Patents by Inventor Bock Soon Na

Bock Soon Na has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240130638
    Abstract: Disclosed is a mechanochromic array patch that implements, as a color change, a strain applied to a skin surface due to musculoskeletal movement. The mechanochromic array patch may include stretchable mechanochromic color-changing parts, a polymer connection part that connects the mechanochromic color-changing parts, and a water-insoluble support part. The polymer connection part may have a higher elastic modulus compared to the mechanochromic color-changing parts.
    Type: Application
    Filed: October 12, 2023
    Publication date: April 25, 2024
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: JAE JOON KIM, Chan Woo PARK, Seong Hyun KIM, Sujung KIM, Bock Soon NA, Jeho NA, Su Jae LEE
  • Patent number: 11959819
    Abstract: Provided is a strain sensor. The strain sensor according to embodiments of the inventive concept includes a flexible substrate, rigid patterns on the flexible substrate, the rigid patterns including a first pattern and a second pattern spaced apart from the first pattern in a first direction, a first electrode on the first pattern, a second electrode on the second pattern, the second electrode being spaced apart from the first electrode, and a piezoresistive layer connecting the first electrode and the second electrode. Here, each of the rigid patterns may have a stiffness greater than that of the flexible substrate.
    Type: Grant
    Filed: May 11, 2021
    Date of Patent: April 16, 2024
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Su Jae Lee, Seong Hyun Kim, Chan Woo Park, Jae Bon Koo, Bock Soon Na, Ji-Young Oh
  • Patent number: 11789576
    Abstract: Provided is a flexible touch panel.
    Type: Grant
    Filed: September 6, 2022
    Date of Patent: October 17, 2023
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Chan Woo Park, Sang Hoon Cheon, Tae-Youb Kim, Bock Soon Na, Ji-Young Oh, Su Jae Lee
  • Publication number: 20230152930
    Abstract: Provided is a flexible touch panel.
    Type: Application
    Filed: September 6, 2022
    Publication date: May 18, 2023
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Chan Woo PARK, Sang Hoon CHEON, Tae-Youb KIM, Bock Soon NA, Ji-Young OH, Su Jae LEE
  • Publication number: 20230039362
    Abstract: Disclosed is a vibration stimulation device. The vibration stimulation device includes a box having a cavity, vibrators disposed in the cavity; light emitting elements disposed between the vibrators or disposed on the vibrators, an upper vibration layer configured to connect the vibrators and the light emitting elements to edges of the box on the cavity, and bumps disposed on the vibrators.
    Type: Application
    Filed: June 6, 2022
    Publication date: February 9, 2023
    Inventors: Kang-Ho PARK, Jong Tae LIM, Seung Youl KANG, Sujung KIM, Bock Soon NA, Chan Woo PARK
  • Patent number: 11487348
    Abstract: Provided is a pixel circuit. The pixel circuit includes a conversion element forming a voltage of an input level at a first node, a first transistor adjusting the voltage of the first node to a first level in response to a first signal received at a first time interval, a first capacitive element forming a voltage at a second node based on the voltage of the first node, a second transistor adjusting a level of the voltage of the second node to a second level in response to the first signal, a third transistor forming a voltage at a third node, a fourth transistor outputting a current in response to a second signal received in a second time interval, and a. fifth transistor adjusting the voltage of the third node to a third level in response to a third signal received in a third time interval.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: November 1, 2022
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Chunwon Byun, Young-deuk Jeon, Chi-Sun Hwang, Chan-mo Kang, Yun-Jeong Kim, Hye Jin Kim, Seongdeok Ahn, Jeong Ik Lee, Seong Hyun Kim, Bock Soon Na
  • Publication number: 20220149265
    Abstract: Provided is a low frequency vibrating actuator device including an actuator configured to generate a vibration by receiving a voltage, a spring structure disposed on the actuator, and a vibrating mass part disposed on the spring structure. Here, the spring structure includes a first thin-film, a first spacer disposed between the first thin-film and the actuator, and a second spacer disposed between the first thin-film and the vibrating mass part. Also, the first spacer and the second spacer are horizontally offset from each other.
    Type: Application
    Filed: October 4, 2021
    Publication date: May 12, 2022
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Kang-Ho PARK, Jong Tae LIM, Seung Youl KANG, Bock Soon NA, Chan Woo PARK, Wooseup YOUM, Ji-Young OH
  • Publication number: 20210361525
    Abstract: Provided is a vibratory stimulation device including a first substrate, a connection band connected to both sides of the first substrate, and a vibration element array including a plurality of vibration elements provided on the first substrate, wherein each of the vibration elements includes a stand provided on the first substrate, a vibration film provided on the stand and in contact with the stand at an edge, a vibrator provided on an upper or lower surface of the vibration film, and an electrode wire connected to the vibrator, wherein the vibration film includes a material that is more flexible and stretchable than the stand.
    Type: Application
    Filed: May 24, 2021
    Publication date: November 25, 2021
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Kang-Ho PARK, Jong Tae LIM, Seung Youl KANG, Bock Soon NA, Chan Woo PARK, Seongdeok AHN, WOOSEUP YOUM, Ji-Young OH
  • Publication number: 20210356340
    Abstract: Provided is a strain sensor. The strain sensor according to embodiments of the inventive concept includes a flexible substrate, rigid patterns on the flexible substrate, the rigid patterns including a first pattern and a second pattern spaced apart from the first pattern in a first direction, a first electrode on the first pattern, a second electrode on the second pattern, the second electrode being spaced apart from the first electrode, and a piezoresistive layer connecting the first electrode and the second electrode. Here, each of the rigid patterns may have a stiffness greater than that of the flexible substrate.
    Type: Application
    Filed: May 11, 2021
    Publication date: November 18, 2021
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Su Jae LEE, Seong Hyun KIM, Chan Woo PARK, Jae Bon KOO, Bock Soon NA, Ji-Young OH
  • Patent number: 10986727
    Abstract: According to an exemplary embodiment of the present invention, by providing an apparatus for fabricating a stretchable electronic element including a chamber, a plurality of sample portions loaded into the chamber and spaced apart from each other, while the chamber is maintained at atmospheric pressure, and a movable member moving the plurality of sample portions and compressing each of the plurality of sample portions together while the chamber is kept under vacuum, it is possible to fabricate variable stretchable electronic elements.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: April 20, 2021
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Jong Tae Lim, Seung Youl Kang, Jae Bon Koo, Seongdeok Ahn, Jeong Ik Lee, Bock Soon Na, Hyunkoo Lee, Sung Haeng Cho
  • Patent number: 10629744
    Abstract: Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: April 21, 2020
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Kyoung Ik Cho, Jae Bon Koo, Chan Woo Park, Bock Soon Na, Sang Seok Lee, Sang Chul Lim, Soon-Won Jung, Hye Yong Chu
  • Publication number: 20200072665
    Abstract: Provided is a pixel circuit.
    Type: Application
    Filed: August 27, 2019
    Publication date: March 5, 2020
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: CHUNWON BYUN, Young-deuk JEON, Chi-Sun HWANG, Chan-mo KANG, Yun-Jeong KIM, Hye Jin KIM, Seongdeok AHN, JEONG IK LEE, Seong Hyun KIM, Bock Soon NA
  • Publication number: 20190327828
    Abstract: According to an exemplary embodiment of the present invention, by providing an apparatus for fabricating a stretchable electronic element including a chamber, a plurality of sample portions loaded into the chamber and spaced apart from each other, while the chamber is maintained at atmospheric pressure, and a movable member moving the plurality of sample portions and compressing each of the plurality of sample portions together while the chamber is kept under vacuum, it is possible to fabricate variable stretchable electronic elements.
    Type: Application
    Filed: December 14, 2018
    Publication date: October 24, 2019
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Jong Tae LIM, Seung Youl KANG, Jae Bon KOO, Seongdeok AHN, JEONG IK LEE, Bock Soon NA, Hyunkoo LEE, Sung Haeng CHO
  • Publication number: 20180277684
    Abstract: Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.
    Type: Application
    Filed: May 31, 2018
    Publication date: September 27, 2018
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Kyoung Ik CHO, Jae Bon KOO, Chan Woo PARK, Bock Soon NA, Sang Seok LEE, Sang Chul LIM, Soon-Won JUNG, Hye Yong CHU
  • Patent number: 10026844
    Abstract: Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: July 17, 2018
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Kyoung Ik Cho, Jae Bon Koo, Chan Woo Park, Bock Soon Na, Sang Seok Lee, Sang Chul Lim, Soon-Won Jung, Hye Yong Chu
  • Publication number: 20180012861
    Abstract: Provided is a method of manufacturing an electronic apparatus which includes preparing a substrate having a first Young's modulus, disposing a thin film having a second Young's modulus greater than the first Young's modulus on the substrate, disposing an electronic device on the thin film, and disposing a capping layer configured to cover the electronic device on the thin film.
    Type: Application
    Filed: June 23, 2017
    Publication date: January 11, 2018
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Ji-Young OH, Joo Yeon KIM, Jae Bon KOO, Bock Soon NA, Nae-Man PARK, Chan Woo PARK, Sang Seok LEE, Soon Won JUNG, Chi-Sun HWANG, Keunsoo LEE
  • Patent number: 9864251
    Abstract: Provided is a color changeable device which includes a first substrate and a second substrate that are spaced apart from each other, a first transparent electrode disposed on the first substrate, a second transparent electrode disposed on the second substrate, an electrochromic layer disposed between the first transparent electrode and the second transparent electrode, an organic layer disposed between the first transparent electrode and the electrochromic layer. The organic layer may include a hole injection layer or an electron injection layer. The organic layer may further include a hole transport layer or an electron transport layer.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: January 9, 2018
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Ji-Young Oh, Jae Bon Koo, Joo Yeon Kim, Bock Soon Na, Chan Woo Park, Sang Seok Lee, Soon-Won Jung, Seong-Mok Cho, Hye Yong Chu
  • Patent number: 9865559
    Abstract: Provided is a method for manufacturing a stretchable wire, the method including removing a portion of a photoresist layer on a substrate to form a photoresist pattern comprising at least one pattern slit, applying a liquid-phase conductive material on the photoresist pattern to form a liquid-phase conductive structure in the pattern slit, forming a stretchable first insulating layer on the liquid-phase conductive structure, after removing the photoresist pattern, and separating the liquid-phase conductive structure and the first insulating layer from the substrate.
    Type: Grant
    Filed: July 26, 2016
    Date of Patent: January 9, 2018
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Chan Woo Park, Jae Bon Koo, Bock Soon Na, Rae-Man Park, Ji-Young Oh, Sang Seok Lee, Soon-Won Jung
  • Patent number: 9842669
    Abstract: A stretchable wire including a stretchable solid-phase conductive structure; a stretchable insulation layer which surrounds the solid-phase conductive structure; and a liquid-phase conductive material layer disposed between the solid-phase conductive structure and the stretchable insulation layer, and in contact with the solid-phase conductive structure, and a method of fabricating the same.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: December 12, 2017
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Chan Woo Park, Jae Bon Koo, Bock Soon Na, Rae-Man Park, Ji-Young Oh, Sang Seok Lee, Soon-Won Jung
  • Patent number: 9740073
    Abstract: Provided is a complex display device Including a first substrate and an opposed second substrate, a first electrode, an electrochromic layer, a common electrode, an emission part and a second electrode, laminated between the first substrate and the second substrate one by one, and an organic layer disposed between the first electrode and the electrochromic layer, or between the electrochromic layer and the common electrode. The organic layer of the complex display device may include at least one of a hole injection material, a hole transport material and a mixture thereof, or at least one of an electron injection material, an electron transport material or a mixture thereof.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: August 22, 2017
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Ji-Young Oh, Jae Bon Koo, Joo Yeon Kim, Bock Soon Na, Chan Woo Park, Sang Seok Lee, Soon-Won Jung, Hye Yong Chu