Abstract: A polyamide molding composition and uses thereof, and moldings produced therefrom, comprising the following components: (A) semicrystalline semiaromatic polyamide with melting point above 270° C., or a mixture of these polyamides; (B) copolymer of oxyranyl acrylate and/or oxyranyl methacrylate with at least one other olefinically unsaturated monomer, or a mixture of these copolymers; (C) one or more fibrous reinforcing materials; (D) one or more heat stabilizers; where the proportion of (B) is in the range of 1 to 15% by weight, based on 100% by weight composed of the entirety of the components (A) and (B), with the proviso that the polyamide molding composition is free from grafted impact modifiers.

Abstract: Polyamide molding composition: (A) 29-89 wt % of at least one partly crystalline thermoplastic homo- or copolyamide selected from: aliphatic polyamide, cycloaliphatic polyamide, partly aromatic polyamide, or a mixture thereof, having a melting temperature (Tm) of at least 270° C. and a melting enthalpy in the range of 30-70 J/g, in particular in the range of 40-65 J/g, each measured to ISO standard 11357-3 on the granulate at a heating rate of 20° C./min; (B) 1-15 wt % of ethylene-vinyl acetate copolymer; (C) 10-70 wt % of filling and reinforcing materials selected from the following group: fibrous reinforcing materials, particulate fillers and mixtures thereof; (D) 0-20 wt % of impact modifier other than (B) and/or polymers other than (A); (E) 0-20 wt % of flame retardant; and (F) 0-5 wt % of additives, wherein the sum total of components (A)-(F) is 100 weight percent.

Abstract: The invention relates to a polyamide molding composition which comprises a partially aromatic polyamide and also a mixture of at least two UV absorbers. The invention likewise relates to molded articles which comprise corresponding polyamide molding compositions.

Abstract: Fillers are proposed, with the exception of layered silicates, which have a surface coating, which comprises a water-soluble polyamide or multiple water-soluble polyamides, wherein at least one of these water-soluble polyamides is produced by polycondensation from monomer components, which comprise at least one dicarboxylic acid and at least one selected ether diamine, preferably having linear oxypropyl amino end groups. Fillers coated in this manner are suitable for use in the production of filled and/or reinforced thermoplastic plastics molding materials. Thermoplastic plastics molding materials which contain fillers having such a surface coating have good mechanical properties and few emissions (low outgassing).

Abstract: A polyamide molding composition for the production of a stain-resistant article, the staining tendency (ST) of the article being at least 2. The composition contains 30-100% by weight of a polyamide or a polyamide mixture, consisting of 50-100% by weight of at least one amorphous and/or microcrystalline polyamide having a glass transition temperature of at least 100° C., based on: 20-100 mol % of at least one cycloaliphatic diamine; and 0-80 mol % of at least one other aliphatic and/or aromatic diamine; and also aromatic and/or aliphatic dicarboxylic acids comprising at least 6 carbon atoms, and 0-50% by weight of at least one semi-aromatic polyamide. In addition, the molding composition comprises any of inorganic white pigments, fillers, impact toughness modifier and/or flame retardants.

Abstract: The present invention relates to polyamide moulding compounds which have an improved resistance to heat-aging and comprise the following compositions: (A) 25 to 84.99 wt.-% of at least one polyamide, (B) 15 to 70 wt.-% of at least one filler and reinforcing means, (C) 0.01 to 5.0 wt.-% of at least one inorganic radical interceptor, (D) 0 to 5.0 wt.-% of at least one heat stabilizer which is different from the inorganic free-radical scavenger under (C), and (E) 0 to 20.0 wt.-% of at least one additive. The invention further relates to moulded articles produced from these polyamide moulding compounds as components in the automobile or electrics/electronics sector.

Abstract: What is described is a transparent polyamide-imide based on one or more different imido-dicarboxylic acids (AB) or derivatives thereof, and cycloaliphatic diamines (C) comprising 6 to 24 carbon atoms, wherein the imido-dicarboxylic acids (AB) or derivatives thereof are selected from the group of imido-dicarboxylic acids (AB) having the following structural formulas: wherein: ASL=(CH2)5-11, phenylene, (ylomethyl)phenyl, bis(ylomethyl)benzene, cyclohexanediyl, (ylomethyl)cyclohexyl, bis(ylomethyl)cyclohexane, cyclopentanediyl, (ylomethyl)cyclopentyl, bis(ylomethyl)cyclopentane, R?OH, O-alkyl, O-aryl, Cl, NH-ASL-COOH, Br, O—(CO)-alkyl, O—(CO)-aryl, R1=H, methyl, ethyl, propyl, with the provision that the ring can be substituted once or twice, and, with double substitution of the ring, the two substituents can be selected from the group, but may be different, and also moulding compounds based thereon, a method for production, and uses.

Abstract: What is described is a transparent polyamide-imide based on one or more different imido-dicarboxylic acids (AB) or derivatives thereof, and cycloaliphatic diamines (C) comprising 6 to 24 carbon atoms, wherein the imido-dicarboxylic acids (AB) or derivatives thereof are selected from the group of imido-dicarboxylic acids (AB) having the following structural formulas: wherein: ASL=(CH2)5-11, phenylene, (ylomethyl)phenyl, bis(ylomethyl)benzene, cyclohexanediyl, (ylomethyl)cyclohexyl, bis(ylomethyl)cyclohexane, cyclopentanediyl, (ylomethyl)cyclopentyl, bis(ylomethyl)cyclopentane, R?OH, O-alkyl, O-aryl, Cl, NH-ASL-COOH, Br, O—(CO)-alkyl, O—(CO)-aryl, R1=H, methyl, ethyl, propyl, with the provision that the ring can be substituted once or twice, and, with double substitution of the ring, the two substituents can be selected from the group, but may be different, and also moulding compounds based thereon, a method for production, and uses.

Abstract: What is described is the use of a polyamide moulding composition for the production of a stain-resistant article, the staining tendency (ST) of the article being at least 2. Here, the composition contains 30-100% by weight of a polyamide or a polyamide mixture, consisting of 50-100% by weight of at least one amorphous and/or microcrystalline polyamide having a glass transition temperature of at least 100° C., based on: 20-100 mol % of at least one cycloaliphatic diamine; and 0-80 mol % of at least one other aliphatic and/or aromatic diamine; and also aromatic and/or aliphatic dicarboxylic acids comprising at least 6 carbon atoms, and 0-50% by weight of at least one semi-aromatic polyamide. In addition, 0-70% by weight of fibrous fillers (B1) and/or particulate fillers (B2), 0-30% by weight of impact toughness modifier and/or polymers different from (A), 0-25% by weight of a flame retardant, and 0-3% by weight of additives may also be contained.

Abstract: The present invention relates to a polyamide moulding compound which consists of a blend of two specific polyamides. The first polyamide is thereby based substantially on 1,5-pentanediamine as diamine component used during polycondensation. The second polyamide is thereby polyamide 6I/6T. The polyamide moulding compounds according to the invention are distinguished by extremely low shrinkage and low differential shrinkage (difference between shrinkage of the moulded article longitudinally and transversely relative to the injection flow). In addition, the present invention relates to moulded articles which are producible from the polyamide moulding compounds according to the invention and also to purposes of use of the polyamide moulding compounds.

Abstract: Polyamide moulding composition consisting of the following components: (A) 29-89 wt % of at least one partly crystalline thermoplastic homo- or copolyamide selected from the following group: aliphatic polyamide, cycloaliphatic polyamide, partly aromatic polyamide, or a mixture thereof, having a melting temperature (Tm) of at least 270° C. and a melting enthalpy in the range of 30-70 J/g, in particular in the range of 40-65 J/g, each measured to ISO standard 11357-3 on the granulate at a heating rate of 20° C./min; (B) 1-15 wt % of ethylene-vinyl acetate copolymer; (C) 10-70 wt % of filling and reinforcing materials selected from the following group: fibrous reinforcing materials, particulate fillers and mixtures thereof; (D) 0-20 wt % of impact modifier other than (B) and/or polymers other than (A); (E) 0-20 wt % of flame retardant; and (F) 0-5 wt % of additives, wherein the sum total of components (A)-(F) is 100 weight percent.

Abstract: A reinforced polyamide moulding composition is described, particularly for use as starting material for the production of housings for devices in the field of mobile radio technology, composed of the following components: (A) from 20-45% by weight of aliphatic polyamide selected from the group consisting of: PA 610, PA 612 and mixtures thereof; (B) from 5-15% by weight of semiaromatic polyamide selected from the group consisting of: 6I, DI, 6I/6T, 6I/6T, DI/DT, DI/6T, MXD6 and mixtures thereof; (C) from 45-75% by weight of flat glass fibres with non-circular cross section, where the dimensional ratio of the major cross-sectional axis to the minor cross-sectional axis of the said cross section is in the range from 2-5; (D) from 0-10% by weight of additives; where components (A)-(D) give a total of 100% by weight.

Abstract: A polyamide molding composition for the production of a stain-resistant article, the staining tendency (ST) of the article being at most 15. The composition contains 30-100% by weight of a polyamide mixture, consisting of more than 50 and up to 98% by weight of at least one semi-aromatic polyamide comprising 2 to up to 50% by weight of amorphous and/or microcrystalline polyamides having a glass transition temperature of at least 100° C., based on: 20-100 mol % of at least one cycloaliphatic diamine; and 0-80 mol % of at least one other aliphatic and/or aromatic diamine; and also aromatic and/or aliphatic dicarboxylic acids comprising at least 6 carbon atoms. In addition, the composition comprises inorganic white pigments, fibrous or particulate additives, impact toughness modifier and/or polymers different from (A), 0-25% by weight of a flame retardant.

Abstract: The invention relates to polyamide sheet silicate compositions, containing an untreated clay mineral and a water-soluble polyamide, the concentration of the clay material being greater than 30% by weight. Furthermore the invention relates to nanocomposites which contain clay minerals distributed homogeneously in a water-insoluble thermoplastic matrix. These nanocomposites are produced by mixing the polyamide sheet silicate composition and a water-insoluble thermoplastic in the melt.

Abstract: A transparent polyamide molding material containing at least one cycloolefin co-polymer comprises a mixture of: (A) 55 to 99 wt % of at least one amorphous polyamide; and (B) 1 to 30 wt % of the at least one cycloolefin copolymer, Wherein, in the at least one cycloolefin copolymer (B), the cycloolefin fraction is more than 40 mol %. In this connection, the sum of the components (A) and (B) together with optional additives (C) is 100 wt % of the polyamide molding material.

Abstract: Fillers are proposed, with the exception of layered silicates, which have a surface coating, which comprises a water-soluble polyamide or multiple water-soluble polyamides, wherein at least one of these water-soluble polyamides is produced by polycondensation from monomer components, which comprise at least one dicarboxylic acid and at least one selected ether diamine, preferably having linear oxypropyl amino end groups. Fillers coated in this manner are suitable for use in the production of filled and/or reinforced thermoplastic plastics molding materials. Thermoplastic plastics molding materials which contain fillers having such a surface coating have good mechanical properties and few emissions (low outgassing).

Abstract: What is described is the use of a polyamide molding composition for the production of a stain-resistant article, the staining tendency (ST) of the article being at most 15. Here, the composition contains 30-100% by weight of a polyamide mixture, consisting of more than 50 and up to 98% by weight of at least one semi-aromatic polyamide comprising 2 to up to 50% by weight of amorphous and/or microcrystalline polyamides having a glass transition temperature of at least 100° C., based on: 20-100 mol % of at least one cycloaliphatic diamine; and 0-80 mol % of at least one other aliphatic and/or aromatic diamine; and also aromatic and/or aliphatic dicarboxylic acids comprising at least 6 carbon atoms. In addition, 0-70% by weight of fibrous additives (B1) and/or particulate additives (B2), 0-30% by weight of impact toughness modifier and/or polymers different from (A), 0-25% by weight of a flame retardant, and 0-3% by weight of additives may also be contained.

Abstract: The present invention relates to a method for low-stress injection moulding of amorphous or microcrystalline polyamides, in which a melt of the amorphous or microcrystalline polyamides is processed and injection moulded under specific conditions. Hence, low-stress moulded articles made of the amorphous or microcrystalline polyamides can be produced by injection moulding. The present invention relates in addition to the correspondingly produced moulded articles.

Abstract: The invention relates to a polyamide moulding composition which comprises a partially aromatic polyamide and also a mixture of at least two UV absorbers. The invention likewise relates to moulded articles which comprise corresponding polyamide moulding compositions.

Abstract: A polyamide moulding composition and uses thereof, and mouldings produced therefrom, comprising the following components: (A) semicrystalline semiaromatic polyamide with melting point above 270° C., or a mixture of these polyamides; (B) copolymer of oxyranyl acrylate and/or oxyranyl methacrylate with at least one other olefinically unsaturated monomer, or a mixture of these copolymers; (C) one or more fibrous reinforcing materials; (D) one or more heat stabilizers; where the proportion of (B) is in the range of 1 to 15% by weight, based on 100% by weight composed of the entirety of the components (A) and (B), with the proviso that the polyamide moulding composition is free from grafted impact modifiers.