Patents by Inventor Binod B. De

Binod B. De has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12338309
    Abstract: This disclosure relates to a dielectric film-forming composition that includes at least one cyclized polydiene resin, and one or both of at least one reactive functional compound and at least one catalyst.
    Type: Grant
    Filed: March 4, 2024
    Date of Patent: June 24, 2025
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Binod B. De, William A. Reinerth, Sanjay Malik, Stephanie Dilocker, Raj Sakamuri
  • Publication number: 20250188015
    Abstract: There are provided indane bis-o-aminophenol compounds capable of producing soluble polyimides, functional polyimides, and poly-o-hydroxyamides.
    Type: Application
    Filed: November 21, 2024
    Publication date: June 12, 2025
    Inventor: Binod B. De
  • Publication number: 20250188312
    Abstract: This disclosure describes highly soluble novel poly-o-hydroxyamides containing indane bis-o-aminophenols, photosensitive compositions containing same, and methods and articles for use thereof.
    Type: Application
    Filed: November 26, 2024
    Publication date: June 12, 2025
    Inventors: Binod B. De, William A. Reinerth
  • Publication number: 20250188223
    Abstract: Preparation of polyimides and functional polyimides comprising novel indane bis-o-aminophenols and photosensitive compositions obtained therefrom are described.
    Type: Application
    Filed: November 21, 2024
    Publication date: June 12, 2025
    Inventors: Binod B. De, Sanjay Malik
  • Publication number: 20250189892
    Abstract: This disclosure describes poly-o-hydroxyamides containing novel indane bis-o-aminophenols, negative tone photosensitive compositions containing same, and methods and articles for use thereof.
    Type: Application
    Filed: November 26, 2024
    Publication date: June 12, 2025
    Inventors: Binod B. De, William A. Reinerth
  • Publication number: 20250188311
    Abstract: This disclosure describes highly soluble novel poly-o-hydroxyamides containing new indane bis-o-aminophenols, photosensitive compositions containing same, and methods and articles for use thereof.
    Type: Application
    Filed: November 26, 2024
    Publication date: June 12, 2025
    Inventors: Binod B. De, William A. Reinerth
  • Publication number: 20250065365
    Abstract: This disclosure relates to a dielectric film-forming composition that includes (a) at least one resin selected from the group consisting of: i) a fully imidized polyimide polymer; ii) a polyamic acid ester; iii) a cyclized polydiene resin; and iv) a mixture of a cyclized polydiene resin and a cyanate ester compound; and (b) at least one additive selected from a group consisting of: i) a polybenzoxazole (PBO) precursor; ii) PBO particles; iii) a mixture of PBO and silica particles; and iv) a PBO resin containing at least two reactive functional groups.
    Type: Application
    Filed: August 20, 2024
    Publication date: February 27, 2025
    Inventor: Binod B. De
  • Publication number: 20250051532
    Abstract: This disclosure relates to a dielectric film-forming composition that includes (a) at least one meth(acrylate)-containing polyphenylene ether resin and (b) at least one second resin selected from the group consisting of: i) at least one fully imidized polyimide polymer; ii) at least one polyamic acid ester; iii) at least one cyclized polydiene resin; and iv) a mixture of a cyclized polydiene resin and a cyanate ester compound.
    Type: Application
    Filed: August 7, 2024
    Publication date: February 13, 2025
    Inventor: Binod B. De
  • Publication number: 20250046717
    Abstract: The present disclosure generally relates to microelectronic devices with good reliability and related compositions and methods. In some embodiments, the methods include providing a composition comprising a hydrophobic multifunctional (meth)acrylate crosslinker and a polymer, and reacting the composition to provide a dielectric layer, wherein, when the dielectric layer is present in a microelectronic device, the microelectronic device exhibits good reliability. In certain embodiments, the compositions include a fully imidized polyimide and a hydrophobic multifunctional (meth)acrylate crosslinker, wherein the dielectric composition is suitable to provide a dielectric layer that imparts good reliability to a microelectronic device when the dielectric layer is present in the device.
    Type: Application
    Filed: July 24, 2024
    Publication date: February 6, 2025
    Inventors: Stefan Vanclooster, Satoshi Matsui, Sanjay Malik, Binod B. De, William A. Reinerth, Stephanie Dilocker, Juliet Kotyk
  • Publication number: 20240408590
    Abstract: The present disclosure is directed to methods and systems of purifying bioderived organic solvents. The purified bioderived organic solvents can be used in a multistep semiconductor manufacturing process.
    Type: Application
    Filed: June 5, 2024
    Publication date: December 12, 2024
    Inventors: Sanjay Malik, William A. Reinerth, Binod B. De, Stephanie Dilocker, Raj Sakamuri
  • Publication number: 20240254268
    Abstract: This disclosure relates to a dielectric film-forming composition that includes at least one cyclized polydiene resin, and one or both of at least one reactive functional compound and at least one catalyst.
    Type: Application
    Filed: March 4, 2024
    Publication date: August 1, 2024
    Inventors: Binod B. De, William A. Reinerth, Sanjay Malik, Stephanie Dilocker, Raj Sakamuri
  • Publication number: 20240248400
    Abstract: This disclosure relates to a dielectric film forming composition that includes at least one resin; and at least one acyl germanium compound, as well as related processes, films, dry film structures, and articles.
    Type: Application
    Filed: December 18, 2023
    Publication date: July 25, 2024
    Inventors: Binod B. De, Sanjay Malik, William A. Reinerth, Stephanie Dilocker
  • Patent number: 11945894
    Abstract: This disclosure relates to a dielectric film-forming composition that includes at least one cyclized polydiene resin, and one or both of at least one reactive functional compound and at least one catalyst.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: April 2, 2024
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Binod B. De, William A. Reinerth, Sanjay Malik, Stephanie Dilocker, Raj Sakamuri
  • Patent number: 11939428
    Abstract: This disclosure relates to a polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib), (b) at least one diamine of Structure (II), (c) at least one tetracarboxylic acid dianhydride, and optionally (d) at least one compound containing a first functional group reactive with an amine or an anhydride and at least a second functional group selected from the group consisting of a substituted or unsubstituted alkenyl group and a substituted or unsubstituted alkynyl group. Each variable in the above formulas is defined in the specification.
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: March 26, 2024
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Binod B. De, Sanjay Malik, William A. Reinerth, Ognian N. Dimov, Ahmad A. Naiini, Raj Sakamuri
  • Patent number: 11899364
    Abstract: This disclosure relates to a dry film structure that includes a carrier substrate, and a polymeric layer supported by the carrier substrate. The polymeric layer includes at least one fully imidized polyimide polymer.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: February 13, 2024
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Binod B. De, Sanjay Malik, Raj Sakamuri, William A. Reinerth, Ognian N. Dimov, Ahmad A. Naiini
  • Patent number: 11782344
    Abstract: This disclosure relates to a photosensitive composition that includes at least one fully imidized polyimide polymer having a weight average molecular weight in the range of about 20,000 Daltons to about 70,000 Daltons; at least one solubility switching compound; at least one photoinitiator; and at least one solvent. The composition is capable of forming a film or a dry film having a dissolution rate of greater than about 0.15 micron/second using cyclopentanone as a developer.
    Type: Grant
    Filed: July 11, 2018
    Date of Patent: October 10, 2023
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Sanjay Malik, Raj Sakamuri, Ognian N. Dimov, Binod B. De, William A. Reinerth, Ahmad A. Naiini
  • Publication number: 20230053355
    Abstract: This disclosure relates to a dry film structure that includes a carrier substrate; and a dielectric film supported by the carrier substrate. The dielectric film includes at least one dielectric polymer and low amounts of metals.
    Type: Application
    Filed: December 21, 2020
    Publication date: February 23, 2023
    Inventors: Sanjay Malik, William A. Reinerth, Binod B. De
  • Publication number: 20220127459
    Abstract: This disclosure relates to a dielectric film-forming composition that includes (a) at least one cyanate ester compound, the at least one cyanate ester compound containing at least two cyanate groups; and (b) at least one dielectric polymer including a polybenzoxazoie precursor polymer, a polyimide precursor polymer, or a fully imidized polyimide polymer.
    Type: Application
    Filed: October 12, 2021
    Publication date: April 28, 2022
    Inventors: Binod B. De, Raj Sakamuri, Sanjay Malik, Stephanie Dilocker, William A. Reinerth
  • Publication number: 20220017673
    Abstract: This disclosure relates to a dielectric film forming composition that includes a plurality of (meth)acrylate containing compounds, at least one fully imidized polyimide polymer, and at least one solvent.
    Type: Application
    Filed: July 13, 2021
    Publication date: January 20, 2022
    Inventors: Sanjay Malik, Binod B. De, William A. Reinerth, Ognian Dimov, Stephanie Dilocker
  • Publication number: 20220002463
    Abstract: This disclosure relates to a dielectric film-forming composition that includes at least one cyclized polydiene resin, and one or both of at least one reactive functional compound and at least one catalyst.
    Type: Application
    Filed: June 21, 2021
    Publication date: January 6, 2022
    Inventors: Binod B. De, William A. Reinerth, Sanjay Malik, Stephanie Dilocker, Raj Sakamuri