Abstract: Disclosed are a semiconductor package and a method of making the same. In the semiconductor package, a substrate and a semiconductor die are covered with and encapsulated by vertically pressing thermosetting resin having fluidity in a predetermined temperature range and denaturalizing itself in gel. Thus, it is possible to reduce a thickness of the semiconductor package and prevent wire sweeping.

Abstract: In accordance with the present invention, there is provided multiple embodiments of a reduced profile stackable semiconductor package. The semiconductor package comprises a substrate having at least one semiconductor die attached thereto. The semiconductor die is also electrically connected to the substrate by a plurality of conductive wires. A package body defining opposed top and bottom surfaces and a side surface at least partially encapsulates the substrate, the conductive wires and the semiconductor die. The package body is formed such that at least portions of the conductive wires are exposed in the top surface thereof. The package body may include a groove formed in the top surface thereof, with at least portions of the conductive wires being exposed in the groove.

Abstract: Provided is an adhesive composition for a semiconductor device. For example, the adhesive composition comprises a binder resin and a silicon carbide filler. The silicon carbide filler has relatively high thermal conductivity and a relatively low coefficient of thermal expansion (CTE). Accordingly, the adhesive composition containing the silicon carbide filler exhibits improved heat dissipation performance and electrical performance due to high thermal conductivity and shows inhibition of delamination or cracking of semiconductor devices due to low CTE. The silicon carbide has high thermal conductivity, but is electrically non-conductive. Therefore, an electrically conductive adhesive can be obtained by additional incorporation of a silver (Ag) filler into the binder resin.

Abstract: An apparatus and a method manage a neighbor base station list (NBL) in a distributed wireless ad-hoc network. Information of neighbor BSs is collected at the BS using a surrounding environment detection function. Neighbor BSs that satisfy a certain condition are determined, among the neighbor BSs from which the information is collected. And the NBL is generated based on the determined neighbor BSs.

Abstract: In accordance with the present invention, there is provided multiple embodiments of a semiconductor package including one or more semiconductor dies which are electrically connected to an underlying substrate through the use of a conductive pattern which is at least partially embedded in a patterning layer of the package. In a basic embodiment of the present invention, the semiconductor package comprises a substrate having a conductive pattern disposed thereon. Electrically connected to the conductive pattern of the substrate is at least one semiconductor die. The semiconductor die and the substrate are at least partially encapsulated by a patterning layer. Embedded in the patterning layer is a wiring pattern which electrically connects the semiconductor die to the conductive pattern. A portion of the wiring pattern is exposed in the patterning layer.

Abstract: A wire bonder has a capillary through which a wire passes. A discharge tip is positioned near a bottom section of the capillary and provides a flame to a distal end of the wire. A gas diffuser is positioned beside the capillary to diffuse a heated gas to the distal end of the wire.

Abstract: In accordance with the present invention, there is provided multiple embodiments of a semiconductor package including two or more semiconductor dies which are electrically connected to an underlying substrate through the use of conductive wires, some of which may be fully or partially encapsulated by an adhesive or insulating layer of the package. In a basic embodiment of the present invention, the semiconductor package comprises a substrate having a conductive pattern disposed thereon. Electrically connected to the conductive pattern of the substrate are first and second semiconductor dies. The first semiconductor die and a portion of the substrate are covered by an adhesive layer. The second semiconductor die, the adhesive layer and a portion of the substrate are in turn covered by a package body of the semiconductor package.

Abstract: In a power saving device and power saving method for a mobile access point, the power saving device sets a minimum power saving interval among power saving intervals of at least one first station coupled to the mobile access point as a power saving interval of the mobile access point. The power saving device prevents a power supply voltage from being supplied to at least one first wireless interface wirelessly communicating with the first station(s) during the power saving interval of the mobile access point when a minimum remaining power saving interval of at least one second station working in a power saving mode is longer than the power saving interval of the mobile access point.

Abstract: In accordance with the present invention, there is provided multiple embodiments of a reduced size stackable semiconductor package. In a basic embodiment of the present invention, the semiconductor package comprises a bulk layer having at least one first bond pad formed therein. At least one active layer is formed on the bulk layer and electrically coupled to the first bond pad. Additionally, at least one second bond pad is formed on the active layer and is electrically coupled thereto. A protection layer is formed on that surface of the active layer having the second bond pad formed thereon, the protection layer also partially encapsulating the second bond pad. In other embodiments of the present invention, the above-described semiconductor package is provided in a stacked arrangement and in a prescribed pattern of electrical communication with one or more additional, identically configured semiconductor packages.

Abstract: An apparatus and method for supporting Peer to Peer (P2P) communication in a broadband wireless communication system are provided. A P2P zone within a frame used for the P2P communication includes at least one channel, each channel includes a broadcasting zone and a contention zone, and a P2P-mode transmit Mobile Station (MS) transmits a reference signal through a broadcasting zone of a channel to which itself belongs. The method MS includes determining an interference sum for each channel within the P2P zone, comparing the determined interference sums with each other, selecting a channel having the least interference sum, and transmitting information regarding the selected channel to a Base Station (BS).

Abstract: In accordance with the present invention, there is provided multiple embodiments of a semiconductor package including two or more semiconductor dies which are electrically connected to an underlying substrate through the use of conductive wires, some of which may be fully or partially encapsulated by an adhesive or insulating layer of the package. In a basic embodiment of the present invention, the semiconductor package comprises a substrate having a conductive pattern disposed thereon. Electrically connected to the conductive pattern of the substrate are first and second semiconductor dies. The first semiconductor die and a portion of the substrate are covered by an adhesive layer. The second semiconductor die, the adhesive layer and a portion of the substrate are in turn covered by a package body of the semiconductor package.

Abstract: Disclosed are a semiconductor package and a method of making the same. In the semiconductor package, a substrate and a semiconductor die are covered with and encapsulated by vertically pressing thermosetting resin having fluidity in a predetermined temperature range and denaturalizing itself in gel. Thus, it is possible to reduce a thickness of the semiconductor package and prevent wire sweeping.

Abstract: In a method of reworking a substrate, an organic anti-reflection coating (ARC) layer is formed on the substrate having an amorphous carbon pattern. A photoresist pattern is formed on the organic ARC layer. The photoresist pattern is entirely exposed when the photoresist pattern has a selected level of defects, and then the photoresist pattern is removed by a developing process. The substrate may be reworked without damaging the organic ARC layer, and the amorphous carbon pattern may include an alignment key and/or an overlay key.

Abstract: A semiconductor device has a substrate having first, second, and third surfaces. An electrically conductive pattern is formed on the first surface. A semiconductor die has a bond pad formed on a first surface thereof. A second surface of the semiconductor die is coupled to the first surface of the substrate. A first connection member electrically couples the bond pad and the electrically conductive pattern. A first land has a first, second, and third surfaces. The second surface of the first land is coupled to the first electrically conductive pattern. A first encapsulant encapsulates the first semiconductor die, the first connection member, and the first land such that the first surface of the first land is exposed.

Abstract: In a method and system for supporting resource reservation protocol (RSVP) in an Internet protocol version 4 (IPv4)/Internet protocol version 6 (IPv6) hybrid network, the method includes the steps of: transmitting, from a dual stack host in an IPv6 network, an end-to-end quality of service (QoS) session establishment request message to an IPv4 server through a dual stack transition mechanism tunnel end point (DSTM TEP); transmitting, from the IPv4 server, an end-to-end path message to the dual stack host through the DSTM TEP; transmitting, from the DSTM TEP to the dual stack host, a path message for reserving resources in the IPv6 network; transmitting, from the dual stack host, an end-to-end resource reservation request message to the IPv4 server through the DSTM TEP, and making a resource reservation in an IPv4 network; and transmitting, from the dual stack host to the DSTM TEP, a resource reservation request message, and making a resource reservation in the IPv6 network.

Abstract: In a power saving device and power saving method for a mobile access point, the power saving device sets a minimum power saving interval among power saving intervals of at least one first station coupled to the mobile access point as a power saving interval of the mobile access point. The power saving device prevents a power supply voltage from being supplied to at least one first wireless interface wirelessly communicating with the first station(s) during the power saving interval of the mobile access point when a minimum remaining power saving interval of at least one second station working in a power saving mode is longer than the power saving interval of the mobile access point.

Abstract: Disclosed are a wafer level stacked package and its manufacturing method. As one example, in such a wafer level stacked package, a first semiconductor die is electrically connected to an upper surface of a substrate and a second semiconductor die is electrically connected to a lower surface of the substrate. That is, with respect to one substrate, semiconductor dies can be stacked on upper and lower surfaces of the substrate. Also, underfill is formed between the respective semiconductor dies and the substrate, thereby enhancing bonding forces between the respective semiconductor dies and the substrate. In addition to stacking the semiconductor dies, packages can be stacked with each other. That is, it is possible to stack a plurality of completed wafer level packages with each other in an up-and-down direction.

Abstract: The present invention provides a method of predicting a food-drug interaction in vivo, in the case of an orally administered drug interactive with digestive enzymes in the gastrointestinal tract, by measuring the activity of the drug to the digestive enzymes in vitro, which is based on the fact that the ingestion of foods causes the absorption of drug in vivo to decrease due to the above interaction between a drug and digestive enzymes. The present invention further provides methods of minimizing the change of absorption in vivo caused by the ingestion of foods by reducing the action of digestive enzymes, for example, introduction of prodrugs, modification of the chemical structure of drug, design of drug formulation, etc.

Abstract: The present invention provides a novel process for preparing a compound represented by the above formula 7, which is an important intermediate for an oral thrombin inhibitor, by one-pot reaction. In accordance with the present invention, the above intermediate for the thrombin inhibitor may be obtained in a high yield.

Abstract: The present invention relates to crystalline forms of (2S)-N-5-[amino(imino)methyl]-2-thienyl-methyl-1-(2R)-2-[(carboxymethyl)amino]-3,3-diphenylpropanoyl-2-pyrrolidinecarboxamide nH2O.