Abstract: A display device includes a display substrate, a touch module and a ring structure. The display substrate includes a first portion for display, a second portion located at a non-display side of the first portion of the display substrate, and a first bent portion for connecting the first portion and the second portion, and a first driver is provided at a side of the second portion away from the first portion. The touch module includes a touch layer and a touch flexible circuit board connected with the touch layer, the touch flexible circuit board includes a flat portion located at a side of the second portion away from the first portion and a second bent portion for connecting the touch layer and the flat portion. The ring structure is located between the flat portion of the touch flexible circuit board and the second portion of the display substrate.

Abstract: The display assembly includes a display module, a flexible printed board, an integrated circuit chip, and a composite tape. The integrated circuit chip and a binding portion of the flexible printed board are respectively in binding connection with the display module. The composite tape includes: a conductive fabric layer comprising a first part and a second part, the first part covering the integrated circuit chip and the binding portion, and the second part covering at least part of a grounding portion of the flexible printed board; and an insulating film layer on a side of the conductive fabric layer facing the integrated circuit chip and the flexible printed board, and including a third part, which is at the first part of the conductive fabric layer and covering the integrated circuit chip and the binding portion, and the insulating film layer avoiding the at least part of the grounding portion.

Abstract: A heat dissipation module includes: a heat dissipation base material layer, provided with a first accommodating slot for accommodating a fingerprint sensor and a second accommodating slot for accommodating a flexible printed circuit, the fingerprint sensor being electrically connected to the flexible printed circuit, the first accommodating slot penetrating through the heat dissipation base material layer; and a light shielding buffer layer, on a side of the heat dissipation base material layer away from an opening of the second accommodating slot and provided with a hollowed-out area, an orthographic projection of the hollowed-out area on the heat dissipation base material layer being in the first accommodating slot, the hollowed-out area being configured to expose a photosensitive area of the fingerprint sensor, and the impedance of a surface of a side of the light shielding buffer layer away from the heat dissipation base material layer being 106?-1010?.

Abstract: An impedance match is described. The impedance match includes a housing having a bottom portion and a top portion. The bottom portion has match components and the top portion has an elongated body. A low frequency input is connected through the bottom portion of the housing, and the low frequency input is interconnected to a first set of capacitors and inductors. A high frequency input is connected through the bottom portion of the housing, and the high frequency input is interconnected to a second set of capacitors and inductors. An elongated strap extends between the bottom portion and the top portion of the housing. A lower portion of the elongated strap is coupled to the second set of capacitors and inductors and an upper portion of the elongated strap is connected to an RF rod at an end of the elongated body.

Abstract: A fixed outer support flange (flange 1) is formed to circumscribe an electrode within a plasma processing system. Flange 1 has a vertical portion and a horizontal portion extending radially outward from a lower end of the vertical portion. An articulating outer support flange (flange 2) is formed to circumscribe flange 1. Flange 2 has a vertical portion and a horizontal portion extending radially outward from a lower end of the vertical portion. The vertical portion of flange 2 is positioned concentrically outside of the vertical portion of flange 1. Flange 2 is spaced apart from flange 1 and moveable along the vertical portion of flange 1. Each of a plurality of electrically conductive straps has a first end portion connected to flange 2 and a second end portion connected to flange 1.

Abstract: A tunable edge sheath (TES) system includes a coupling ring configured to couple to a bottom surface of an edge ring that surrounds a wafer support area within a plasma processing chamber. The TES system includes an annular-shaped electrode embedded within the coupling ring. The TES system includes a plurality of radiofrequency signal supply pins coupled to the electrode within the coupling ring. Each of the plurality of radiofrequency signal supply pins extends through a corresponding hole formed through a bottom surface of the coupling ring. The TES system includes a plurality of radiofrequency signal filters respectively connected to the plurality of radiofrequency supply pins. Each of the plurality of radiofrequency signal filters is configured to provide a high impedance to radiofrequency signals used to generate a plasma within the plasma processing chamber.

Abstract: A method for achieving uniformity in an etch rate is described. The method includes receiving a voltage signal from an output of a match, and determining a positive crossing and a negative crossing of the voltage signal for each cycle of the voltage signal. The negative crossing of each cycle is consecutive to the positive crossing of the cycle. The method further includes dividing a time interval of each cycle of the voltage signal into a plurality of bins. For one or more of the plurality of bins associated with the positive crossing and one or more of the plurality of bins associated with the negative crossing, the method includes adjusting a frequency of a radio frequency generator to achieve the uniformity in the etch rate.

Abstract: An optical film, a display screen assembly and a display device are disclosed. The optical film includes a light transmitting film and a light blocking film; the light transmitting film is a double-sided adhesive film, and the light blocking film is a flexible film and is connected with a periphery of the light transmitting film.

Abstract: A display module and a display device are disclosed. The display module includes a first flexible circuit board, a display substrate, and a touch sensor disposed on the display side of the display substrate. The display substrate includes a flat region and curved surface regions; the touch sensor includes first and second bonding regions; the first bonding region and the second bonding region are on a surface, away from the display substrate, of the touch sensor, stacked with the flat region and spaced apart from each other; the first flexible circuit board is electrically connected with the touch sensor through the first bonding region and the second bonding region; the first flexible circuit board includes a main body and first and second bonding connection portions; the first and second bonding connection portions are respectively bonded with the first and second bonding regions.

Abstract: A display device includes a display substrate, a touch module and a ring structure. The display substrate includes a first portion for display, a second portion located at a non-display side of the first portion of the display substrate, and a first bent portion for connecting the first portion and the second portion, and a first driver is provided at a side of the second portion away from the first portion. The touch module includes a touch layer and a touch flexible circuit board connected with the touch layer, the touch flexible circuit board includes a flat portion located at a side of the second portion away from the first portion and a second bent portion for connecting the touch layer and the flat portion. The ring structure is located between the flat portion of the touch flexible circuit board and the second portion of the display substrate.

Abstract: Disclosed are a display panel, a display device, and a terminal apparatus. The display panel comprises a display substrate having a backlight surface and a main flexible circuit board. The main flexible circuit board comprises a connection section, a fixed section and a test section. The connection section is arranged on the backlight surface, and has an outer peripheral surface comprising a first side and a second side opposite to each other. The fixed section is attached and fixed onto the backlight surface, and having one end connected to the first side and another end extending towards an end of the first side away from the second side. The test section has one end connected to the first side, and another end comprising a connection port.

Abstract: Disclosed is a display device, comprising: a display panel (10), wherein the display panel (10) comprises a display area (AA), a bending area (BB) and a bonding area (CC), with the bending area (BB) being arranged between the display area (AA) and the bonding area (CC); a support heat dissipation structure (20), with the support heat dissipation structure (20) being disposed on a non-display surface (10b) of the display area (AA); a driving chip (30), with the driving chip (30) being fixed to a bonding surface (10c) of the bonding area (CC); and an electromagnetic shielding structure (40), with the electromagnetic shielding structure (40) being fixed onto a side of the support heat dissipation structure (20) away from the display panel (10).

Abstract: The present disclosure relates to the technical field of display devices, and discloses a touch display device and a fabrication method thereof, and terminal equipment. The touch display device includes: a cover plate; a mold frame, including a bottom and an extended part, wherein the bottom and the extended part define a groove; adhesive, located at the end part of the extended part; a touch display module, located in the groove and including a display panel and a touch panel located at the side, facing the cover plate, of the display panel; and a touch flexible printed circuit board, bound to a side edge of the side, facing away from the display panel, of the touch panel and bent to the side, facing away from the touch panel, of the display panel, wherein the touch flexible printed circuit board is provided with a plurality of through holes at the area other than the binding position.

Abstract: Disclosed in embodiments of the present disclosure are a flexible circuit board assembly, a display assembly and a display device. The flexible circuit board assembly includes: a first flexible circuit board, including a component part, the component part being provided with components; and a first wave absorbing layer, disposed on the component part and configured to cover the components. The display assembly includes a display module and the flexible circuit board assembly; the display module includes a module body and a second binding part, and the second binding part is configured to be bent to a back surface of the module body; and the first flexible circuit board is located on the back surface of the module body and includes a first binding part, and the first binding part is bound and connected to the second binding part of the display module.

Abstract: A method for optimizing delivery of power to a plasma chamber is described. The method includes dividing each cycle of a low frequency (LF) radio frequency generator (RFG) into multiple time intervals. During each of the time intervals, a frequency offset of a high frequency (HF) RFG is generated for which the delivery of power is maximized. The frequency offsets provide a substantially inverse relationship compared to a voltage signal of the LF RFG for each cycle of the voltage signal. The frequency offsets for the time intervals are multiples of the low frequency. The substantially inverse relationship facilitates an increase in the delivery of power to the electrode. A total range of the frequency offsets from a reference HF frequency over the LF RF cycle depends on a power ratio of power that is supplied by the LF RFG and power that is supplied by the HF RFG.

Abstract: A heat dissipation module includes: a heat dissipation base material layer, provided with a first accommodating slot for accommodating a fingerprint sensor and a second accommodating slot for accommodating a flexible printed circuit, the fingerprint sensor being electrically connected to the flexible printed circuit, the first accommodating slot penetrating through the heat dissipation base material layer; and a light shielding buffer layer, on a side of the heat dissipation base material layer away from an opening of the second accommodating slot and provided with a hollowed-out area, an orthographic projection of the hollowed-out area on the heat dissipation base material layer being in the first accommodating slot, the hollowed-out area being configured to expose a photosensitive area of the fingerprint sensor, and the impedance of a surface of a side of the light shielding buffer layer away from the heat dissipation base material layer being 106?-1010?.

Abstract: The disclosure provides a display panel and a display device, including a display cell. The display cell includes: a plurality of display pins and a plurality of cell test pins, which are arranged in a bonding region of the display cell; and a chip on film bonded to a side facing away from a display surface of the display cell. An orthographic projection of the chip on film on the display cell completely covers the display pins and the cell test pins.

Abstract: The display assembly includes a display module, a flexible printed board, an integrated circuit chip, and a composite tape. The integrated circuit chip and a binding portion of the flexible printed board are respectively in binding connection with the display module. The composite tape includes: a conductive fabric layer comprising a first part and a second part, the first part covering the integrated circuit chip and the binding portion, and the second part covering at least part of a grounding portion of the flexible printed board; and an insulating film layer on a side of the conductive fabric layer facing the integrated circuit chip and the flexible printed board, and including a third part, which is at the first part of the conductive fabric layer and covering the integrated circuit chip and the binding portion, and the insulating film layer avoiding the at least part of the grounding portion.

Abstract: A method for optimizing delivery of power to a plasma chamber is described. The method includes dividing each cycle of a low frequency (LF) radio frequency generator (RFG) into multiple time intervals. During each of the time intervals, a frequency offset of a high frequency (HF) RFG is generated for which the delivery of power is maximized. The frequency offsets provide a substantially inverse relationship compared to a voltage signal of the LF RFG for each cycle of the voltage signal. The frequency offsets for the time intervals are multiples of the low frequency. The substantially inverse relationship facilitates an increase in the delivery of power to the electrode. A total range of the frequency offsets from a reference HF frequency over the LF RF cycle depends on a power ratio of power that is supplied by the LF RFG and power that is supplied by the HF RFG.

Abstract: A radio frequency (RF) generator system includes first and second RF power sources, each RF power source applying a respective RF signal and second RF signal to a load. The first RF signal is applied in accordance with the application of the second RF signal. The application of the first RF signal is synchronized to application of the second RF signal. The first RF signal may be amplitude modulated in synchronization with the second RF signal, and the amplitude modulation can include blanking of the first RF signal. A frequency offset may be applied to the first RF signal in synchronization with the second RF signal. A variable actuator associated with the first RF power source may be controlled in accordance with the second RF signal.