Abstract: A pelvic floor muscle exercise machine according to the present invention comprises: a waist belt fixed to a user's waist; a support belt fixed to the waist belt; and an insertion device provided on the support belt. The insertion device comprises: an insertion part inserted into and extracted from the user's vagina; a rod extending from the insertion portion, penetrated by the support belt so as to be slidable; and guiding the movement of the insertion part; and an elastic member supported by the rod, and providing elastic restoring force to the insertion part by elastically transforming in accordance with the relative movement of the insertion part with respect to the support belt.

Abstract: An embodiment charging power filtering method includes receiving a signal instructing whether or not a filtering request is required from an on-board charger, selecting a mode of a plurality of modes for driving a filter based on the signal instructing whether or not the filtering request is required, and charging a battery using the selected mode.

Abstract: An embodiment system includes a mobile charger and a vehicle. The vehicle includes a connection port designed to interface with the mobile charger and a vehicle battery. A vehicle battery management unit is configured to control a current and a voltage of charging and output by detecting a temperature, a current, and a voltage in each module of the vehicle battery. A power conversion unit includes a motor and an inverter and is configured to convert a voltage received at the connection port to a magnitude of voltage that charges the vehicle battery. A charging management unit is coupled to the second battery management unit and the power conversion unit.

Abstract: Disclosed is a brake device, including a motor unit operated by an electrical signal, a gear unit having a plurality of gears connected to the motor unit, a cylinder unit having a piston connected to the gear unit to be propelled by operations of a plurality of the gears, a brake pad unit connected to the piston to be propelled by propulsion of the piston, and a caliper body having the cylinder unit seated thereon to guide the brake pad unit. Disclosed is a vehicle having a brake device, the brake device including a motor unit operated by an electrical signal, a gear unit having a plurality of gears connected to the motor unit, a cylinder unit having a piston connected to the gear unit to be propelled by operations of a plurality of the gears, a brake pad unit connected to the piston to be propelled by propulsion of the piston, and a caliper body having the cylinder unit seated thereon to guide the brake pad unit.

Abstract: The present disclosure relates to a pad liner for a brake caliper, a brake caliper equipped with the pad liner and a method for assembling the brake caliper, and a vehicle equipped with the brake caliper. The pad liner according to an embodiment of the present disclosure includes a body seated in a caliper body and formed in a shape of a flat plate, an upper elastic portion connected to an upper portion of the body, and a lower elastic portion connected to a lower portion of the body, the upper elastic portion applies an elastic force to an upper portion of the brake pad, and the lower elastic portion applies an elastic force to a lower portion of the brake pad. According to embodiments of the present disclosure, reliability of a return operation of the brake pad is ensured to reduce drag and braking noise.

Abstract: Substrate cleaning equipment includes a substrate holder which supports a substrate, a swing body, a head, a first cleaning liquid supply structure, and a second cleaning liquid supply structure. The swing body moves along a sweep line on a main surface of the substrate. The head is coupled to the swing body and includes a pad attachment surface facing the substrate holder. The first cleaning liquid supply structure is coupled to the swing body and sprays a first cleaning liquid onto the main surface of the substrate. The second cleaning liquid supply structure sprays a second cleaning liquid onto the main surface of the substrate. A buffing pad is attached to the pad attachment surface.

Abstract: A polishing pad for chemical mechanical polishing includes a polymer matrix and a temperature sensitive agent dispersed in the polymer matrix and constituting 1 to 40% by volume of the polishing pad, wherein the temperature sensitive agent includes a two-dimensional (2D) sheet material having a thermal conductivity of 1 W/(m·K) or more.

Abstract: The present disclosure relates to a brake pad, a brake caliper equipped with the brake pad, and a vehicle equipped with the brake caliper. The brake pad may include two brake pad connectors symmetrically positioned with respect to a center of a brake pad surface and connected to the caliper body by springs. Reliability of a return operation of the brake pad is secured, thereby reducing drag and braking noise.

Abstract: A method for fabricating a semiconductor device includes providing a polishing pad which includes a first region and a second region separated from each other by a fence, loading a wafer onto the first region, providing a slurry solution onto the first region, providing an ultrapure water onto the second region, turning the polishing pad to polish a surface of the wafer, and unloading the wafer from the polishing pad after polishing on the surface of the wafer is completed, wherein the fence includes a first fence extending from a center of the polishing pad toward an edge of the polishing pad in a first horizontal direction, and a second fence extending from the center of the polishing pad toward the edge of the polishing pad in a second horizontal direction different from the first horizontal direction.

Abstract: The present invention relates to a peptide for cancer immunotherapy that disrupts tumor-derived vesicles and a use thereof. The peptide according to the present invention has an ?-helical structure, inhibits T-cell functional impairment caused by tumor-derived vesicles and controls the formation of a tumor microenvironment as an immunosuppressive environment by disrupting the tumor-derived vesicles, and has effects of not only enhancing cancer immunotherapy activity but also inhibiting the metastasis of cancer cells through co-administration with an immune checkpoint inhibitor. Additionally, when the peptide is modified with PEG through a pH-sensitive linker, it has effects of increasing the stability of the peptide in vivo, and disrupting tumor-derived vesicles under the pH condition of the tumor microenvironment.

Abstract: A disk brake apparatus of an in-wheel driving system may include: an in-wheel driving device having a rotor and stator, and positioned within a wheel; a first torque member installed on the stator, and configured to support one side portions of a pair of brake pads; a second torque member spaced apart from the first torque member, and configured to support the other side portions of the brake pads; and a caliper body having one side portion coupled to the first torque member and the other side portion coupled to the second torque member, and configured to press the brake pads toward a wheel disk.

Abstract: A method of manufacturing a semiconductor device includes forming a first pattern structure having a first opening and a second pattern structure having a second opening on a substrate, forming a gap fill layer in the second opening, forming fences and contact structures in the first opening, removing the gap fill layer in the second opening, forming an upper conductive layer to cover the first and second pattern structures, the fences, and the contact structures, forming a mask pattern based on a photolithography process using the second pattern structure covered by the upper conductive layer as an align mark, and etching the upper conductive layer using the mask pattern to form upper conductive patterns. A width of the second opening is larger than a width of a first opening. A thickness of the upper conductive layer is smaller than a depth of the second opening.

Abstract: A brake apparatus for a vehicle may include: a stator unit fixed to an inside of a wheel of the vehicle, a rotor unit disposed to face the stator unit and rotated by electromagnetic interaction with the stator unit, a disc unit connected to the rotor unit and rotated together with the rotor unit, a pair of caliper units disposed on both sides of the disc unit and configured to generate a braking force by contacting with the disc unit as hydraulic pressure is applied, and a transfer unit connected to the pair of caliper units, and configured to transfer hydraulic pressure applied to one of the pair of caliper units to a remaining one of the pair of caliper units.

Abstract: A method of manufacturing a semiconductor device includes forming a first pattern structure having a first opening and a second pattern structure having a second opening on a substrate, forming a gap fill layer in the second opening, forming fences and contact structures in the first opening, removing the gap fill layer in the second opening, forming an upper conductive layer to cover the first and second pattern structures, the fences, and the contact structures, forming a mask pattern based on a photolithography process using the second pattern structure covered by the upper conductive layer as an align mark, and etching the upper conductive layer using the mask pattern to form upper conductive patterns. A width of the second opening is larger than a width of a first opening. A thickness of the upper conductive layer is smaller than a depth of the second opening.

Abstract: A temperature controller of a plasma processing apparatus, a temperature measurer for a plasma processing apparatus, and a plasma processing apparatus, the temperature controller including a movable cooling plate configured to selectively contact a dielectric window in a plasma chamber, the cooling plate having at least one cooling groove through which a cooling agent for cooling the dielectric window is flowable; at least one cooling port including a cooling passageway that is connected to the at least one cooling groove; and a resilient member configured to resiliently press the cooling port toward the cooling plate such that the cooling plate is relatively movable with respect to the dielectric window.

Abstract: A method of manufacturing a semiconductor device includes forming a first pattern structure having a first opening and a second pattern structure having a second opening on a substrate, forming a gap fill layer in the second opening, forming fences and contact structures in the first opening, removing the gap fill layer in the second opening, forming an upper conductive layer to cover the first and second pattern structures, the fences, and the contact structures, forming a mask pattern based on a photolithography process using the second pattern structure covered by the upper conductive layer as an align mark, and etching the upper conductive layer using the mask pattern to form upper conductive patterns. A width of the second opening is larger than a width of a first opening. A thickness of the upper conductive layer is smaller than a depth of the second opening.

Abstract: A semiconductor device that includes a plurality of word lines disposed on a substrate in which p-type and n-type active regions are defined, and extends in a first direction. A plurality of bit lines is disposed on the plurality of word lines and extends in a second direction, perpendicular to the first direction. A plurality of memory cells is disposed between the plurality of word lines and the plurality of bit lines and each includes a data storage pattern. The plurality of memory cells includes a plurality of dummy memory cells and a plurality of main memory cells. An upper surface of the data storage pattern of the main memory cells is higher than an upper surface of the data storage pattern of the dummy memory cells.

Abstract: A method of forming a semiconductor device includes forming a mold structure on a substrate, forming a first mask layer having a deposition thickness on the mold structure and patterning the first mask layer to form first mask openings which expose the mold structure. The mold structure is etched to form holes that penetrate the mold structure. The first mask layer is thinned to form mask portions having thickness smaller than the deposition thickness. Conductive patterns are formed to fill the holes and the first mask openings. The first mask layer including the mask portions is etched to expose the mold structure. The conductive patterns include protrusions. A chemical mechanical polishing process is performed to remove the protrusions of the conductive patterns.

Abstract: Disclosed is a slurry composition for chemical mechanical polishing (CMP) includes, as polishing particles, a complex compound of both fullerenol and alkylammonium hydroxide. The slurry composition, which exhibits excellent polishing properties, may be prepared at low cost in large quantities. Also disclosed is a method of preparing the slurry composition comprising obtaining a mixture of a fullerenol complex compound and unreacted hydrogen peroxide by reacting alkylammonium hydroxide, hydrogen peroxide, and fullerene, removing the unreacted hydrogen peroxide by adding hydrogen peroxide decomposition catalyst particles to the mixture, separating the hydrogen peroxide decomposition catalyst particles from the mixture by filtration, and adding a polishing additive to the mixture.

Abstract: Substrate cleaning equipment includes a substrate holder which supports a substrate, a swing body, a head, a first cleaning liquid supply structure, and a second cleaning liquid supply structure. The swing body moves along a sweep line on a main surface of the substrate. The head is coupled to the swing body and includes a pad attachment surface facing the substrate holder. The first cleaning liquid supply structure is coupled to the swing body and sprays a first cleaning liquid onto the main surface of the substrate. The second cleaning liquid supply structure sprays a second cleaning liquid onto the main surface of the substrate. A buffing pad is attached to the pad attachment surface.