Patents by Inventor Bing Ji

Bing Ji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230274914
    Abstract: A system having the low frequency RF generator is described. The low frequency RF has an operating frequency range between 10 kilohertz (kHz) and 330 kHz. The low frequency RF generator generates an RF signal. The system further includes an impedance matching circuit coupled to the low frequency RF generator for receiving the RF signal. The impedance matching circuit modifies an impedance of the RF signal to output a modified RF signal. The system includes a plasma chamber coupled to the RF generator for receiving the modified RF signal. The plasma chamber includes a chuck having a dielectric layer and a base metal layer. The dielectric layer is located on top of the base metal layer. The dielectric layer has a bottom surface, and the base metal layer has a top surface. The base metal layer has a porous plug and the bottom surface of the dielectric layer has a portion that is in contact with the porous plug.
    Type: Application
    Filed: November 5, 2021
    Publication date: August 31, 2023
    Inventors: Alexei M. Marakhtanov, Felix Leib Kozakevich, Bing Ji, Ranadeep Bhowmick, John Patrick Holland, Alexander Matyushkin
  • Publication number: 20230260768
    Abstract: Methods, systems, apparatuses, and computer programs are presented for controlling plasma discharge uniformity using magnetic fields. A substrate processing apparatus includes a vacuum chamber with a processing zone for processing a substrate. The apparatus further includes a magnetic field sensor to detect a first signal representing an axial magnetic field and a second signal representing a radial magnetic field associated with the vacuum chamber. The apparatus includes at least two magnetic field sources to generate an axial supplemental magnetic field and a radial supplemental magnetic field through the processing zone of the vacuum chamber. The apparatus includes a magnetic field controller coupled to the magnetic field sensor and the at least two magnetic field sources. The magnetic field controller adjusts at least one characteristic of one or more of the axial supplemental magnetic field and the radial supplemental magnetic field based on the first signal and the second signal.
    Type: Application
    Filed: August 30, 2021
    Publication date: August 17, 2023
    Inventors: Theodoros Panagopoulos, Alexei M. Marakhtanov, Bing Ji, Anthony de la Llera, John P. Holland, Dong Woo Paeng
  • Publication number: 20230253184
    Abstract: An impedance match housing is described. The impedance match housing includes an impedance matching circuit having an input that is coupled to a radio frequency (RF) generator. The impedance matching circuit has an output that is coupled to a first RF strap. The impedance match housing includes a uniformity control circuit coupled in parallel to a portion of the first RF strap to modify uniformity in a processing rate of a substrate when the substrate is processed within a plasma chamber.
    Type: Application
    Filed: November 2, 2021
    Publication date: August 10, 2023
    Inventors: Alexei M. Marakhtanov, Felix Leib Kozakevich, Bing Ji, John P. Holland
  • Publication number: 20230254978
    Abstract: A display device is provided. The display device includes: a display substrate having a non-display side, a first driver being provided at the non-display side of the display substrate; a touch module comprising a touch layer and a touch flexible circuit board connected with the touch layer, the touch flexible circuit board comprising a flat portion located at a side of the second portion away from the first portion and a second bent portion for connecting the touch layer and the flat portion; and a supporting wall between the flat portion of the touch flexible circuit board and the second portion of the display substrate, and the supporting wall is located on at least one side of the first driver in a direction parallel to the flat portion of the touch flexible circuit board.
    Type: Application
    Filed: April 13, 2023
    Publication date: August 10, 2023
    Applicants: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Shuang ZHANG, Xiaoxia HUANG, Jiangsheng WANG, Jianjun WU, Xuerui GONG, Bing JI
  • Publication number: 20230245874
    Abstract: Systems and methods for controlling a plasma sheath characteristic are described. One of the methods includes determining a first value of the plasma sheath characteristic of a plasma sheath formed within a plasma chamber. The method further includes determining whether the first value of the plasma sheath characteristic is within a predetermined range from a preset value of the plasma sheath characteristic. The method also includes modifying a variable of a radio frequency (RF) generator coupled to the plasma chamber via an impedance matching circuit upon determining that the first value is not within the predetermined range from the preset value. The operation of modifying the variable of the RF generator is performed until it is determined that the first value of the plasma sheath characteristic is within the predetermined range from the preset value.
    Type: Application
    Filed: March 15, 2022
    Publication date: August 3, 2023
    Inventors: Alexei M. Marakhtanov, James Eugene Caron, John Patrick Holland, Felix Leib Kozakevich, Ranadeep Bhowmick, Bing Ji
  • Publication number: 20230240058
    Abstract: The display assembly includes a display module, a flexible printed board, an integrated circuit chip, and a composite tape. The integrated circuit chip and a binding portion of the flexible printed board are respectively in binding connection with the display module. The composite tape includes: a conductive fabric layer comprising a first part and a second part, the first part covering the integrated circuit chip and the binding portion, and the second part covering at least part of a grounding portion of the flexible printed board; and an insulating film layer on a side of the conductive fabric layer facing the integrated circuit chip and the flexible printed board, and including a third part, which is at the first part of the conductive fabric layer and covering the integrated circuit chip and the binding portion, and the insulating film layer avoiding the at least part of the grounding portion.
    Type: Application
    Filed: March 31, 2023
    Publication date: July 27, 2023
    Inventors: Qizhong CHEN, Bing JI
  • Publication number: 20230223242
    Abstract: In some implementations, a method for performing a plasma process in a chamber is provided, including: supplying a process gas to the chamber; applying pulsed RF power to the process gas in the chamber, the pulsed RF power being provided at a predefined frequency, wherein the applying of the pulsed RF power to the process gas generates a plasma in the chamber; during the applying of the RF power, applying a pulsed DC current to a magnetic coil that is disposed over the chamber, wherein the pulsed DC current is provided at the predefined frequency.
    Type: Application
    Filed: November 2, 2021
    Publication date: July 13, 2023
    Inventors: Alexei Marakhtanov, Bing Ji, Ken Lucchesi, John Holland
  • Publication number: 20230215694
    Abstract: A method for achieving a first uniformity level in a processing rate across a surface of a substrate is described. The method includes receiving the first uniformity level to be achieved across the surface of the substrate and identifying a first plurality of duty cycles associated with a first plurality of states based on the first uniformity level. The first plurality of states are of a variable of a first radio frequency (RF) signal. The method further includes controlling an RF generator to generate the first RF signal having the first plurality of duty cycles.
    Type: Application
    Filed: December 23, 2021
    Publication date: July 6, 2023
    Inventors: Alexei M. Marakhtanov, Felix Leib Kozakevich, Bing Ji, John P. Holland, Ranadeep Bhowmick
  • Patent number: 11665827
    Abstract: A display device includes a display substrate, a touch module and a ring structure. The display substrate includes a first portion for display, a second portion located at a non-display side of the first portion of the display substrate, and a first bent portion for connecting the first portion and the second portion, and a first driver is provided at a side of the second portion away from the first portion. The touch module includes a touch layer and a touch flexible circuit board connected with the touch layer, the touch flexible circuit board includes a flat portion located at a side of the second portion away from the first portion and a second bent portion for connecting the touch layer and the flat portion. The ring structure is located between the flat portion of the touch flexible circuit board and the second portion of the display substrate.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: May 30, 2023
    Assignees: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Shuang Zhang, Xiaoxia Huang, Jiangsheng Wang, Jianjun Wu, Xuerui Gong, Bing Ji
  • Patent number: 11647616
    Abstract: The display assembly includes a display module, a flexible printed board, an integrated circuit chip, and a composite tape. The integrated circuit chip and a binding portion of the flexible printed board are respectively in binding connection with the display module. The composite tape includes: a conductive fabric layer comprising a first part and a second part, the first part covering the integrated circuit chip and the binding portion, and the second part covering at least part of a grounding portion of the flexible printed board; and an insulating film layer on a side of the conductive fabric layer facing the integrated circuit chip and the flexible printed board, and including a third part, which is at the first part of the conductive fabric layer and covering the integrated circuit chip and the binding portion, and the insulating film layer avoiding the at least part of the grounding portion.
    Type: Grant
    Filed: June 4, 2020
    Date of Patent: May 9, 2023
    Assignees: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Qizhong Chen, Bing Ji
  • Patent number: 11617286
    Abstract: A heat dissipation module includes: a heat dissipation base material layer, provided with a first accommodating slot for accommodating a fingerprint sensor and a second accommodating slot for accommodating a flexible printed circuit, the fingerprint sensor being electrically connected to the flexible printed circuit, the first accommodating slot penetrating through the heat dissipation base material layer; and a light shielding buffer layer, on a side of the heat dissipation base material layer away from an opening of the second accommodating slot and provided with a hollowed-out area, an orthographic projection of the hollowed-out area on the heat dissipation base material layer being in the first accommodating slot, the hollowed-out area being configured to expose a photosensitive area of the fingerprint sensor, and the impedance of a surface of a side of the light shielding buffer layer away from the heat dissipation base material layer being 106?-1010?.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: March 28, 2023
    Assignees: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Qizhong Chen, Bing Ji
  • Publication number: 20230081542
    Abstract: An impedance match is described. The impedance match includes a housing having a bottom portion and a top portion. The bottom portion has match components and the top portion has an elongated body. A low frequency input is connected through the bottom portion of the housing, and the low frequency input is interconnected to a first set of capacitors and inductors. A high frequency input is connected through the bottom portion of the housing, and the high frequency input is interconnected to a second set of capacitors and inductors. An elongated strap extends between the bottom portion and the top portion of the housing. A lower portion of the elongated strap is coupled to the second set of capacitors and inductors and an upper portion of the elongated strap is connected to an RF rod at an end of the elongated body.
    Type: Application
    Filed: January 12, 2021
    Publication date: March 16, 2023
    Inventors: Felix Leib Kozakevich, Alexei Marakhtanov, Bing Ji, Ranadeep Bhowmick, John Holland
  • Publication number: 20230059495
    Abstract: A fixed outer support flange (flange 1) is formed to circumscribe an electrode within a plasma processing system. Flange 1 has a vertical portion and a horizontal portion extending radially outward from a lower end of the vertical portion. An articulating outer support flange (flange 2) is formed to circumscribe flange 1. Flange 2 has a vertical portion and a horizontal portion extending radially outward from a lower end of the vertical portion. The vertical portion of flange 2 is positioned concentrically outside of the vertical portion of flange 1. Flange 2 is spaced apart from flange 1 and moveable along the vertical portion of flange 1. Each of a plurality of electrically conductive straps has a first end portion connected to flange 2 and a second end portion connected to flange 1.
    Type: Application
    Filed: January 30, 2021
    Publication date: February 23, 2023
    Inventors: Alexei Marakhtanov, Felix Kozakevich, Bing Ji, Ranadeep Bhowmick, Kenneth Lucchesi, John Holland
  • Publication number: 20230054699
    Abstract: A tunable edge sheath (TES) system includes a coupling ring configured to couple to a bottom surface of an edge ring that surrounds a wafer support area within a plasma processing chamber. The TES system includes an annular-shaped electrode embedded within the coupling ring. The TES system includes a plurality of radiofrequency signal supply pins coupled to the electrode within the coupling ring. Each of the plurality of radiofrequency signal supply pins extends through a corresponding hole formed through a bottom surface of the coupling ring. The TES system includes a plurality of radiofrequency signal filters respectively connected to the plurality of radiofrequency supply pins. Each of the plurality of radiofrequency signal filters is configured to provide a high impedance to radiofrequency signals used to generate a plasma within the plasma processing chamber.
    Type: Application
    Filed: January 30, 2021
    Publication date: February 23, 2023
    Inventors: Alexei Marakhtanov, Felix Kozakevich, Bing Ji, Ranadeep Bhowmick, John Holland
  • Publication number: 20230007885
    Abstract: A method for achieving uniformity in an etch rate is described. The method includes receiving a voltage signal from an output of a match, and determining a positive crossing and a negative crossing of the voltage signal for each cycle of the voltage signal. The negative crossing of each cycle is consecutive to the positive crossing of the cycle. The method further includes dividing a time interval of each cycle of the voltage signal into a plurality of bins. For one or more of the plurality of bins associated with the positive crossing and one or more of the plurality of bins associated with the negative crossing, the method includes adjusting a frequency of a radio frequency generator to achieve the uniformity in the etch rate.
    Type: Application
    Filed: February 8, 2021
    Publication date: January 12, 2023
    Inventors: Alexei Marakhtanov, Felix Leib Kozakevich, Ranadeep Bhowmick, Bing Ji, John Holland
  • Patent number: 11545651
    Abstract: An optical film, a display screen assembly and a display device are disclosed. The optical film includes a light transmitting film and a light blocking film; the light transmitting film is a double-sided adhesive film, and the light blocking film is a flexible film and is connected with a periphery of the light transmitting film.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: January 3, 2023
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
    Inventors: Bing Ji, Xiaoxia Huang
  • Publication number: 20220384530
    Abstract: A display module and a display device are disclosed. The display module includes a first flexible circuit board, a display substrate, and a touch sensor disposed on the display side of the display substrate. The display substrate includes a flat region and curved surface regions; the touch sensor includes first and second bonding regions; the first bonding region and the second bonding region are on a surface, away from the display substrate, of the touch sensor, stacked with the flat region and spaced apart from each other; the first flexible circuit board is electrically connected with the touch sensor through the first bonding region and the second bonding region; the first flexible circuit board includes a main body and first and second bonding connection portions; the first and second bonding connection portions are respectively bonded with the first and second bonding regions.
    Type: Application
    Filed: November 1, 2019
    Publication date: December 1, 2022
    Applicants: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Xiaoxia HUANG, Bing JI, Shuang ZHANG
  • Publication number: 20220377903
    Abstract: A display device includes a display substrate, a touch module and a ring structure. The display substrate includes a first portion for display, a second portion located at a non-display side of the first portion of the display substrate, and a first bent portion for connecting the first portion and the second portion, and a first driver is provided at a side of the second portion away from the first portion. The touch module includes a touch layer and a touch flexible circuit board connected with the touch layer, the touch flexible circuit board includes a flat portion located at a side of the second portion away from the first portion and a second bent portion for connecting the touch layer and the flat portion. The ring structure is located between the flat portion of the touch flexible circuit board and the second portion of the display substrate.
    Type: Application
    Filed: October 31, 2019
    Publication date: November 24, 2022
    Applicants: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Shuang ZHANG, Xiaoxia HUANG, Jiangsheng WANG, Jianjun WU, Xuerui GONG, Bing JI
  • Publication number: 20220330416
    Abstract: Disclosed are a display panel, a display device, and a terminal apparatus. The display panel comprises a display substrate having a backlight surface and a main flexible circuit board. The main flexible circuit board comprises a connection section, a fixed section and a test section. The connection section is arranged on the backlight surface, and has an outer peripheral surface comprising a first side and a second side opposite to each other. The fixed section is attached and fixed onto the backlight surface, and having one end connected to the first side and another end extending towards an end of the first side away from the second side. The test section has one end connected to the first side, and another end comprising a connection port.
    Type: Application
    Filed: May 19, 2021
    Publication date: October 13, 2022
    Inventors: Shuang ZHANG, Xiaoxia HUANG, Bing JI
  • Publication number: 20220312654
    Abstract: Disclosed is a display device, comprising: a display panel (10), wherein the display panel (10) comprises a display area (AA), a bending area (BB) and a bonding area (CC), with the bending area (BB) being arranged between the display area (AA) and the bonding area (CC); a support heat dissipation structure (20), with the support heat dissipation structure (20) being disposed on a non-display surface (10b) of the display area (AA); a driving chip (30), with the driving chip (30) being fixed to a bonding surface (10c) of the bonding area (CC); and an electromagnetic shielding structure (40), with the electromagnetic shielding structure (40) being fixed onto a side of the support heat dissipation structure (20) away from the display panel (10).
    Type: Application
    Filed: April 8, 2021
    Publication date: September 29, 2022
    Inventors: Shuang ZHANG, Xiaoxia HUANG, Bing JI