Heat dissipation device

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FIG. 1 is a perspective view of a heat dissipation device showing our new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof, wherein the features shown in broken lines are for illustrative purposes only and form no part of the claimed design.


The ornamental design for a heat dissipation device, as shown and described.

Referenced Cited
U.S. Patent Documents
D511327 November 8, 2005 Ma et al.
D552564 October 9, 2007 Mochizuki
D561123 February 5, 2008 Mochizuki et al.
D561711 February 12, 2008 Lin
7362573 April 22, 2008 Lu et al.
D573109 July 15, 2008 Mochizuki et al.
20060219386 October 5, 2006 Hsia et al.
Patent History
Patent number: D593511
Type: Grant
Filed: Jul 18, 2008
Date of Patent: Jun 2, 2009
Assignee: Foxconn Technology Co., Ltd. (Tu-Cheng, Taipei Hsien)
Inventors: Hong-Bo Deng (Shenzhen), Di-Qiong Zhao (Shenzhen), Ye Chen (Shenzhen)
Primary Examiner: Selina Sikder
Attorney: Frank R. Niranjan
Application Number: 29/321,527
Current U.S. Class: Heat Sink (D13/179)