Abstract: A lithographic apparatus includes a substrate support that is constructed to support a substrate, and a projection system that is configured to project a patterned radiation beam onto a target portion of the substrate. The substrate support is arranged to move the substrate along a predetermined trajectory of subsequently targeted target portions of the substrate. The substrate support includes a duct configuration for providing thermal stabilization to the substrate. The duct configuration is arranged to duct thermally stabilizing media in the support, and to substantially duct the media away from a part of the substrate support that supports the target portion via parts of the substrate support that support previously targeted portions of the substrate, so as to keep subsequently targeted target portions thermally stable.

Abstract: In calibration of overlay performance of an immersion lithographic apparatus, two sets of overlay data are obtained from exposures carried out using normal and reversed meanders. The two data sets can then be used to eliminate effects due to wafer cooling.

Abstract: In calibration of overlay performance of an immersion lithographic apparatus, two sets of overlay data are obtained from exposures carried out using, for example, normal and reversed meanders. The two data sets can then be used to eliminate effects due to substrate cooling.

Abstract: A calibration substrate for use during calibration of a lithographic apparatus is disclosed. The calibration substrate includes a first substantially flat surface, a second substantially flat surface that is substantially parallel to the first surface, and an edge that connects the first surface to the second surface. The calibration substrate has a thermal expansion coefficient of less than about 1.0×10?6 K?1 to reduce deformation thereof due to thermal changes in the substrate while in the lithographic apparatus.

Abstract: A lithographic apparatus includes a substrate support that is constructed to support a substrate, and a projection system that is configured to project a patterned radiation beam onto a target portion of the substrate. The substrate support is arranged to move the substrate along a predetermined trajectory of subsequently targeted target portions of the substrate. The substrate support includes a duct configuration for providing thermal stabilization to the substrate. The duct configuration is arranged to duct thermally stabilizing media in the support, and to substantially duct the media away from a part of the substrate support that supports the target portion via parts of the substrate support that support previously targeted portions of the substrate, so as to keep subsequently targeted target portions thermally stable.

Abstract: A lithographic apparatus is disclosed. The apparatus includes an illumination system configured to condition a radiation beam, and a support constructed to support a patterning device. The patterning device is capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam. The apparatus also includes a substrate table constructed to hold a substrate, a projection system configured to project the patterned radiation beam onto a target portion of the substrate, a liquid supply system configured to at least partly fill a space between the projection system and the substrate with liquid, a seal member arranged to substantially contain the liquid within the space, and elements to control and/or compensate for evaporation of immersion liquid from the substrate.

Abstract: A lithographic apparatus is disclosed having a liquid supply system configured to at least partly fill a space between a projection system of the lithographic apparatus and a substrate with liquid, a barrier member arranged to substantially contain the liquid within the space, and one or more elements to control and/or compensate for evaporation of liquid from the substrate.

Abstract: A method and apparatus of correcting thermally-induced field deformations of a lithographically exposed substrate, is presented herein. In one embodiment, the method includes exposing a pattern onto a plurality of fields of a substrate in accordance with pre-specified exposure information and measuring attributes of the fields to assess deformation of the fields induced by thermal effects of the exposing process. The method further includes determining corrective information based on the measured attributes, and adjusting the pre-specified exposure information, based on the corrective information, to compensate for the thermally-induced field deformations. Other embodiments include the use of predictive models to predict thermally-induced effects on the fields and thermographic imaging to determine temperature variations across a substrate.