Patents by Inventor Bongkyu MIN

Bongkyu MIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200093040
    Abstract: Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board.
    Type: Application
    Filed: September 19, 2019
    Publication date: March 19, 2020
    Inventors: Hyelim YUN, Bongkyu MIN, Dohoon KIM, Taewoo KIM, Jinyong PARK, Jungje BANG, Hyeongju LEE
  • Publication number: 20190373729
    Abstract: According to an embodiment of the disclosure, an electronic device comprises a first printed circuit board including a first electrical terminal exposed on one face of a first area, a second electrical terminal exposed on the one face of a second area and insulated from the first electrical terminal, and a first ground terminal exposed on the one face of a third area formed between the first area and the second area, the third area having a width narrower than a width of the first area or the width of the second area; and a second printed circuit board including a third electrical terminal exposed on one face of a fourth area, a fourth electrical terminal exposed on the one face of a fifth area and electrically connected to the third electrical terminal, and a second ground terminal exposed on the one face of a sixth area located between the fourth area and the fifth area, wherein the second printed circuit board is disposed on the first printed circuit board to overlap the third area, the first electrical te
    Type: Application
    Filed: May 16, 2019
    Publication date: December 5, 2019
    Inventors: Jinyong PARK, Taewoo KIM, Hyeongju LEE, Bongkyu MIN, Jungsik PARK, Hyelim YUN
  • Publication number: 20190319381
    Abstract: An electronic device includes a housing, a first board disposed inside the housing and including a first signal line and a first ground, a second board disposed on the first board and including a second signal line and a second ground, a plurality of connectors interposed between the first board and the second board, and a first electronic component disposed inside a space defined by the first board, the second board, and the plurality of connectors. Each of the plurality of connectors includes an insulating member, at least one conductive pin having at least a portion surrounded by the insulating member, and a metal plate electrically connecting the first ground of the first board with the second ground of the second board and formed on an outer sidewall of the insulating member. A first signal pin of conductive pins included in the plurality of connectors electrically connects the first signal line of the first board and the second signal line of the second board with the first electronic component.
    Type: Application
    Filed: April 15, 2019
    Publication date: October 17, 2019
    Inventors: Jungje BANG, Seungju KIM, Taewoo KIM, Bongkyu MIN, Bongchoon PARK, Jonggu PARK, Jonghan PARK, Jinyong PARK, Hoyeon SEO, Jaeheung YE, Hyelim YUN, Hyeongju LEE, Hyoungsoo JUNG