Patents by Inventor Bo yun KIM

Bo yun KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200071613
    Abstract: Disclosed is a slurry composition for chemical mechanical polishing (CMP) includes, as polishing particles, a complex compound of both fullerenol and alkylammonium hydroxide. The slurry composition, which exhibits excellent polishing properties, may be prepared at low cost in large quantities. Also disclosed is a method of preparing the slurry composition comprising obtaining a mixture of a fullerenol complex compound and unreacted hydrogen peroxide by reacting alkylammonium hydroxide, hydrogen peroxide, and fullerene, removing the unreacted hydrogen peroxide by adding hydrogen peroxide decomposition catalyst particles to the mixture, separating the hydrogen peroxide decomposition catalyst particles from the mixture by filtration, and adding a polishing additive to the mixture.
    Type: Application
    Filed: July 3, 2019
    Publication date: March 5, 2020
    Inventors: Bo-yun KIM, Kenji Takai, Do-yoon KIM, Sang-kyun KIM, Bo-un YOON
  • Publication number: 20190371861
    Abstract: An image sensor includes a sensor region for receiving light and generating an image data and a pad region adjacent to the sensor region, an insulation layer on the substrate, and a lower transparent electrode on the insulation layer in the sensor region, and an etch stop layer on the insulation layer in the sensor region and pad region. The etch stop layer may include silicon nitride. A height of an uppermost surface of the lower transparent electrode may be substantially equal to a height of an upper surface of the etch stop layer, with respect to the substrate.
    Type: Application
    Filed: February 26, 2019
    Publication date: December 5, 2019
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Dong Chan Kim, Kwan Sik Kim, Bo Yun Kim, Eun Sung Seo, II Young Yoon, Seung Hoon Choi
  • Patent number: 9827592
    Abstract: Provided is an ultrasonic probe that is capable of easily dissipating heat generated therein using porous carbon allotrope foams. The ultrasonic probe includes: a matching layer; a piezoelectric layer disposed on a bottom surface of the matching layer; and a backing layer disposed on a bottom surface of the piezoelectric layer and formed of porous carbon allotrope foams and backing materials.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: November 28, 2017
    Assignee: SAMSUNG MEDISON CO., LTD.
    Inventors: Won Hee Lee, Min Seon Seo, Bo Yun Kim
  • Patent number: 9677002
    Abstract: An etching composition includes about 1 wt % to about 7 wt % of hydrogen peroxide, about 20 wt % to about 80 wt % of phosphoric acid, about 0.001 wt % to about 1 wt % of an amine or amide polymer, 0 wt % to about 55 wt % of sulfuric acid, and about 10 wt % to about 45 wt % of deionized water.
    Type: Grant
    Filed: October 9, 2015
    Date of Patent: June 13, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang Won Bae, Yongsun Ko, Byoungho Kwon, Bo yun Kim, Hongjin Kim, Sungoh Park, Kuntack Lee, Hyosan Lee, Sol Han
  • Publication number: 20160032185
    Abstract: An etching composition includes about 1 wt % to about 7 wt % of hydrogen peroxide, about 20 wt % to about 80 wt % of phosphoric acid, about 0.001 wt % to about 1 wt % of an amine or amide polymer, 0 wt % to about 55 wt % of sulfuric acid, and about 10 wt % to about 45 wt % of deionized water.
    Type: Application
    Filed: October 9, 2015
    Publication date: February 4, 2016
    Inventors: Sang Won BAE, Yongsun KO, Byoungho KWON, Bo yun KIM, Hongjin KIM, Sungoh PARK, Kuntack LEE, Hyosan LEE, Sol HAN
  • Patent number: 9165759
    Abstract: An etching composition includes about 1 wt % to about 7 wt % of hydrogen peroxide, about 20 wt % to about 80 wt % of phosphoric acid, about 0.001 wt % to about 1 wt % of an amine or amide polymer, 0 wt % to about 55 wt % of sulfuric acid, and about 10 wt % to about 45 wt % of deionized water.
    Type: Grant
    Filed: November 21, 2013
    Date of Patent: October 20, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang Won Bae, Yongsun Ko, Byoungho Kwon, Bo yun Kim, Hongjin Kim, Sungoh Park, Kuntack Lee, Hyosan Lee, Sol Han
  • Publication number: 20150061465
    Abstract: Provided is an ultrasonic probe that is capable of easily dissipating heat generated therein using porous carbon allotrope foams. The ultrasonic probe includes: a matching layer; a piezoelectric layer disposed on a bottom surface of the matching layer; and a backing layer disposed on a bottom surface of the piezoelectric layer and formed of porous carbon allotrope foams and backing materials.
    Type: Application
    Filed: August 28, 2014
    Publication date: March 5, 2015
    Inventors: Won Hee LEE, Min Seon SEO, Bo Yun KIM
  • Publication number: 20140141616
    Abstract: An etching composition includes about 1 wt % to about 7 wt % of hydrogen peroxide, about 20 wt % to about 80 wt % of phosphoric acid, about 0.001 wt % to about 1 wt % of an amine or amide polymer, 0 wt % to about 55 wt % of sulfuric acid, and about 10 wt % to about 45 wt % of deionized water.
    Type: Application
    Filed: November 21, 2013
    Publication date: May 22, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang Won BAE, Yongsun KO, Byoungho KWON, Bo yun KIM, Hongjin KIM, Sungoh PARK, Kuntack LEE, Hyosan LEE, Sol HAN