Patents by Inventor BING-YUN NIE

BING-YUN NIE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110303688
    Abstract: An enclosure includes an enclosure body and a support. The enclosure includes a bottom wall. A receiving recess is formed in the bottom wall. The support defines a contacting surface substantially parallel to the bottom wall and an attachment surface. The support includes a securing portion extending from the attachment surface. A distance between the supporting surface and the attachment surface is greater than the depth of the receiving recess. The supporting surface is configured to contact a supporting surface to maintain a space between the bottom wall and the supporting surface.
    Type: Application
    Filed: October 28, 2010
    Publication date: December 15, 2011
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY(ShenZhen) CO., LTD.
    Inventors: YUN-LUNG CHEN, GUO-ZHONG LIU, BING-YUN NIE