includes a substrate having a cavity formed in a surface of the substrate, a membrane disposed on the surface of the substrate covering an opening of the cavity, and a seal disposed between the membrane and the surface of the substrate. The seal surrounds the opening of the cavity, and the seal and membrane are configured to enclose the cavity and retain a substance within the cavity. An electrode structure is configured to locally heat a portion of the membrane in response to a control voltage applied to the electrode structure, and create a stress that causes a rupture in the locally heated portion of the membrane to release the substance from within the cavity.

Abstract: A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.

Abstract: Vertical via connections to a battery are hermetically sealed to prevent environmental factors (e.g. moisture, oxygen, and nitrogen) from entering the internals of the battery through porous conductive material filling the vias resulting in reduced battery performance and battery failure.

Abstract: A digital biomedical device includes a substrate forming a reservoir, a membrane comprising a first layer and a second layer having a strain therebetween, the membrane sealing the reservoir, and a controller configured to activate the membrane and release at least a portion of the strain causing the membrane curl and open the reservoir.

Abstract: A structure containing a vertical light emitting diode (LED) is provided. The vertical LED is present in an opening located in a display substrate, and the vertical LED is coupled to a back contact structure via a magnetic back contact structure. A first top contact structure contacts a topmost surface of the vertical LED and a second top contact structure contacts a surface of the back contact structure.

Abstract: A device for detecting a tampering of a product in a product packaging material. The device comprises a network of sensors integrated into the product packaging material; a microcontroller, the microcontroller configured to detect, by accessing the sensors of the sensor network, the tampering of the product packaging material; and a communication device for relaying information regarding a status of the product packaging material.

Abstract: Die stacks and methods of making die stacks with very thin dies are disclosed. The die surfaces remain flat within a 5 micron tolerance despite the thinness of the die and the process steps of making the die stack. A residual flux height is kept below 50% of the spacing distance between adjacent surfaces or structures, e.g. in the inter-die spacing.

Abstract: Systems, devices, and techniques facilitating wirelessly charging and/or communicating with one or more electronic devices (e.g., electronic wearable devices) are provided. A device can comprise a memory and a storage component that can be operatively coupled to the memory. The storage component can comprise one or more recesses that can receive a second device that can be charged by the storage component. The storage component can comprise a charging circuit and an inductive circuit that can be coupled to the charging circuit. The storage component can harvest energy from one or more energy sources to charge the charging circuit. Based on the energy harvested, the inductive circuit can inductively couple to the second device having a second inductive circuit and positioned in at least one of the recesses and the inductive circuit can charge a power source of the second device.

Abstract: A digital biomedical device includes a substrate forming a cavity, a seal formed around the cavity, a lid coupled to the substrate by the seal, a reactive metal structure comprising a plurality of metal layers, wherein the reactive metal structure is a component of at least one of the substrate and the lid, a metal trace configured to initiate a self-propagating reaction between the plurality of metal layers of the reactive metal structure and release contents of the cavity, and a power supply configured to apply an electric current to the metal trace.

Abstract: A drug delivery form includes a drug and electronics. The electronics includes memory(ies) having drug delivery form information, including information about the drug and about at least part of a supply chain from manufacture of the drug delivery form to a current location in the supply chain. The electronics includes communication circuitry configured to read data from and write data to the drug delivery form information. An apparatus includes memory(ies) having computer readable code, and processor(s). The processor(s) cause the apparatus to perform operations including communicating with a drug delivery form including a drug and drug delivery form information, including information about the drug and about at least part of a supply chain from manufacture of the drug delivery form to a current location in the supply chain. The processor(s) cause the apparatus to perform reading data from or writing data into the drug and drug delivery form information.

Abstract: Systems and/or techniques associated with a solid-state microbattery packaging system are provided. In one example, a device comprises a substrate layer and a tape substrate layer. The substrate layer is associated with a set of solid-state microbattery components. The tape substrate comprises a releasable adhesive material and a polymer sealing material. A conductive surface associated with the set of solid-state microbattery components is disposed on the releasable adhesive material of the tape substrate layer.

Abstract: A method, system, and mobile terminal configured for medication management are provided. A read operation is performed by a magnetic reader to detect whether a pattern of bio-compatible nano-magnetic particles on a pill is present within a body of a patient. Information from the read operation is transmitted to a mobile terminal by the wireless transceiver.

Abstract: Vertical via connections to a battery are hermetically sealed to prevent environmental factors (e.g. moisture, oxygen, and nitrogen) from entering the internals of the battery through porous conductive material filling the vias resulting in reduced battery performance and battery failure.

Abstract: A method, system, and mobile terminal configured for medication management are provided. A read operation is performed by a magnetic reader to detect whether a pattern of bio-compatible nano-magnetic particles on a pill is present within a body of a patient. Information from the read operation is transmitted to a mobile terminal by the wireless transceiver.

Abstract: The present disclosure related to routing methods. One example method includes configuring a first path and a second path in charge of load sharing for a data flow, and configuring a third path in charge of reroute protection. A first group entry is generated for instructing the forwarding device to use the first path and the second path as load-sharing paths and use the third path to perform reroute protection on the first path and the second path. A flow entry for instructing to perform an operation of going to the first group entry is generated.

Abstract: Die stacks and methods of making die stacks with very thin dies are disclosed. The die surfaces remain flat within a 5 micron tolerance despite the thinness of the die and the process steps of making the die stack. A residual flux height is kept below 50% of the spacing distance between adjacent surfaces or structures, e.g. in the inter-die spacing.

Abstract: A method for integrating a thin film microbattery with electronic circuitry includes forming a release layer over a handler, forming a thin film microbattery over the release layer of the handler, removing the thin film microbattery from the handler, depositing the thin film microbattery on an interposer, forming electronic circuitry on the interposer, and sealing the thin film microbattery and the electronic circuitry to create individual microbattery modules.

Abstract: An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.

Abstract: A method for integrating a thin film microbattery with electronic circuitry includes forming a release layer over a handler, forming a thin film microbattery over the release layer of the handler, removing the thin film microbattery from the handler, depositing the thin film microbattery on an interposer, forming electronic circuitry on the interposer, and sealing the thin film microbattery and the electronic circuitry to create individual microbattery modules.