Abstract: A method for transmitting information is disclosed, including: writing at least a portion of the information to at least one multicast Internet Protocol (IP) address field; and transmitting at least a packet according to the at least one multicast IP address field. Even when the wireless network environment is encrypted, information can be transmitted to desired devices in the sniffer mode.

Abstract: A voltage measuring apparatus electrically connected to buck circuits includes the same number of RC circuits as there are buck circuits, an analog/digital (A/D) convertor, a controller, and a display unit. Each RC circuit is configured to be electrically connected in parallel with an inductor of one corresponding buck circuit. The A/D convertor selectively obtains an analog voltage of one of the buck circuits, and converts the analog voltage signal into a digital voltage signal. The controller controls the A/D convertor and receives the digital voltage signal from the A/D convertor. The display unit displays a decimal voltage value based on the digital voltage signal.

Abstract: A speed adjustment circuit for a plurality of fans includes a voltage input terminal, a plurality of speed control modules, and a fan tachometer. Each of the speed control modules includes a fan connector, a speed adjusting unit, and a detector switch unit. The speed adjusting unit includes a switching control unit, a voltage adjusting chip, and a variable resistor. The detector switch unit includes a first switch. The voltage input terminal connects to the input terminal of the voltage adjusting chip through the switching control unit. The output terminal of the voltage adjusting chip connects to the power pin of the fan connector. The adjusting terminal of the voltage adjusting chip connects to ground through the variable resistor, and connects to the output terminal of the voltage adjusting chip through a resistor. The detection pin of the fan connector connects to the fan tachometer through the first switch.

Abstract: A motherboard system includes a PCB, a CPU socket mounted on the PCB, a heat dissipating device, and a number of fastening devices. The CPU socket is configured for receiving a CPU. The heat dissipating device is mounted on the CPU socket for dissipating heat generated by the CPU. The fastening devices extend through the heat dissipating device and the CPU socket and are engaged in the PCB, thereby fastening the heat dissipating device, and the CPU socket to the PCB.

Abstract: A thermal protection circuit includes a temperature detecting circuit, a comparing circuit, and a switching circuit. The temperature detecting circuit senses an internal temperature of the electronic device and outputs a voltage signal decreasing proportionally with the internal temperature of the electronic device increasing. The comparing circuit compares the voltage signal to a high voltage threshold or a low voltage threshold, thereby outputting a corresponding driving signal. The switching circuit turns on/off under the control of the driving signal.

Abstract: A voltage measuring apparatus electrically connected to buck circuits includes the same number of RC circuits as there are buck circuits, an analog/digital (A/D) convertor, a controller, and a display unit. Each RC circuit is configured to be electrically connected in parallel with an inductor of one corresponding buck circuit. The A/D convertor selectively obtains an analog voltage of one of the buck circuits, and converts the analog voltage signal into a digital voltage signal. The controller controls the A/D convertor and receives the digital voltage signal from the A/D convertor. The display unit displays a decimal voltage value based on the digital voltage signal.

Abstract: An over-current protection apparatus includes a first connector connected to a power supply, a second connector connected to a motherboard. A non-inverting input terminal of a comparator receives a voltage from a power supply and compares the received voltage with a preset voltage, when the received voltage is greater than the preset voltage. The comparator outputs a high level signal to control a first electrical switch to be turned on and a second electrical switch to be turned off. A clock pin of a flip-flop receives a high level signal from the second electrical switch, and an output terminal of the flip-flop outputs a low level signal to a third electrical switch, to control the third electrical switch to be turned off. A control pin of a first connector is disconnected to a control pin of a second connector and the power supply does not provide voltages to a motherboard.

Abstract: A heat dissipation apparatus includes a heat sink and a pair of first heat pipes. The heat sink includes a pair of first fin assemblies staggered with a pair of second fin assemblies. The first and second fin assemblies each define a receiving groove therein. The second fin assemblies each further defines an opening communicating with the receiving groove of a corresponding second fin assembly. The first heat pipes each include an evaporation section and a condensation section. A portion of the condensation section of each of the first heat pipes is inserted into the receiving groove of each of the first fin assemblies. The other portion of the condensation section of each of the first heat pipes is received in the receiving groove of each of the second fin assemblies through the opening.

Abstract: A current balance testing system is configured for measuring current flowing in a main board, the main board comprises a load, a power source supplying power to the loads, and a number of inductors connected between the power source and the loads. The current balance testing system includes a data acquiring device and a data processing device. The data acquiring device includes a plurality of input terminals and an output terminal, each input terminal correspondingly is connected to one inductor and configured for measuring a voltage drop across the inductor. The data processing device is connected to the output terminal and stores resistances of the inductors in the data processing device. The data processing device uses the voltage drops and the resistances of the inductors to calculate the current flowing through the inductors to determine whether or not the current flowing between the power source and the load are balanced.

Abstract: A motherboard system includes a PCB, a CPU socket mounted on the PCB, a heat dissipating device, and a number of fastening devices. The CPU socket is configured for receiving a CPU. The heat dissipating device is mounted on the CPU socket for dissipating heat generated by the CPU. The fastening devices extend through the heat dissipating device and the CPU socket and are engaged in the PCB, thereby fastening the heat dissipating device, and the CPU socket to the PCB.

Abstract: An over-current protection apparatus includes a first connector connected to a power supply, a second connector connected to a motherboard. A non-inverting input terminal of a comparator receives a voltage from a power supply and compares the received voltage with a preset voltage, when the received voltage is greater than the preset voltage. The comparator outputs a high level signal to control a first electrical switch to be turned on and a second electrical switch to be turned off. A clock pin of a flip-flop receives a high level signal from the second electrical switch, and an output terminal of the flip-flop outputs a low level signal to a third electrical switch, to control the third electrical switch to be turned off. A control pin of a first connector is disconnected to a control pin of a second connector and the power supply does not provide voltages to a motherboard.

Abstract: A speed adjustment circuit for a plurality of fans includes a voltage input terminal, a plurality of speed control modules, and a fan tachometer. Each of the speed control modules includes a fan connector, a speed adjusting unit, and a detector switch unit. The speed adjusting unit includes a switching control unit, a voltage adjusting chip, and a variable resistor. The detector switch unit includes a first switch. The voltage input terminal connects to the input terminal of the voltage adjusting chip through the switching control unit. The output terminal of the voltage adjusting chip connects to the power pin of the fan connector. The adjusting terminal of the voltage adjusting chip connects to ground through the variable resistor, and connects to the output terminal of the voltage adjusting chip through a resistor. The detection pin of the fan connector connects to the fan tachometer through the first switch.

Abstract: A shredder includes a shredder housing with a top head and a shredder mechanism receptacle. The top head has at least a first slot for receiving articles to be shredded. The shredder mechanism receptacle is connected to the top head for receiving a cutting assembly capable of shredding paper. A safety device is disposed in the shredder housing. The safety device includes a slot guard and gear system for selectively blocking the first slot.

Abstract: A heat dissipation apparatus includes a heat sink and a fan. The heat sink defines a recessed space at a center of a top end thereof, and an engaging groove in an inner circumference of the top end of the heat sink surrounding and communicating with the space. The fan includes a frame and an impeller assembled to the frame. A plurality of legs extends downwardly from the frame. Each of the legs includes a hook at a free end thereof. The hooks of the legs engage in the engaging groove of the heat sink for securely mounting the fan in the recessed space of the heat sink. Heat pipes extend through the heat sink and connect with a base.

Abstract: A heat dissipation apparatus includes a heat sink and a fan. The heat sink includes a plurality of radial first and second fins. The first and second fins each include a main body and an extension arm extending upwardly from the main body. The main bodies and the extension arms cooperatively form a space therebetween for securely receiving the fan therein. Each extension arm defines an engaging groove communicating with the space. A height of the extension arm of each second fin is less than that of the extension arm of each first fin. A fixing recess is defined over the extension arms of the second fins. The fan includes a frame extending downwardly out a plurality of legs and radially out a fixing arm. The legs have hooks engaging in the engaging grooves, and the fixing arm is fixed in the fixing recess.

Abstract: A heat dissipation apparatus includes a heat sink and a heat pipe thermally connecting with the heat sink. The heat sink includes a plurality of radial fins. Each of the fins defines a receiving hole therein, and extends out a flange around the receiving hole. A height of the flange increases outwardly in a direction away from a center of the heat sink. The heat pipe includes an evaporation section and an arcuate condensation section. The condensation section of the heat pipe extends through the receiving hole, and is attached to the flanges of the heat sink.

Abstract: A heat dissipation apparatus includes a heat sink and a fan. The heat sink defines a recessed space at a center of a top end thereof, and an engaging groove in an inner circumference of the top end of the heat sink surrounding and communicating with the space. The fan includes a frame and an impeller assembled to the frame. A plurality of legs extends downwardly from the frame. Each of the legs includes a hook at a free end thereof. The hooks of the legs engage in the engaging groove of the heat sink for securely mounting the fan in the recessed space of the heat sink. Heat pipes extend through the heat sink and connect with a base.

Abstract: A heat dissipation apparatus includes a heat sink and a pair of first heat pipes. The heat sink includes a pair of first fin assemblies staggered with a pair of second fin assemblies. The first and second fin assemblies each define a receiving groove therein. The second fin assemblies each further defines an opening communicating with the receiving groove of a corresponding second fin assembly. The first heat pipes each include an evaporation section and a condensation section. A portion of the condensation section of each of the first heat pipes is inserted into the receiving groove of each of the first fin assemblies. The other portion of the condensation section of each of the first heat pipes is received in the receiving groove of each of the second fin assemblies through the opening.