Patents by Inventor Boong Kim

Boong Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11953273
    Abstract: Proposed is a heat dissipating device using turbulent flow. In the heat dissipating device, a plurality of block flow paths are formed in parallel inside a block body, a first cap and a second cap are mounted on side surfaces of the respective ends of the block body so as to connect the block flow paths, a working fluid flows into the block flow paths, and the working fluid which has passed through the block flow paths is transferred to the outside. Turbulence generators are mounted inside the block flow paths, and finishing end portions on the respective ends of the turbulence generators are supported by the first cap and the second cap and are positioned inside the block flow paths.
    Type: Grant
    Filed: January 28, 2021
    Date of Patent: April 9, 2024
    Assignee: HYOSUNG HEAVY INDUSTRIES CORPORATION
    Inventors: Chang Woo Han, Young Joo Kim, Kang Min Choi, Seung Boong Jeong
  • Patent number: 11735437
    Abstract: Provided are an apparatus and method for treating a substrate. Specifically, provided are an apparatus and method for treating a substrate through a supercritical process. The apparatus includes: a housing providing a space for performing a process; a support member disposed in the housing to support a substrate; a supply port configured to supply a process fluid to the housing; a shield member disposed between the supply port and the support member to prevent the process fluid from being directly injected to the substrate; and an exhaust port configured to discharge the process fluid from the housing.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: August 22, 2023
    Assignee: SEMES CO., LTD.
    Inventors: Boong Kim, Oh Jin Kwon, Sungho Jang, Joo Jib Park
  • Patent number: 11443938
    Abstract: A substrate processing apparatus and a substrate processing method are provided. The substrate processing apparatus includes a chamber having a first housing and a second housing that are combined with each other to form a processing space inside, and a housing actuator that moves the first housing to open or close the processing space. The housing actuator includes a plurality of cylinder units coupled to the first housing, a fluid supplier that supplies a fluid for operating the plurality of cylinder units, and a deviation corrector that corrects an operation deviation between the plurality of cylinder units. The deviation corrector corrects the operation deviation between the plurality of cylinder units coupled to the chamber, thereby minimizing particles that are generated when the chamber is opened/closed.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: September 13, 2022
    Assignee: SEMES CO., LTD.
    Inventors: Boong Kim, Joo Jib Park, Woo Young Kim
  • Publication number: 20220246452
    Abstract: Provided are an apparatus and a method for treating a substrate at a high-pressure atmosphere. The apparatus for treating the substrate includes a first body and a second body combined with each other to define a treatment space in which the substrate is treated, a sealing member interposed between the first body and the second body to seal the treatment space from an outside at a position in which the first body is in close contact with the second body, and a driving member to drive the first body or the second body such that the treatment space is open or closed. The sealing member is positioned in a sealing groove formed in the first body. The sealing member is deformed to be in close contact with the second body by pressure of the treatment space when a process is performed.
    Type: Application
    Filed: April 22, 2022
    Publication date: August 4, 2022
    Applicant: Semes Co., Ltd
    Inventors: Sangmin LEE, Woo Young KIM, Joo Jib PARK, Boong KIM
  • Patent number: 11367635
    Abstract: Provided are an apparatus and a method for treating a substrate at a high-pressure atmosphere. The apparatus for treating the substrate includes a first body and a second body combined with each other to define a treatment space in which the substrate is treated, a sealing member interposed between the first body and the second body to seal the treatment space from an outside at a position in which the first body is in close contact with the second body, and a driving member to drive the first body or the second body such that the treatment space is open or closed. The sealing member is positioned in a sealing groove formed in the first body. The sealing member is deformed to be in close contact with the second body by pressure of the treatment space when a process is performed.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: June 21, 2022
    Assignee: SEMES CO., LTD.
    Inventors: Sangmin Lee, Woo Young Kim, Joo Jib Park, Boong Kim
  • Patent number: 11361960
    Abstract: A substrate processing apparatus includes a chamber providing a space in which a substrate is processed, a first substrate support within the chamber and configured to support the substrate when the substrate is loaded into chamber, a second substrate support within the chamber and configured to support the substrate in a height greater than the height in which the first substrate supports the substrate, a first supply port through which a supercritical fluid is supplied to a first space under the substrate of a chamber space, a second supply port through which the supercritical fluid is supplied to a second space above the substrate of the chamber space, and an exhaust port through which the supercritical fluid is exhausted from the chamber.
    Type: Grant
    Filed: June 4, 2020
    Date of Patent: June 14, 2022
    Assignees: SEMES CO., LTD., SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Won-Ho Jang, Jeong-Yong Bae, Woo-Young Kim, Hyun-Jung Lee, Se-Jin Park, Yong-Sun Ko, Dong-Gyun Han, Woo-Gwan Shim, Boong Kim
  • Publication number: 20220084814
    Abstract: The apparatus includes a chamber having a first body and a second body that are combined with each other to form a processing space inside, an actuator that moves a relative position between the first body and the second body to enable a position change between a closed position in which the processing space is sealed from the outside and an open position in which the processing space is open to the outside, the actuator to sequentially perform a high-speed closing step of moving the first body or the second body at a first speed and a low-speed closing step of moving the first body or the second body at a second speed lower than the first speed, at the time of the position change from the open position to the closed position.
    Type: Application
    Filed: November 20, 2021
    Publication date: March 17, 2022
    Inventors: SANGMIN LEE, JOO JIB PARK, BOONG KIM, JONG DOO LEE
  • Publication number: 20210111042
    Abstract: Provided are an apparatus and method for treating a substrate. Specifically, provided are an apparatus and method for treating a substrate through a supercritical process. The apparatus includes: a housing providing a space for performing a process; a support member disposed in the housing to support a substrate; a supply port configured to supply a process fluid to the housing; a shield member disposed between the supply port and the support member to prevent the process fluid from being directly injected to the substrate; and an exhaust port configured to discharge the process fluid from the housing.
    Type: Application
    Filed: December 23, 2020
    Publication date: April 15, 2021
    Applicant: SEMES CO., LTD.
    Inventors: Boong KIM, Oh Jin KWON, Sungho JANG, Joo Jib PARK
  • Publication number: 20200303182
    Abstract: A substrate processing apparatus includes a chamber providing a space in which a substrate is processed, a first substrate support within the chamber and configured to support the substrate when the substrate is loaded into chamber, a second substrate support within the chamber and configured to support the substrate in a height greater than the height in which the first substrate supports the substrate, a first supply port through which a supercritical fluid is supplied to a first space under the substrate of a chamber space, a second supply port through which the supercritical fluid is supplied to a second space above the substrate of the chamber space, and an exhaust port through which the supercritical fluid is exhausted from the chamber.
    Type: Application
    Filed: June 4, 2020
    Publication date: September 24, 2020
    Applicants: Samsung Electronics Co., Ltd., SEMES CO., LTD.
    Inventors: Won-Ho JANG, Jeong-Yong BAE, Woo-Young KIM, Hyun-Jung LEE, Se-Jin PARK, Yong-Sun KO, Dong-Gyun HAN, Woo-Gwan SHIM, Boong KIM
  • Patent number: 10707071
    Abstract: A substrate processing apparatus includes a chamber providing a space in which a substrate is processed, a first substrate support within the chamber and configured to support the substrate when the substrate is loaded into chamber, a second substrate support within the chamber and configured to support the substrate in a height greater than the height in which the first substrate supports the substrate, a first supply port through which a supercritical fluid is supplied to a first space under the substrate of a chamber space, a second supply port through which the supercritical fluid is supplied to a second space above the substrate of the chamber space, and an exhaust port through which the supercritical fluid is exhausted from the chamber.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: July 7, 2020
    Assignees: Samsung Electronics Co., Ltd., Semes Co., Ltd.
    Inventors: Won-Ho Jang, Hyun-Jung Lee, Se-Jin Park, Yong-Sun Ko, Dong-Gyun Han, Woo-Gwan Shim, Jeong-Yong Bae, Woo-Young Kim, Boong Kim
  • Patent number: 10529594
    Abstract: Embodiments of the inventive concept relate to an apparatus for treating a substrate in a high-pressure atmosphere. The apparatus includes a process chamber having an upper body and a lower body that are combined with each other to provide a treatment space therein, an elevation member configured to elevate any one of the upper body and the lower body to an opening location at which the upper body and the lower body is spaced apart or a closing location at which the upper body and the lower body is attached, a clamping member configured to clamp the upper body and the lower body located at the closing location, and a movable member configured to move the clamping member to a locking location at which the clamping member clamps the process chamber or to the release location at which the clamping member is spaced apart from the process chamber.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: January 7, 2020
    Assignee: SEMES CO., LTD.
    Inventors: Do-Youn Lim, Joonho Won, Kisang Eum, Boong Kim, Joo Jib Park
  • Publication number: 20190333759
    Abstract: The apparatus includes a chamber having a first body and a second body that are combined with each other to form a processing space inside, an actuator that moves a relative position between the first body and the second body to enable a position change between a closed position in which the processing space is sealed from the outside and an open position in which the processing space is open to the outside, the actuator to sequentially perform a high-speed closing step of moving the first body or the second body at a first speed and a low-speed closing step of moving the first body or the second body at a second speed lower than the first speed, at the time of the position change from the open position to the closed position.
    Type: Application
    Filed: April 29, 2019
    Publication date: October 31, 2019
    Inventors: SANGMIN LEE, JOO JIB PARK, BOONG KIM, JONG DOO LEE
  • Publication number: 20190115210
    Abstract: Disclosed are a substrate processing apparatus and a substrate processing method. The substrate processing apparatus includes a chamber having a first housing and a second housing that are combined with each other to form a processing space inside, and a housing actuator that moves the first housing to open or close the processing space. The housing actuator includes a plurality of cylinder units coupled to the first housing, a fluid supply unit that supplies a fluid for operating the plurality of cylinder units, and a deviation correction unit that corrects an operation deviation between the plurality of cylinder units. The deviation correction unit corrects the operation deviation between the plurality of cylinder units coupled to the chamber, thereby minimizing particles that are generated when the chamber is opened/closed.
    Type: Application
    Filed: October 15, 2018
    Publication date: April 18, 2019
    Inventors: BOONG KIM, JOO JIB PARK, WOO YOUNG KIM
  • Publication number: 20190096717
    Abstract: Provided are an apparatus and a method for treating a substrate at a high-pressure atmosphere. The apparatus for treating the substrate includes a first body and a second body combined with each other to define a treatment space in which the substrate is treated, a sealing member interposed between the first body and the second body to seal the treatment space from an outside at a position in which the first body is in close contact with the second body, and a driving member to drive the first body or the second body such that the treatment space is open or closed. The sealing member is positioned in a sealing groove formed in the first body. The sealing member is deformed to be in close contact with the second body by pressure of the treatment space when a process is performed.
    Type: Application
    Filed: September 17, 2018
    Publication date: March 28, 2019
    Applicant: SEMES CO., LTD.
    Inventors: Sangmin Lee, Woo Young Kim, Joo Jib Park, Boong Kim
  • Patent number: 10197333
    Abstract: Disclosed is a substrate drying apparatus of substrate processing apparatus including a chamber that provides a space for processing a substrate, and a fluid supply unit that supplies a process fluid to the chamber, wherein the liquid supply unit includes a supply tank in which the fluid is stored, a supply line that connects the supply tank and the chamber, a branch line branched from a first point of the supply line and connected to a second point of the supply line, and a temperature control unit that adjusts the temperature of the fluid such that the temperatures of the fluids flowing through the supply line and the branch line between the first point and the second point are different.
    Type: Grant
    Filed: May 12, 2016
    Date of Patent: February 5, 2019
    Assignee: Semes Co., Ltd.
    Inventors: Boong Kim, Min Sung Han, Joo Jib Park, Woo Young Kim
  • Publication number: 20180190485
    Abstract: A substrate processing apparatus includes a chamber providing a space in which a substrate is processed, a first substrate support within the chamber and configured to support the substrate when the substrate is loaded into chamber, a second substrate support within the chamber and configured to support the substrate in a height greater than the height in which the first substrate supports the substrate, a first supply port through which a supercritical fluid is supplied to a first space under the substrate of a chamber space, a second supply port through which the supercritical fluid is supplied to a second space above the substrate of the chamber space, and an exhaust port through which the supercritical fluid is exhausted from the chamber.
    Type: Application
    Filed: November 30, 2017
    Publication date: July 5, 2018
    Applicants: Samsung Electronics Co., Ltd., SEMES CO., LTD.
    Inventors: Won-Ho JANG, Hyun-Jung LEE, Se-Jin PARK, Yong-Sun KO, Dong-Gyun HAN, Woo-Gwan SHIM, Jeong-Yong BAE, Woo-Young KIM, Boong KIM
  • Patent number: 9984902
    Abstract: Provided are an apparatus and method for treating a substrate. Specifically, provided are an apparatus and method for treating a substrate through a supercritical process. The apparatus includes: a housing providing a space for performing a process; a support member disposed in the housing to support a substrate; a supply port configured to supply a process fluid to the housing; a shield member disposed between the supply port and the support member to prevent the process fluid from being directly injected to the substrate; and an exhaust port configured to discharge the process fluid from the housing.
    Type: Grant
    Filed: July 27, 2012
    Date of Patent: May 29, 2018
    Assignee: Semes Co., Ltd.
    Inventors: Boong Kim, Oh Jin Kwon, Sungho Jang, Joo Jib Park
  • Publication number: 20180114707
    Abstract: Embodiments of the inventive concept relate to an apparatus for treating a substrate in a high-pressure atmosphere. The apparatus includes a process chamber having an upper body and a lower body that are combined with each other to provide a treatment space therein, an elevation member configured to elevate any one of the upper body and the lower body to an opening location at which the upper body and the lower body is spaced apart or a closing location at which the upper body and the lower body is attached, a clamping member configured to clamp the upper body and the lower body located at the closing location, and a movable member configured to move the clamping member to a locking location at which the clamping member clamps the process chamber or to the release location at which the clamping member is spaced apart from the process chamber.
    Type: Application
    Filed: October 25, 2017
    Publication date: April 26, 2018
    Inventors: Do-Youn Lim, Joonho Won, Kisang Eum, Boong Kim, Joo Jib Park
  • Publication number: 20180102263
    Abstract: Provided are an apparatus and method for treating a substrate. Specifically, provided are an apparatus and method for treating a substrate through a supercritical process. The apparatus includes: a housing providing a space for performing a process; a support member disposed in the housing to support a substrate; a supply port configured to supply a process fluid to the housing; a shield member disposed between the supply port and the support member to prevent the process fluid from being directly injected to the substrate; and an exhaust port configured to discharge the process fluid from the housing.
    Type: Application
    Filed: December 7, 2017
    Publication date: April 12, 2018
    Applicant: SEMES CO., LTD.
    Inventors: Boong Kim, Oh Jin Kwon, Sungho Jang, Joo Jib Park
  • Patent number: 9587880
    Abstract: Provided is an apparatus and method for drying a substrate. The apparatus includes a housing, a substrate support member, a fluid supply member, and a discharge member. The housing provides a space in which a drying process is performed. The substrate support member is provided in the housing to support the substrate. The fluid supply member includes a supply line for supplying a process fluid of a supercritical state to the housing. The discharge member includes a discharge line for discharging the process fluid from the housing. Here, the supply line includes a first supply line provided to supply the process fluid to the housing at a first supply flow rate, and a second supply line provided to supply the process fluid to the housing at a second supply flow rate.
    Type: Grant
    Filed: May 30, 2013
    Date of Patent: March 7, 2017
    Assignee: SEMES CO., LTD.
    Inventors: Boong Kim, Ki Bong Kim, Gil Hun Song, Oh Jin Kwon