Patents by Inventor Botho Hoffmann
Botho Hoffmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11945143Abstract: A composite containing directly adjoining and firmly bonded sections (I) and (II) of the following type: (I) section, formed from a thermoplastic moulding compound FM-1 containing at least one polyamide (A) and optionally fillers and reinforcing materials (C) and additives (D); (II) section, formed from a thermoplastic moulding compound containing at least one olefinic and/or vinyl aromatic polymer (E) and optionally fillers and reinforcing agents (F), plasticisers (G) and additives (H); wherein the moulding compound FM-1 or FM-2 contains 0.1 to 5.0 percent by weight of polyethyleneimine (B) or a copolymer or derivative thereof and a method for producing such composites.Type: GrantFiled: October 29, 2020Date of Patent: April 2, 2024Assignee: EMS-Chemie AGInventors: Etienne Aepli, Botho Hoffmann
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Publication number: 20240026079Abstract: Thermoplastic polyamide moulding composition consisting of: (A) 30-99.9 percent by weight of at least one polyamide selected from the group consisting of: at least one aliphatic or semiaromatic polyamide, in each case with C:N ratio at least 8; at least one aliphatic or semiaromatic polyamide composed of at least one dicarboxylic acid and of at least one diamine and also optionally a proportion below 50 mol percent based on the entirety of dicarboxylic acids and diamine as 100 mol percent, of lactams and/or aminocarboxylic acids; and mixtures thereof; (B) 0.1-5.0 percent by weight of polyethyleneimine (PEI) or copolymers or derivatives thereof; (C) 0-60 percent by weight of fillers and/or reinforcing materials; (D) 0-5.0 percent by weight of additives; where the entirety of (A)-(D) provides 100% of the thermoplastic polyamide moulding composition, and also uses of such moulding compositions in particular in the context of components bonded to mineral glass.Type: ApplicationFiled: September 28, 2023Publication date: January 25, 2024Applicant: EMS-PATENT AGInventors: Etienne AEPLI, Georg STOPPELMANN, Botho HOFFMANN
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Publication number: 20240010836Abstract: Use of a part comprising at least a portion of a polyamide moulding composition said portion for direct contact with fuel, wherein the polyamide moulding composition consists of the following components in the following proportions: (A) 30-90% by weight of at least one polyamide; (B) 10-70% by weight of fibers with non-circular cross-section; (C) 0-10% by weight of at least one stabiliser; (D) 0-10% by weight of additives different from (B) and (C), wherein the sum of (A)-(D) makes up 100% of the portion.Type: ApplicationFiled: June 30, 2023Publication date: January 11, 2024Applicant: Ems-Chemie AGInventors: Doris ABT, Botho HOFFMANN
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Patent number: 11807718Abstract: Thermoplastic polyamide moulding composition consisting of: (A) 30-99.9 percent by weight of at least one polyamide selected from the group consisting of: at least one aliphatic or semiaromatic polyamide, in each case with C:N ratio at least 8; at least one aliphatic or semiaromatic polyamide composed of at least one dicarboxylic acid and of at least one diamine and also optionally a proportion below 50 mol percent based on the entirety of dicarboxylic acids and diamine as 100 mol percent, of lactams and/or aminocarboxylic acids; and mixtures thereof; (B) 0.1-5.0 percent by weight of polyethyleneimine (PEI) or copolymers or derivatives thereof; (C) 0-60 percent by weight of fillers and/or reinforcing materials; (D) 0-5.0 percent by weight of additives; where the entirety of (A)-(D) provides 100% of the thermoplastic polyamide moulding composition, and also uses of such moulding compositions in particular in the context of components bonded to mineral glass.Type: GrantFiled: December 18, 2019Date of Patent: November 7, 2023Assignee: EMS-PATENT AGInventors: Etienne Aepli, Georg Stoppelmann, Botho Hoffmann
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Publication number: 20230312922Abstract: The present invention relates to a polyamide molding material with high fracture energy and molded parts produced therefrom which are particularly suitable for visible parts for automotive parts or for electronic devices. The polyamide molding material has, in addition to excellent fracture energy, a likewise excellent piano lacquer finish and a high rubbing resistance.Type: ApplicationFiled: March 28, 2023Publication date: October 5, 2023Applicant: EMS-CHEMIE AGInventors: Etienne AEPLI, Botho HOFFMANN
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Publication number: 20230257579Abstract: The present invention relates to a polyamide moulding compound consisting of A 33-79.4 wt% of a polymer mixture consisting of A1 55 to 85 wt% of at least one semi-crystalline, aliphatic polyamide selected from the group PA 6, PA 46, PA 56, PA 66, PA 66/6, PA 610, PA 612, PA 6/12, PA 1010, PA 11, PA 12, PA 1012, PA 1212 and mixtures thereof; A2 15 to 45 wt% of at least one semi-aromatic polyamide selected from the group PA 6l, PA 5l/5T, PA 6l/6T, PA 10l/10T, PA 10T/6T, PA 6T/BACT/66/BAC6, PA MXD6, PA MXD6/MXDl and mixtures thereof; wherein the sum of A1 and A2 is 100 wt% of A; B 20 to 60 wt% of a reinforcing fibre; C 0.6 to 2.0 wt% metal borate, wherein the molar ratio of metal to boron is in the range from 0.5 to 4; D 0 to 5.0 wt% additives, different from A, B and C; wherein the sum of the components A to D is 100 wt% and wherein the moulding compound comprises neither copper halides nor metal phosphinates.Type: ApplicationFiled: February 10, 2023Publication date: August 17, 2023Inventors: Etienne AEPLI, Philipp HARDER, Botho Hoffmann
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Patent number: 11718012Abstract: Thermoplastic moulding composition consisting of (A) 51 to 69.9 wt % of polyamide elastomer; (B) 15 to 38 wt % of ethylene-?-olefin copolymer; (C) 3 to 25 wt % of polyamide selected from the group consisting of: PA6, PA66, PA6/66, PA610, PA612, PA614, PA616, PA6/610, PA66/610 or mixtures thereof; (D) 0.1 to 2.0 wt % of heat stabilizers based on copper and/or iodide, organic stabilizers or a mixture thereof; (E) 0 to 5.0 wt % of additives, different from (A) to (D); where the sum of (A) to (E) makes 100 wt % of the total moulding composition, and with the proviso that the sum of (B) and (C) is in the range from 30 to 48 wt % based on the total moulding composition.Type: GrantFiled: December 18, 2019Date of Patent: August 8, 2023Assignee: EMS-PATENT AGInventors: Botho Hoffmann, Oliver Thomas, Minoru Hatta, Takamasa Fujii
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Publication number: 20220204764Abstract: The present invention relates to polyamide compounds having high heat aging resistance which, in addition to a specific polyamide, comprise at least one unsubstituted or substituted metallocene, optionally at least one impact modifier and optionally at least one additive. The invention also relates to the use of said polyamide compounds for the production of molds.Type: ApplicationFiled: December 15, 2021Publication date: June 30, 2022Applicant: EMS-CHEMIE AGInventors: Arda ALKAN, Andri CADALBERT, Andreas BAYER, Botho HOFFMANN
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Publication number: 20220195186Abstract: The present invention relates to filled polyamide moulding compounds with a high heat-ageing resistance which, besides a specific polyamide mixture, also comprise at least one filler, at least one unsubstituted or substituted metallocene and optionally at least one additive. The invention also relates to the use of these polyamide moulding compounds to produce moulded articles.Type: ApplicationFiled: December 15, 2021Publication date: June 23, 2022Applicant: EMS-CHEMIE AGInventors: Arda ALKAN, Andri CADALBERT, Andreas BAYER, Botho HOFFMANN
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Patent number: 11359091Abstract: The present invention relates to a polyamide molding compound which contains the following components (A) to (C) or consist of these components: (A) 50 to 98% by weight of at least one specific amorphous or microcrystalline copolyamide constituted by the specific monomers (a1) to (a4); (B) 2 to 40% by weight of at least one semi-crystalline polyamide which is selected from the group consisting of PA 612, PA 6/12, PA 516, PA 614, PA 616, PA 618, PA 1012, PA 1014, PA 1016, PA 1018 and mixtures thereof; and (C) 0 to 20% by weight of at least one additive; the constituent amounts of the components (A) to (C) adding up to 100% by weight. The invention also relates to molded articles made of said polyamide molding compound and the use thereof.Type: GrantFiled: December 6, 2018Date of Patent: June 14, 2022Assignee: EMS-Patent AGInventors: Thomas Wiedemann, Botho Hoffmann
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Patent number: 11359051Abstract: The invention relates to microwave-resistant mouldings comprising at least one amorphous or microcrystalline copolyamide moulding compound, comprising at least one amorphous or microcrystalline copolyamide (A), said copolyamide (A) containing at least the following monomers: (a) at least one cycloaliphatic diamine, (b) 0.25 to 30 mol % of at least one dimeric fatty acid and (c) at least one aromatic dicarboxylic acid, where the proportions of all the monomers add up to 100 mol % and which has a glass transition temperature of at least 155° C. and a dielectric loss factor tan ? of not more than 8.30×10?3. The invention also relates to the use of an amorphous or microcrystalline copolyamide moulding compound comprising the copolyamide (A) for production of microwave-resistant mouldings.Type: GrantFiled: March 2, 2018Date of Patent: June 14, 2022Assignee: EMS-Patent AGInventors: Etienne Aepli, Botho Hoffmann, Thomas Wiedemann
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Publication number: 20210395517Abstract: The present invention relates to a thermoplastic molding composition comprising: A mixture of at least one polyamide A1, at least one polyphenylene ether A2 and optionally a compatibilizer A3 and optionally an olefinic and/or vinylaromatic polymer A4; B 10 to 60% by weight of glass filler, the glass composition of which comprises at least 10% by weight of boron oxide and at most 15% by weight for the sum of magnesium oxide and calcium oxide; C 1 to 8% by weight of LDS additive; D 0 to 5% by weight of additives other than components A, B and C; wherein 80 to 100% by weight of mixture A consists of a mixture M of components A1, A2 and A3 and 0 to 20% by weight of component A4, in each case based on the sum of components M and A4, and wherein the sum of components M and A4 gives 100% by weight of mixture A, and wherein 36 to 92% by weight of mixture M is of component A2, from 8 to 60% by weight of component A1 and from 0 to 4% by weight of component A3, based in each case on the sum of components A1 to A3, andType: ApplicationFiled: June 15, 2021Publication date: December 23, 2021Inventors: Doris ABT, Georg STOEPPELMANN, Botho HOFFMANN
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Patent number: 11098194Abstract: The invention relates to polyamide moulding compounds comprising the following components: a) 50 to 95% by weight of a single amorphous copolyamide constructed from monomers a1) to a6), b) 5 to 50% by weight of at least one glass filler, c) 0 to 15% by weight of at least one monomeric lactam and/or polyamide 12, d) 0 to 19% by weight of additives, the sum of components a) to d) producing 100% by weight. Furthermore, the invention relates to moulded articles made of this polyamide moulding compound.Type: GrantFiled: October 10, 2017Date of Patent: August 24, 2021Assignee: EMS-Patent AGInventors: Etienne Aepli, Botho Hoffmann
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Patent number: 11091590Abstract: The present invention relates to an amorphous or microcrystalline copolyamide (A) containing at least the following monomers: (a) at least one cycloaliphatic diamine; (b) 0.25 to 4.4 mol % of at least one dimeric fatty acid; and (c) 12 to 49.75 mol % of at least one aromatic dicarboxylic acid selected from the group consisting of isophthalic acid, terephthalic acid and naphthalenedicarboxylic acid, and (d) 0 to 37.75 mol % of at least one aliphatic dicarboxylic acid; where the molar proportion of isophthalic acid is at least equal to the molar proportion of terephthalic acid, and where the monomers (b), (c) and optionally (d) add up to 50 mol % and the molar proportions of all the monomers present in the copolyamide (A) add up to 100 mol %. The invention further relates to moulding compounds comprising the copolyamide (A), to mouldings made therefrom and to the use thereof.Type: GrantFiled: March 2, 2018Date of Patent: August 17, 2021Assignee: EMS-Patent AGInventors: Botho Hoffmann, Etienne Aepli, Thomas Wiedemann
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Publication number: 20210189124Abstract: The present invention relates to the use of a polyamide molding compound for application purposes in which high resistance to hypochlorous acid is crucial. The molding compound is thus used according to the invention for molded bodies suitable for being in contact with aqueous, hypochlorous acid-containing solutions.Type: ApplicationFiled: December 21, 2020Publication date: June 24, 2021Applicant: EMS-CHEMIE AGInventors: Arda ALKAN, Thomas WIEDEMANN, Andri CADALBERT, Manfred HEWEL, Botho HOFFMANN
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Publication number: 20210189125Abstract: The present invention relates to the use of a polyamide molding compound for application purposes in which a high resistance to hypochlorous acid is decisive. The molding compound is thus used in accordance with the invention for molds that are suitable for contact with aqueous solutions containing hypochlorous acid.Type: ApplicationFiled: December 21, 2020Publication date: June 24, 2021Applicant: EMS-CHEMIE AGInventors: Arda ALKAN, Thomas WIEDEMANN, Andri CADALBERT, Manfred HEWEL, Botho HOFFMANN
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Publication number: 20210129398Abstract: A composite containing directly adjoining and firmly bonded sections (I) and (II) of the following type: (I) section, formed from a thermoplastic moulding compound FM-1 containing at least one polyamide (A) and optionally fillers and reinforcing materials (C) and additives (D); (II) section, formed from a thermoplastic moulding compound containing at least one olefinic and/or vinyl aromatic polymer (E) and optionally fillers and reinforcing agents (F), plasticisers (G) and additives (H); wherein the moulding compound FM-1 or FM-2 contains 0.1 to 5.0 percent by weight of polyethyleneimine (B) or a copolymer or derivative thereof and a method for producing such composites.Type: ApplicationFiled: October 29, 2020Publication date: May 6, 2021Inventors: Etienne AEPLI, Botho HOFFMANN
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Publication number: 20210115250Abstract: The present invention relates to a polyamide molding compound which contains the following components (A) to (C) or consist of these components: (A) 50 to 98% by weight of at least one specific amorphous or microcrystalline copolyamide constituted by the specific monomers (a1) to (a4); (B) 2 to 40% by weight of at least one semi-crystalline polyamide which is selected from the group consisting of PA 612, PA 6/12, PA 516, PA 614, PA 616, PA 618, PA 1012, PA 1014, PA 1016, PA 1018 and mixtures thereof; and (C) 0 to 20% by weight of at least one additive; the constituent amounts of the components (A) to (C) adding up to 100% by weight. The invention also relates to molded articles made of said polyamide molding compound and the use thereof.Type: ApplicationFiled: December 6, 2018Publication date: April 22, 2021Applicant: EMS-PATENT AGInventors: Thomas WIEDEMANN, Botho HOFFMANN
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Patent number: 10889713Abstract: Disclosed is a polyamide moulding compound formed from a mixture of partially crystalline, aliphatic polyamides and partially crystalline, partially aromatic polyamides and also fibrous reinforcing materials. The partially crystalline, partially aromatic polyamides are thereby formed from a diamine component, a dicarboxylic acid component and possibly a lactam- and/or ?-amino acid component. The mixture and/or the moulding compound can include further components. Moulded articles produced from these moulding compounds are used, for example, in the automobile sphere, in the household sphere, in measuring, regulating and control technology or in mechanical engineering.Type: GrantFiled: April 18, 2018Date of Patent: January 12, 2021Assignee: EMS-Patent AGInventors: Christian Schubert, Botho Hoffmann, Andreas Bayer
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Patent number: 10836905Abstract: The present invention relates to polyamide molding compounds that are characterized by high notch impact resistance and high gloss. These polyamide molding compounds comprise the following components or consist of these components: (A) 84.5 to 97.0 wt % of at least one amorphous or microcrystalline copolyamide selected from the group comprising PA 6I/6T/MACMI/MACMT/PACMI/PACMT/Y, PA 6I/6T/MACMI/MACMT/Y, and mixtures thereof; (B) 3.0 to 9.5 wt % of at least one specific functionalized impact resistance modifier; and (C) 0 to 6 wt % of at least one additive; wherein the weight proportions of the components (A) to (C) add up to 100 wt %. The present invention furthermore relates to molded bodies composed of this polyamide molding compound.Type: GrantFiled: August 28, 2018Date of Patent: November 17, 2020Assignee: EMS-PATENT AGInventors: Thomas Wiedemann, Botho Hoffmann, Sepp Bass