Abstract: An integrated MEMS waveguide modulator, including: a static, non-suspended waveguide to guide light traveling through the waveguide; and a dielectric slab movable into and out of an evanescent field surrounding the waveguide using an actuation mechanism, wherein the dielectric slab is movable between a first position that is farthest away possible for the slab from the waveguide and a second position that is closest possible for the slab from the waveguide, wherein dispersion characteristic of the light is controlled by moving the dielectric slab from an unactuated mode that is at the first position to an actuated mode that is at the second position, and wherein the dielectric slab is layered to include non-uniform refractive index profile.

Abstract: An electromechanical systems structure including: providing a stack, including a structural layer extending in a plane, a sidewall layer including a first portion lying in a plane parallel to the structural layer plane and a second portion lying in a plane transverse to the structural layer plane, an etch-stop layer, positioned between the sidewall layer and the structural layer, including an etch-selectivity different from an etch-selectivity of the structural layer and an etch-selectivity of the sidewall layer, and a mold comprising a wall parallel to the sidewall layer's second portion; etching the sidewall layer's first portion to expose the etch-stop layer; removing the mold; etching the etch-stop layer such that the sidewall layer's second portion masks a portion of the etch-stop layer; removing the sidewall layer's second portion; and etching the structural layer such that the portion of the etch-stop layer masks a portion of the structural layer.

Abstract: Rack-type backlight light emitting element (LEE) printed circuit boards (PCBs) with at least two layers to provide redundant current paths. This enables a PCB strip to be broken at designated perforations in the field in order to accommodate pipes or fixtures that require formation of a gap in the rack array. The entire length and width of an array can be sized in the field. A plurality of PCB arrays can be serially chained together with the system. A chain of PCB strips is snapped into clips, which in turn snap into rails that are fastened to a surface. The mounting system includes various types of clips, such as end clips, clips for different LEE patterns on the PCBs, and mounting clips to secure the rails to a surface.

Abstract: Electronic devices comprising pixels for sensing, methods for operating the electronic devices, and methods for manufacturing the electronic devices are disclosed. In some embodiments, the electronic devices comprise hinges for supporting the pixels. In some embodiments, the electronic devices are configured to provide a bias voltage to the pixels.

Abstract: Membrane fabrication including: depositing a bottom Molybdenum (Mo) layer; depositing a polyimide (PI) layer and defining a first release hole; curing the PI layer; depositing a top Mo layer; and defining and etching a second release hole within the first release hole.

Abstract: Microelectromechanical system (MEMS) devices, methods of operating the MEMS device, and methods of manufacturing the MEMS device are disclosed. In some embodiments, the MEMS device includes a glass substrate; an electrode on the glass substrate; a hinge mechanically coupled to the electrode; a membrane mirror mechanically coupled to the hinge; a TFT on the glass substrate and electrically coupled to the electrode; and a control circuit comprising: a multiplexer configured to turn on or turn off the TFT; and a drive source configured to provide a drive signal for charging the electrode through the TFT. An amplitude of the drive signal corresponds to an amount of charge, and the amount of charge generates an electrostatic force for actuating the hinge and a portion of the membrane mirror mechanically coupled to the hinge.

Abstract: A method of manufacturing an electromechanical systems structure includes manufacturing sub-micron structural features. In some embodiments, the structural features are less than the lithographic limit of a lithography process.

Abstract: Methods and systems for sensing a user interaction (e.g., a fingerprint) with a display of an electronic device are disclosed. In some embodiments, the method includes illuminating, with a light source, a position of a user interaction on the display. In some embodiments, the method includes detecting, with a detector, a backscattered light from the position. In some embodiments, the light source and the detector are located on a same layer of the display.

Abstract: Disclosed herein are MEMS devices and systems and methods of manufacturing or operating the MEMS devices and systems. In some embodiments, the MEMS devices and systems are used in imaging applications.

Abstract: Data converter circuits and methods of operating the data converter circuits are disclosed. In some embodiments, a data converter circuit includes a charge measurement circuit. In some embodiments, the charge measurement circuit is a capacitive transimpedance amplifier (CTIA). In some embodiments, the data converter circuit includes the CTIA, a quantizer, a digital-to-analog converter, a summer, and a digital filter. In some embodiments, the data converter circuit includes an analog-to-digital converter electrically coupled to the CTIA and the digital filter. In some embodiment, a method includes integrating an input signal with a CTIA, determining whether a CTIA output signal is greater than a threshold, and reducing the CTIA output signal or forgoing the reducing based on the determination of whether the CTIA output signal is greater than the threshold.

Abstract: A detection device, an inverter, and a detection method are disclosed. The detection device is configured to detect a leakage current flowing through a conductor. The detection device includes a magnetic core, a detection winding and a calibration winding both wound on the magnetic core, a detection circuit, and a calibration circuit. The detection circuit is coupled to the detection winding, and configured to sample a detection signal of the detection winding to obtain a leakage current detection value. The calibration circuit is coupled to the calibration winding, and configured to provide a calibration signal to the calibration winding.

Abstract: Methods and systems for sensing a user interaction (e.g., a fingerprint) with a display of an electronic device are disclosed. In some embodiments, the method includes illuminating, with a light source, a position of a user interaction on the display. In some embodiments, the method includes detecting, with a detector, a backscattered light from the position. In some embodiments, the light source and the detector are located on a same layer of the display.

Abstract: Disclosed herein are MEMS devices and systems and methods of manufacturing or operating the MEMS devices and systems. In some embodiments, the MEMS devices and systems are used in imaging applications.

Abstract: Systems and methods for spectrometry are disclosed. In some embodiments, the system comprises a Fourier Transform Spectrometer (FTS) comprising a waveguide and a delay element. In some embodiments, the method comprises determining a power spectral density of an input optical signal via the FTS.

Abstract: Methods of sensor readout and calibration and circuits for performing the methods are disclosed. In some embodiments, the methods include driving an active sensor at a voltage. In some embodiments, the methods include use of a calibration sensor, and the circuits include the calibration sensor. In some embodiments, the methods include use of a calibration current source and circuits include the calibration current source. In some embodiments, a sensor circuit includes a Sigma-Delta ADC. In some embodiments, a column of sensors is readout using first and second readout circuits during a same row time.

Abstract: A method of manufacturing MEMS housings includes: providing glass spacers; providing a window plate; attaching the window plate to the glass spacers; aligning the glass spacers with a device glass plate having MEMS devices thereon; bonding the glass spacers to the device glass plate; and singulating the glass spacers, window plate, and device glass plate to produce the MEMS housings.

Abstract: Disclosed herein are MEMS devices and systems and methods of manufacturing or operating the MEMS devices and systems for transmitting and detecting radiation. The devices and methods described herein are applicable to terahertz radiation. In some embodiments, the MEMS devices and systems are used in imaging applications. In some embodiments, a microelectromechanical system comprises a glass substrate configured to pass radiation from a first surface of the glass substrate through a second surface of the glass substrate, the glass substrate comprising TFT circuitry; a lid comprising a surface; spacers separating the lid and glass substrate; a cavity defined by the spacers, surface of the lid, and second surface of the glass substrate; a pixel in the cavity, positioned on the second surface of the glass substrate, electrically coupled to the TFT circuitry, and comprising an absorber to detect the radiation; and a reflector to direct the radiation to the absorbers and positioned on the lid.

Abstract: Microelectromechanical system (MEMS) devices, methods of operating the MEMS device, and methods of manufacturing the MEMS device are disclosed. In some embodiments, the MEMS device includes a glass substrate; an electrode on the glass substrate; a hinge mechanically coupled to the electrode; a membrane mirror mechanically coupled to the hinge; a TFT on the glass substrate and electrically coupled to the electrode; and a control circuit comprising: a multiplexer configured to turn on or turn off the TFT; and a drive source configured to provide a drive signal for charging the electrode through the TFT. An amplitude of the drive signal corresponds to an amount of charge, and the amount of charge generates an electrostatic force for actuating the hinge and a portion of the membrane mirror mechanically coupled to the hinge. In some embodiments, the MEMS devices comprise a charge transfer circuit for providing the amount of charge.

Abstract: Circuitries for controlling a power consuming device are disclosed. Methods for operating the circuitries and manufacturing the circuitries are also disclosed. In some embodiments, the circuit comprises a first thin-film transistor (TFT), a second TFT, and a storage capacitor. The first TFT is configured to output a current to a power consuming device. The second TFT is configured to provide a control voltage to the first TFT for controlling an amount of the current. The storage capacitor is configured to store the control voltage.

Abstract: A detection device, an inverter, and a detection method are disclosed. The detection device is configured to detect a leakage current flowing through a conductor. The detection device includes a magnetic core, a detection winding and a calibration winding both wound on the magnetic core, a detection circuit, and a calibration circuit. The detection circuit is coupled to the detection winding, and configured to sample a detection signal of the detection winding to obtain a leakage current detection value. The calibration circuit is coupled to the calibration winding, and configured to provide a calibration signal to the calibration winding.