Abstract: Provided is a vibratory stimulation device including a first substrate, a connection band connected to both sides of the first substrate, and a vibration element array including a plurality of vibration elements provided on the first substrate, wherein each of the vibration elements includes a stand provided on the first substrate, a vibration film provided on the stand and in contact with the stand at an edge, a vibrator provided on an upper or lower surface of the vibration film, and an electrode wire connected to the vibrator, wherein the vibration film includes a material that is more flexible and stretchable than the stand.

Abstract: Disclosed is a mechanochromic array patch that implements, as a color change, a strain applied to a skin surface due to musculoskeletal movement. The mechanochromic array patch may include stretchable mechanochromic color-changing parts, a polymer connection part that connects the mechanochromic color-changing parts, and a water-insoluble support part. The polymer connection part may have a higher elastic modulus compared to the mechanochromic color-changing parts.

Abstract: Disclosed is a mechanochromic array patch that implements, as a color change, a strain applied to a skin surface due to musculoskeletal movement. The mechanochromic array patch may include stretchable mechanochromic color-changing parts, a polymer connection part that connects the mechanochromic color-changing parts, and a water-insoluble support part. The polymer connection part may have a higher elastic modulus compared to the mechanochromic color-changing parts.

Abstract: Provided is a strain sensor. The strain sensor according to embodiments of the inventive concept includes a flexible substrate, rigid patterns on the flexible substrate, the rigid patterns including a first pattern and a second pattern spaced apart from the first pattern in a first direction, a first electrode on the first pattern, a second electrode on the second pattern, the second electrode being spaced apart from the first electrode, and a piezoresistive layer connecting the first electrode and the second electrode. Here, each of the rigid patterns may have a stiffness greater than that of the flexible substrate.

Abstract: Provided is a flexible touch panel.

Abstract: Provided is a flexible touch panel.

Abstract: Disclosed is a vibration stimulation device. The vibration stimulation device includes a box having a cavity, vibrators disposed in the cavity; light emitting elements disposed between the vibrators or disposed on the vibrators, an upper vibration layer configured to connect the vibrators and the light emitting elements to edges of the box on the cavity, and bumps disposed on the vibrators.

Abstract: Provided is a pixel circuit. The pixel circuit includes a conversion element forming a voltage of an input level at a first node, a first transistor adjusting the voltage of the first node to a first level in response to a first signal received at a first time interval, a first capacitive element forming a voltage at a second node based on the voltage of the first node, a second transistor adjusting a level of the voltage of the second node to a second level in response to the first signal, a third transistor forming a voltage at a third node, a fourth transistor outputting a current in response to a second signal received in a second time interval, and a. fifth transistor adjusting the voltage of the third node to a third level in response to a third signal received in a third time interval.

Abstract: Provided is a low frequency vibrating actuator device including an actuator configured to generate a vibration by receiving a voltage, a spring structure disposed on the actuator, and a vibrating mass part disposed on the spring structure. Here, the spring structure includes a first thin-film, a first spacer disposed between the first thin-film and the actuator, and a second spacer disposed between the first thin-film and the vibrating mass part. Also, the first spacer and the second spacer are horizontally offset from each other.

Abstract: Provided is a vibratory stimulation device including a first substrate, a connection band connected to both sides of the first substrate, and a vibration element array including a plurality of vibration elements provided on the first substrate, wherein each of the vibration elements includes a stand provided on the first substrate, a vibration film provided on the stand and in contact with the stand at an edge, a vibrator provided on an upper or lower surface of the vibration film, and an electrode wire connected to the vibrator, wherein the vibration film includes a material that is more flexible and stretchable than the stand.

Abstract: Provided is a strain sensor. The strain sensor according to embodiments of the inventive concept includes a flexible substrate, rigid patterns on the flexible substrate, the rigid patterns including a first pattern and a second pattern spaced apart from the first pattern in a first direction, a first electrode on the first pattern, a second electrode on the second pattern, the second electrode being spaced apart from the first electrode, and a piezoresistive layer connecting the first electrode and the second electrode. Here, each of the rigid patterns may have a stiffness greater than that of the flexible substrate.

Abstract: According to an exemplary embodiment of the present invention, by providing an apparatus for fabricating a stretchable electronic element including a chamber, a plurality of sample portions loaded into the chamber and spaced apart from each other, while the chamber is maintained at atmospheric pressure, and a movable member moving the plurality of sample portions and compressing each of the plurality of sample portions together while the chamber is kept under vacuum, it is possible to fabricate variable stretchable electronic elements.

Abstract: Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.

Abstract: Provided is a pixel circuit.

Abstract: According to an exemplary embodiment of the present invention, by providing an apparatus for fabricating a stretchable electronic element including a chamber, a plurality of sample portions loaded into the chamber and spaced apart from each other, while the chamber is maintained at atmospheric pressure, and a movable member moving the plurality of sample portions and compressing each of the plurality of sample portions together while the chamber is kept under vacuum, it is possible to fabricate variable stretchable electronic elements.

Abstract: Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.

Abstract: Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.

Abstract: Provided is a method of manufacturing an electronic apparatus which includes preparing a substrate having a first Young's modulus, disposing a thin film having a second Young's modulus greater than the first Young's modulus on the substrate, disposing an electronic device on the thin film, and disposing a capping layer configured to cover the electronic device on the thin film.

Abstract: Provided is a method for manufacturing a stretchable wire, the method including removing a portion of a photoresist layer on a substrate to form a photoresist pattern comprising at least one pattern slit, applying a liquid-phase conductive material on the photoresist pattern to form a liquid-phase conductive structure in the pattern slit, forming a stretchable first insulating layer on the liquid-phase conductive structure, after removing the photoresist pattern, and separating the liquid-phase conductive structure and the first insulating layer from the substrate.

Abstract: Provided is a color changeable device which includes a first substrate and a second substrate that are spaced apart from each other, a first transparent electrode disposed on the first substrate, a second transparent electrode disposed on the second substrate, an electrochromic layer disposed between the first transparent electrode and the second transparent electrode, an organic layer disposed between the first transparent electrode and the electrochromic layer. The organic layer may include a hole injection layer or an electron injection layer. The organic layer may further include a hole transport layer or an electron transport layer.