Abstract: A programming control circuit programs a memory cell in accordance to a programming signal value that can be varied by a test equipment. The programming control circuit comprises a signal storage device, a signal output circuit, and a verification circuit. The signal storage device stores the programming signal value. The test equipment can be coupled to the signal storage device to write the programming signal value into the signal storage device. The signal output circuit is coupled to the signal storage device to receive the programming signal value. The signal output circuit converts the programming signal value into a programming signal and outputs the programming signal to the memory cell. The verification circuit determines whether the memory cell is successfully programmed. If the memory cell is not successfully programmed, the programming control circuit increases the programming signal value.

Abstract: A non-volatile memory and method for continuously regulating an output of a charge pump of the non-volatile memory for long periods of time at a target output voltage.

Abstract: The present invention reduces the voltage across the gate oxide and across a junction of a high voltage MOSFET (Metal Oxide Semiconductor Field Effect Transistor) within an unselected block of an electrically erasable memory during an erase operation of a selected block of the electrically erasable memory. The drain node is coupled to each respective control gate node of a plurality of core cells disposed within a well. The present invention includes a voltage generator coupled to a gate node of the high voltage transistor and to the well having the core cells disposed therein. The present invention also includes a microcontroller that controls the voltage generator to ramp up a magnitude of a well voltage applied at the well from a start ramping time when the well voltage is at a start voltage to an end ramping time when the well voltage is at an end voltage.

Abstract: A memory system has the capability to adjust a program or erase voltage if the time to program or erase is excessive. The memory system comprises at least a memory cell, a voltage value storage device, a voltage source, and a voltage adjustment circuit. The voltage value storage device stores a voltage value. The voltage source receives and converts the voltage value into a voltage. The voltage source applies the voltage to at least one memory cell. The voltage adjustment circuit is also coupled to receive the stored voltage value. The voltage adjustment circuit determines the time required to program or erase at least one memory cell using the voltage value. If the time to program or erase at least one memory cell is excessive, the voltage adjustment circuit increments the voltage value stored in the voltage value storage device.

Abstract: A series select transistor and a source select transistor are connected in series at the end of a NAND string of floating gate data storage transistors. The floating gates, the series select gate, and the source select gate are all preferably formed of polysilicon. The same tunnel oxide layer is used as gate oxide for the series select transistor and source select transistor as well as for the floating gate data storage transistors. Two layers of polysilicon in the series select gate and the source select gates are tied together. The series select transistor is tied to the last transistor in the NAND string. The source select transistor is tied to the array Vss supply. In order to program inhibit a specific NAND cell during the programming of another NAND cell, the gate of the series select transistor is raised to Vcc, while the gate of the source select transistor is held to ground.

Abstract: A capacitor divider includes two capacitors coupled in series between two voltage sources. A first capacitor is a floating gate capacitor having one plate being the control gate of a floating gate transistor structure and the other plate being a source, drain, and channel region of the floating gate transistor structure. The capacitive divider has the advantage of having at least one floating gate capacitor, can be implemented in a voltage regulator, and works for a variety of voltages across the capacitors.

Abstract: An erase control circuit erases a memory cell in accordance to an erase signal value that can be varied by a test equipment. The erase control circuit comprises a signal storage device, a signal output circuit, and a verification circuit. The signal storage device stores the erase signal value. A test equipment can be coupled to the signal storage device to write the programming signal value into the signal storage device. The signal output circuit is coupled to the signal storage device to receive the erase signal value. The signal output circuit converts the erase signal value into an erase signal and outputs the erase signal to the memory cell. The verification circuit determines whether the memory cell is successfully erased. If the memory cell is not successfully erased, the erase control circuit increases the erase signal value.

Abstract: The present invention reduces the voltage across the gate oxide and across a junction of a high voltage MOSFET (Metal Oxide Semiconductor Field Effect Transistor) within an unselected block of an electrically erasable memory during an erase operation of a selected block of the electrically erasable memory. The drain node is coupled to each respective control gate node of a plurality of core cells disposed within a well. The present invention includes a voltage generator coupled to a gate node of the high voltage transistor and to the well having the core cells disposed therein. The present invention also includes a microcontroller that controls the voltage generator to ramp up a magnitude of a well voltage applied at the well from a start ramping time when the well voltage is at a start voltage to an end ramping time when the well voltage is at an end voltage.

Abstract: A method and an apparatus are provided for the production and supply of an erase voltage for the initial erasing operation of a floating gate transistor used as a capacitor in a voltage regulator, along with the proper electrical connection of the capacitor's control gate and commonly connected regions. In one embodiment, a capacitor erase control circuit controls a pass transistor for connecting the control gate of the floating gate capacitor to ground and another pass transistor for isolating the commonly connected source, drain and channel regions of the floating gate capacitor (the "well node") from ground. The erase control circuit simultaneously applies a capacitor erase input and a clock input to an erase voltage pass circuit to control a third pass transistor to apply an erase voltage to the well node, thereby erasing the floating gate capacitor.

Abstract: A two part high voltage check program creates a circuit simulator input file, analyzes the resulting circuit simulator output file for design rule violations, and produces a user report of all violations. The user creates a transistor file which indicates which blocks are to be checked, and optionally specifies individual transistors within the block for checking. The user creates a rule file including rule definitions for the various different types of transistors in the design. The first part generates a print file for input to a circuit simulator. The second part reads the print file, the rule file, and the simulator output file. The second part produces a transistor linked list which is linked to the rule linked list. The second part reads the simulator output file line by line and performs the high voltage electrical rule checks for each transistor for each time step. The second part produces a violation linked lists for each transistor for each violation type.

Abstract: An EEPROM NAND array has floating gate memory cells coupled in series, each having a control gate, a floating gate, a body region, and an insulating layer between the floating gate and the body region. A negative charge pump is coupled to the body region. In programming, the body region of the memory cell selected for programming is biased to a negative voltage by the negative charge pump while the control gate of the memory cell is biased to a predetermined positive voltage sufficient to induce Fowler-Nordheim tunneling from the body region into the floating gate. The present invention allows the programming voltage requirement at the control gate of a NAND EEPROM memory cell to be significantly reduced which allows for the peripheral voltage delivery circuitry in NAND EEPROM arrays to be designed for lower voltages than for conventional NAND EEPROM arrays.

Abstract: A series select transistor and a source select transistor are connected in series at the end of a NAND string of floating gate data storage transistors. The floating gates, the series select gate, and the source select gate are all preferably formed of polysilicon. The same tunnel oxide layer is used as gate oxide for the series select transistor and source select transistor as well as for the floating gate data storage transistors. Two layers of polysilicon in the series select gate and the source select gates are tied together. The series select transistor is tied to the last transistor in the NAND string. The source select transistor is tied to the array Vss supply. In order to program inhibit a specific NAND cell during the programming of another NAND cell, the gate of the series select transistor is raised to Vcc, while the gate of the source select transistor is held to ground.

Abstract: A non-volatile memory device includes a plurality of MOS transistors 34 and 36 connected to respective word lines 16 and 18 to allow individual pages of memory stored in the memory cells 8a, 10a and 8b, 10b on the respective word lines 16 and 18 to be erased and erase verified. A method of erasing a page of memory cells includes the steps of applying an erase voltage to one of the MOS transistors 16 and 18 to erase the page of memory cells along the respective word line, and applying an initial erase-inhibit floating voltage to other MOS transistors which are connected to the word lines unselected for page erase. In an erase verify mode, an erase verify voltage is applied to the word line which was selected for page erase in the erase mode, and an erase verify unselect voltage is applied to the word lines which was not selected for page erase.

Abstract: In the programming of a non-volatile memory device, such as a NAND flash memory device 100, a positive bias voltage V.sub.bias is applied to a bit line 44 to set a respective memory gate 44a in a programmed state. In a further embodiment, the positive bias voltage V.sub.bias is obtained by dividing the select drain gate voltage V.sub.cc using two resistors 56 and 58 connected in series.

Abstract: A charge pump circuit having a fast rise time and reduced physical area is disclosed. The charge pump includes a plurality of stages having a non-uniform series of bootstrap capacitors. By using non-uniform capacitors at the various stages, charging rise time is enhanced while at the same time reducing the overall physical size of the charge pump.

Abstract: In a high voltage pass gate suitable for use as a block decoder in a flash memory circuit, the boosting of the block decoder's internal nodes is performed using coupling capacitors and boost transistors which are decoupled from the high capacitance pass gate node. The block decoder uses three internal block decoder nodes. Each of the three nodes is held to ground by a corresponding discharge transistor when the block is unselected. Each of the three nodes of a selected block is discharged to a normal supply voltage by a corresponding diode-connected regulation transistor when the high voltage supply is turned off after a programming operation has finished. Each of the three nodes has a separate coupling capacitor associated with it. One of the nodes is connected to the gates of the high voltage pass transistors, this node has high capacitance. The remaining two nodes have relatively small coupling capacitors.

Abstract: A series select transistor and a source select transistor are connected in series at the end of a NAND string of floating gate data storage transistors. The floating gates, the series select gate, and the source select gate are all preferably formed of polysilicon. The same tunnel oxide layer is used as gate oxide for the series select transistor and source select transistor as well as for the floating gate data storage transistors. Two layers of polysilicon in the series select gate and the source select gates are tied together. The series select transistor is tied to the last transistor in the NAND string. The source select transistor is tied to the array Vss supply. In order to program inhibit a specific NAND cell during the programming of another NAND cell, the gate of the series select transistor is raised to Vcc, while the gate of the source select transistor is held to ground.

Abstract: According to an aspect of the embodiments, the block decoder control circuits which drive the pass transistors for the word lines for a flash memory array are driven with a control voltage that is regulated to be one enhancement transistor's threshold voltage higher than the highest voltage that is actually driven onto the word lines. According to another aspect of some of the embodiments, the block decoder control circuits are implemented with transistors having a very low threshold voltage. According to yet another aspect of some of the embodiments, a special series connection is used to prevent any leakage current through the block decoder control circuit from the high voltage generating charge pumps which might otherwise result from the use of low threshold voltage transistors. In the special series connection, any leakage current occurs from the supply voltage source rather than from the high voltage generating charge pumps.

Abstract: Two NMOS boost transistors have their sources connected to the high voltage input while their drains and gates are cross-connected. Two coupling capacitors connect two alternate phase clocks to the gates of the two cross-connected boost transistors. An NMOS pass transistor has its gate connected to the drain of one of the NMOS boost transistors, its source connected to the high voltage input, and its drain connected to the output. In an embodiment, two diode-connected regulation transistors connect the gates of the boost transistors to the high voltage input. These connections insure that the gates of the boost transistors and the gate of the pass transistor never reach voltages higher than one threshold voltage above the high voltage input. In another embodiment, two discharge transistors have their drains connected to a decode input, their sources connected to the gates of the boost transistors, and their gates connected to the positive power supply.

Abstract: According to an aspect of the embodiments, the block decoder control circuits which drive the pass transistors for the word lines for a flash memory array are driven with a control voltage that is regulated to be one enhancement transistors threshold voltage higher than the highest voltage that is actually driven onto the word lines. According to another aspect of some of the embodiments, the block decoder control circuits are implemented with transistors having a very low threshold voltage. According to yet another aspect of some of the embodiments, a special series connection is used to prevent any leakage current through the block decoder control circuit from the high voltage generating charge pumps which might otherwise result from the use of low threshold voltage transistors. In the special series connection, any leakage current occurs from the supply voltage source rather than from the high voltage generating charge pumps.