Abstract: A method and a device for coupling a PCB sheet are disclosed. If a defective PCB is found after the manufacture of continuously arranged circuit patterns, then the defective PCB sheet portion is removed to replace it with a new PCB sheet portion. That is, a defective circuit pattern sheet 2? is removed from continuously arranged circuit patterns of a first PCB sheet 4a. After removal of the defective circuit pattern sheet 2?, the first PCB sheet 4a is position-located by means of a position locating means 12. Then the space which is formed by removing the defective circuit pattern sheet 2? is filled with a second PCB sheet 4b on which a good quality circuit pattern 2b is printed. Then the first PCB sheet 4a and the second PCB sheet 4b are coupled together by using an adhesive means 14.

Abstract: The present invention relates to a children's car that moves forward with a simple and easy operation with particular care taken of the safety of the child riding the car. A steering block which can be steered with a steering wheel and a steering column is provided at the front of the car body. Drive wheels having a ratchet wheel are provided on opposed sides of the steering block. Auxiliary wheels are provided at the front and the rear of the steering block to stably support the car body. As a child sits on or in the car and turns the steering wheel in alternating directions, the right and left drive wheels rotate in a forward direction. A pawl linked to the steering block engages the ratchet wheels to prevent inverse rotation of the drive wheels, causing the car to proceed ahead in a zig-zag pattern.

Abstract: A method and a device for coupling a PCB sheet are disclosed. If a defective PCB is found after the manufacture of continuously arranged circuit patterns, then the defective PCB sheet portion is removed to replace it with a new PCB sheet portion. That is, a defective circuit pattern sheet 2? is removed from continuously arranged circuit patterns of a first PCB sheet 4a. After removal of the defective circuit pattern sheet 2?, the first PCB sheet 4a is position-located by means of a position locating means 12. Then the space which is formed by removing the defective circuit pattern sheet 2? is filled with a second PCB sheet 4b on which a good quality circuit pattern 2b is printed. Then the first PCB sheet 4a and the second PCB sheet 4b are coupled together by using an adhesive means 14.

Abstract: Disclosed is a design method for plating of a printed circuit board (PCB) strip, in which a main plating line is optionally formed on a component side, a solder side, or an inner layer of the PCB strip by modifying a sub-plating line of the PCB strip used to manufacture a semiconductor chip package, and a method of manufacturing the semiconductor chip package using the same. Therefore, an excellent semiconductor chip package is manufactured without a short when the PCB strip is cut using a sawing machine because misalignment of main plating lines of the solder side and the component side of the PCB strip is avoided, and an interval between PCB units is reduced to desirably increase the number of PCB units in the PCB strip without the short when the PCB strip is cut.

Abstract: A method and a device for coupling a PCB sheet are disclosed. If a defective PCB is found after the manufacture of continuously arranged circuit patterns, then the defective PCB sheet portion is removed to replace it with a new PCB sheet portion. That is, a defective circuit pattern sheet 2? is removed from continuously arranged circuit patterns of a first PCB sheet 4a. After removal of the defective circuit pattern sheet 2?, the first PCB sheet 4a is position-located by means of a position locating means 12. Then the space which is formed by removing the defective circuit pattern sheet 2? is filled with a second PCB sheet 4b on which a good quality circuit pattern 2b is printed. Then the first PCB sheet 4a and the second PCB sheet 4b are coupled together by using an adhesive means 14.

Abstract: Disclosed herein is a via structure that minimizes high frequency loss. A PCB or an IC package of the present invention includes an insulation layer, a plurality of circuit layers, and one or more vias obliquely formed with respect to the circuit layers and constructed to have obtuse angles with respect to the directions of signal and power transmission.

Abstract: Disclosed is a design method for plating of a printed circuit board (PCB) strip, in which a main plating line is optionally formed on a component side, a solder side, or an inner layer of the PCB strip by modifying a sub-plating line of the PCB strip used to manufacture a semiconductor chip package, and a method of manufacturing the semiconductor chip package using the same. Therefore, an excellent semiconductor chip package is manufactured without a short when the PCB strip is cut using a sawing machine because misalignment of main plating lines of the solder side and the component side of the PCB strip is avoided, and an interval between PCB units is reduced to desirably increase the number of PCB units in the PCB strip without the short when the PCB strip is cut.

Abstract: In a method for coupling a PCB sheet, if a defective PCB is found after the manufacture of continuously arranged circuit patterns, then the defective PCB sheet portion is removed to replace it with a new PCB sheet portion. That is, a defective circuit pattern sheet is removed from continuously arranged circuit patterns of a first PCB sheet. After removal of the defective circuit pattern sheet, the first PCB sheet is position-located by a position locator. Then, the space which is formed by removing, the defective circuit pattern sheet is filled with a second PCB sheet on which a good quality circuit pattern is printed. Then, the first PCB sheet and the second PCB sheet are coupled together by using an adhesive.

Abstract: A method and a device for coupling a PCB sheet are disclosed. If a defective PCB is found after the manufacture of continuously arranged circuit patterns, then the defective PCB sheet portion is removed to replace it with a new PCB sheet portion. That is, a defective circuit pattern sheet 2′ is removed from continuously arranged circuit patterns of a first PCB sheet 4a. After removal of the defective circuit pattern sheet 2′, the first PCB sheet 4a is position-located by means of a position locating means 12. Then the space which is formed by removing the defective circuit pattern sheet 2′ is filled with a second PCB sheet 4b on which a good quality circuit pattern 2b is printed. Then the first PCB sheet 4a and the second PCB sheet 4b are coupled together by using an adhesive means 14.

Abstract: An assembling type unit track member for toy vehicles is disclosed, which can be assembled into an endless running track for toy vehicles. The assembling type unit track member for toy vehicles consists of a U shaped track member. The U shaped track member includes a bottom plate 1a and a protuberance 2 and a slot 2a formed at a center of the bottom plate 1a, for being assembled to other track members. A pair of trapezoidal coupling piece 3 and a pair of trapezoidal recesses 3a are formed on the bottom plate 1a and at both sides of the protuberance 2 and the slot 2a. A pair of pillar shaped walls 4 stand at both ends of the bottom plate 1a, and a projection 4a and a channel 4b are formed on each of the pillar shaped walls 4, for being coupled to other track members. The assembling type unit track member can be produced by a single die, and therefore, the production cost can be curtailed.

Abstract: A toy automobile is disclosed, in which when the toy automobile runs through a curved path, a roller of a bumper of the automobile is pushed back by the wall of the track, so that the toy automobile can run through the curved path by turning the front wheels to left or right, thereby preventing the automobile from being detached from the track, or from being overturned. Universal joints 15 are respectively formed on ends of the front shaft 5 to be connected to the front wheels. Shaft retainers 16 of the front wheels are respectively supported by supporting plates 17 of the automobile body 1 by means of king pins 18. A bumper 20 is installed on a front end of the automobile body 1 by utilizing a guide slot 21, a supporting pin 22 and a spring 23 so as to make the bumper 20 turnable to left and right within the limits of the guide slot 21. A pair of steering bars 24 are respectively connected to arms 26 of the shaft retainers 16 of the front wheels.