Patents by Inventor Bongkyu MIN

Bongkyu MIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12274040
    Abstract: An example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board.
    Type: Grant
    Filed: November 20, 2023
    Date of Patent: April 8, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyelim Yun, Bongkyu Min, Dohoon Kim, Taewoo Kim, Jinyong Park, Jungje Bang, Hyeongju Lee
  • Publication number: 20240422954
    Abstract: An electronic device is provided. The electronic device includes a first printed circuit board (PCB) including a main hole, a second PCB inserted into the main hole and enclosed by the first PCB, a bridge PCB configured to connect the first PCB and the second PCB and disposed so as to overlap the first PCB and the second PCB, the bridge PCB including a bridge hole, an application processor disposed on the second PCB, inserted into the bridge hole, and enclosed by the bridge PCB, and a main shield connected to the bridge PCB and configured to cover the application processor.
    Type: Application
    Filed: August 26, 2024
    Publication date: December 19, 2024
    Inventors: Bongkyu MIN, Taewoo KIM, Jinyong PARK, Hyelim YUN, Hyeongju LEE
  • Publication number: 20240292571
    Abstract: An electronic device is provided. The electronic device includes a base plate, a first component disposed on the base plate, a second component which is disposed on the base plate and provided at a position spaced apart from the first component, an interposer which is connected to the base plate and surrounds the first component and the second component, a cover plate including a cover plate body which is connected to the interposer and covers the first component and the second component, and a cover hole which is formed to penetrate the cover plate body, and a heat dissipation plate including a heat dissipation plate body which is disposed on the cover plate body and faces the first component and the second component, a heat dissipation hole which is formed to penetrate the heat dissipation plate body and communicates with the cover hole, and a flow guide which is formed on the heat dissipation plate body and guides the flow of a thermal interface material.
    Type: Application
    Filed: May 8, 2024
    Publication date: August 29, 2024
    Inventors: Bongkyu MIN, Taewoo KIM, Jinyong PARK, Hyelim YUN, Hyeongju LEE, Jiseon HAN
  • Patent number: 12022614
    Abstract: The disclosure relates to an electronic device including an interposer. The interposer includes a substrate and a plurality of connecting structures disposed on the substrate and electrically connecting a first circuit board and a second circuit board disposed in the electronic device. The plurality of connecting structures includes a plurality of via holes formed in the substrate, a plurality of conductive members disposed in the plurality of via holes, an insulating member disposed between the plurality of conductive members, and a plurality of pads disposed on the outer periphery of the plurality of conductive members. The plurality of conductive members may be separately disposed on the substrate to electrically connect with the first and second circuit boards.
    Type: Grant
    Filed: September 28, 2021
    Date of Patent: June 25, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Bongkyu Min, Taewoo Kim, Jinyong Park, Hyelim Yun, Hyeongju Lee, Sanghoon Park, Jiseon Han
  • Publication number: 20240196517
    Abstract: Disclosed is an electronic device. The electronic device includes: a housing, a first board and a second board disposed in an interior of the housing, and an interposer electrically connecting the first board and the second board, the interposer includes a first part that defines an outer surface thereof, and a second part that defines an inner surface thereof, vias included in the first part are all ground vias and are spaced apart from each other by a first interval, and the vias included in the second part include signal vias, and ground vias, the number of which is less than that of the signal vias, and may be spaced apart from each other by a second interval that is larger than or equal to the first interval.
    Type: Application
    Filed: February 23, 2024
    Publication date: June 13, 2024
    Inventors: Youngsun JO, Dohoon KIM, Sangyong KIM, Bongkyu MIN, Seoyoung PARK, Yunoh CHI
  • Publication number: 20240107726
    Abstract: An example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 28, 2024
    Inventors: Hyelim YUN, Bongkyu MIN, Dohoon KIM, Taewoo KIM, Jinyong PARK, Jungje BANG, Hyeongju LEE
  • Patent number: 11825639
    Abstract: An example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board.
    Type: Grant
    Filed: March 14, 2022
    Date of Patent: November 21, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyelim Yun, Bongkyu Min, Dohoon Kim, Taewoo Kim, Jinyong Park, Jungje Bang, Hyeongju Lee
  • Patent number: 11812555
    Abstract: According to an embodiment of the disclosure, an electronic device comprises a first printed circuit board including a first electrical terminal exposed on one face of a first area, a second electrical terminal exposed on the one face of a second area and insulated from the first electrical terminal, and a first ground terminal exposed on the one face of a third area formed between the first area and the second area, the third area having a width narrower than a width of the first area or the width of the second area; and a second printed circuit board including a third electrical terminal exposed on one face of a fourth area, a fourth electrical terminal exposed on the one face of a fifth area and electrically connected to the third electrical terminal, and a second ground terminal exposed on the one face of a sixth area located between the fourth area and the fifth area, wherein the second printed circuit board is disposed on the first printed circuit board to overlap the third area, the first electrical te
    Type: Grant
    Filed: April 12, 2022
    Date of Patent: November 7, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jinyong Park, Taewoo Kim, Hyeongju Lee, Bongkyu Min, Jungsik Park, Hyelim Yun
  • Patent number: 11675392
    Abstract: An electronic device is provided. The electronic device includes a rollable display. The electronic device may include a main bracket configured to support the first portion of the rollable display, a roller member disposed in the first direction from the main bracket and arranged in a third direction perpendicular to the first direction, at least one folding support member disposed between the main bracket and the roller member and configured to support the second portion of the rollable display, a circuit board disposed to overlap at least a portion of the main bracket, at least one electronic component disposed adjacent to the roller member, and a FPCB configured to electrically connecting the main circuit board and the electronic component, wherein the FPCB is disposed to pass through the folding support member and extends from a portion of the circuit board to a portion of the electronic component.
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: June 13, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jinyong Park, Dongku Kang, Jichul Kim, Bongkyu Min, Baekeun Cho, Chihyun Cho, Hyuncheol Jin
  • Publication number: 20220240384
    Abstract: According to an embodiment of the disclosure, an electronic device comprises a first printed circuit board including a first electrical terminal exposed on one face of a first area, a second electrical terminal exposed on the one face of a second area and insulated from the first electrical terminal, and a first ground terminal exposed on the one face of a third area formed between the first area and the second area, the third area having a width narrower than a width of the first area or the width of the second area; and a second printed circuit board including a third electrical terminal exposed on one face of a fourth area, a fourth electrical terminal exposed on the one face of a fifth area and electrically connected to the third electrical terminal, and a second ground terminal exposed on the one face of a sixth area located between the fourth area and the fifth area, wherein the second printed circuit board is disposed on the first printed circuit board to overlap the third area, the first electrical te
    Type: Application
    Filed: April 12, 2022
    Publication date: July 28, 2022
    Inventors: Jinyong PARK, Taewoo KIM, Hyeongju LEE, Bongkyu MIN, Jungsik PARK, Hyelim YUN
  • Patent number: 11388277
    Abstract: An interposer and an electronic device including an interposer are provided. The interposer includes a multi-conductive member. The multi-conductive member includes an insulation member, a first conductive member that is disposed inside the insulation member and electrically transmits a designated signal or a designated power; and a ground member that surrounds the insulation member.
    Type: Grant
    Filed: August 5, 2020
    Date of Patent: July 12, 2022
    Inventors: Taewoo Kim, Dui Kang, Bongkyu Min, Bongchoon Park, Sanghoon Park, Jinyong Park, Hyelim Yun, Hyeongju Lee, Younoh Chi
  • Publication number: 20220210957
    Abstract: An example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board.
    Type: Application
    Filed: March 14, 2022
    Publication date: June 30, 2022
    Inventors: Hyelim YUN, Bongkyu MIN, Dohoon KIM, Taewoo KIM, Jinyong PARK, Jungje BANG, Hyeongju LEE
  • Publication number: 20220171434
    Abstract: An electronic device is provided. The electronic device includes a rollable display. The electronic device may include a main bracket configured to support the first portion of the rollable display, a roller member disposed in the first direction from the main bracket and arranged in a third direction perpendicular to the first direction, at least one folding support member disposed between the main bracket and the roller member and configured to support the second portion of the rollable display, a circuit board disposed to overlap at least a portion of the main bracket, at least one electronic component disposed adjacent to the roller member, and a FPCB configured to electrically connecting the main circuit board and the electronic component, wherein the FPCB is disposed to pass through the folding support member and extends from a portion of the circuit board to a portion of the electronic component.
    Type: Application
    Filed: December 29, 2021
    Publication date: June 2, 2022
    Inventors: Jinyong PARK, Dongku KANG, Jichul KIM, Bongkyu MIN, Baekeun CHO, Chihyun CHO, Hyuncheol JIN
  • Patent number: 11330716
    Abstract: According to an embodiment of the disclosure, an electronic device comprises a first printed circuit board including a first electrical terminal exposed on one face of a first area, a second electrical terminal exposed on the one face of a second area and insulated from the first electrical terminal, and a first ground terminal exposed on the one face of a third area formed between the first area and the second area, the third area having a width narrower than a width of the first area or the width of the second area; and a second printed circuit board including a third electrical terminal exposed on one face of a fourth area, a fourth electrical terminal exposed on the one face of a fifth area and electrically connected to the third electrical terminal, and a second ground terminal exposed on the one face of a sixth area located between the fourth area and the fifth area, wherein the second printed circuit board is disposed on the first printed circuit board to overlap the third area, the first electrical te
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: May 10, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jinyong Park, Taewoo Kim, Hyeongju Lee, Bongkyu Min, Jungsik Park, Hyelim Yun
  • Publication number: 20220104356
    Abstract: The disclosure relates to an electronic device including an interposer. The interposer includes a substrate and a plurality of connecting structures disposed on the substrate and electrically connecting a first circuit board and a second circuit board disposed in the electronic device. The plurality of connecting structures includes a plurality of via holes formed in the substrate, a plurality of conductive members disposed in the plurality of via holes, an insulating member disposed between the plurality of conductive members, and a plurality of pads disposed on the outer periphery of the plurality of conductive members. The plurality of conductive members may be separately disposed on the substrate to electrically connect with the first and second circuit boards.
    Type: Application
    Filed: September 28, 2021
    Publication date: March 31, 2022
    Inventors: Bongkyu MIN, Taewoo KIM, Jinyong PARK, Hyelim YUN, Hyeongju LEE, Sanghoon PARK, Jiseon HAN
  • Patent number: 11277949
    Abstract: Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board.
    Type: Grant
    Filed: July 6, 2020
    Date of Patent: March 15, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyelim Yun, Bongkyu Min, Dohoon Kim, Taewoo Kim, Jinyong Park, Jungje Bang, Hyeongju Lee
  • Publication number: 20210112659
    Abstract: According to an embodiment of the disclosure, an electronic device comprises a first printed circuit board including a first electrical terminal exposed on one face of a first area, a second electrical terminal exposed on the one face of a second area and insulated from the first electrical terminal, and a first ground terminal exposed on the one face of a third area formed between the first area and the second area, the third area having a width narrower than a width of the first area or the width of the second area; and a second printed circuit board including a third electrical terminal exposed on one face of a fourth area, a fourth electrical terminal exposed on the one face of a fifth area and electrically connected to the third electrical terminal, and a second ground terminal exposed on the one face of a sixth area located between the fourth area and the fifth area, wherein the second printed circuit board is disposed on the first printed circuit board to overlap the third area, the first electrical te
    Type: Application
    Filed: December 23, 2020
    Publication date: April 15, 2021
    Inventors: Jinyong PARK, Taewoo KIM, Hyeongju LEE, Bongkyu MIN, Jungsik PARK, Hyelim YUN
  • Publication number: 20210099560
    Abstract: An interposer and an electronic device including an interposer are provided. The interposer includes a multi-conductive member. The multi-conductive member includes an insulation member, a first conductive member that is disposed inside the insulation member and electrically transmits a designated signal or a designated power; and a ground member that surrounds the insulation member.
    Type: Application
    Filed: August 5, 2020
    Publication date: April 1, 2021
    Inventors: Taewoo KIM, Dui KANG, Bongkyu MIN, Bongchoon PARK, Sanghoon PARK, Jinyong PARK, Hyelim YUN, Hyeongju LEE, Younoh CHI
  • Publication number: 20200337188
    Abstract: Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board.
    Type: Application
    Filed: July 6, 2020
    Publication date: October 22, 2020
    Inventors: Hyelim YUN, Bongkyu MIN, Dohoon KIM, Taewoo KIM, Jinyong PARK, Jungje BANG, Hyeongju LEE
  • Patent number: 10709043
    Abstract: Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: July 7, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyelim Yun, Bongkyu Min, Dohoon Kim, Taewoo Kim, Jinyong Park, Jungje Bang, Hyeongju Lee