Patents by Inventor Boum-Seock Kim

Boum-Seock Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11031174
    Abstract: A thin film type inductor includes: a body including a support member including a through hole, upper and lower coils disposed on upper and lower surfaces of the support member, respectively, and a via penetrating through the support member while connecting the upper and lower coils to each other; and external electrodes disposed on an external surface of the body. A coil pattern directly connected to the via may include an inclined surface.
    Type: Grant
    Filed: May 21, 2018
    Date of Patent: June 8, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Hun Kim, Boum Seock Kim, Byeong Cheol Moon
  • Publication number: 20210118605
    Abstract: The coil electronic component includes: a body including a support member having a through-hole, an internal coil disposed on one or more of upper and lower surfaces of the support member, and an encapsulant encapsulating the support member and the internal coil; and external electrodes disposed on an external surface of the body and connected to the internal coil. The internal coil has coil patterns including an innermost and an outermost coil patterns. A portion of cross section of the innermost coil pattern has a different width than a remainder of the cross section of the innermost coil pattern.
    Type: Application
    Filed: December 30, 2020
    Publication date: April 22, 2021
    Inventors: Jae Hun KIM, Byeong Cheol MOON, Boum Seock KIM
  • Publication number: 20210057142
    Abstract: A coil component includes a support substrate, a coil portion including a first conductive layer being in contact with one surface of the support substrate, and a second conductive layer disposed on the first conductive layer to be spaced apart from the one surface of the support substrate, and a body including the support substrate and the coil portion embedded in the body. One side of the first conductive layer is closer to a center of the second conductive layer in a width direction of the coil portion than one side of the second conductive layer.
    Type: Application
    Filed: June 5, 2020
    Publication date: February 25, 2021
    Inventors: Young Min Hur, Dong Ho Han, Boum Seock Kim
  • Patent number: 10847303
    Abstract: A coil component includes a body in which a coil portion is embedded. The coil portion includes a support member; first insulators formed on first and second main surfaces of the support member, respectively, and having an opening having a planar coil shape; coils filling the openings; and second insulators covering the coils.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: November 24, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Hun Kim, Hwa Sung Hwang, Young Ku Lyu, Boum Seock Kim
  • Patent number: 10796840
    Abstract: A coil component includes: a body including a support member, a coil, and a magnetic material; and external electrodes disposed on an external surface of the body. The coil may include first and second coils supported by one surface and the other surface of the support member, respectively, and the first and second coils may include first and second seed patterns, respectively. A thickness of the first seed pattern may be thinner than that of the second seed pattern. Warpage properties of the first support member adjacent to the first seed pattern may be greater than those of the second support member adjacent to the second seed pattern.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: October 6, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Joung Gul Ryu, Boum Seock Kim, Kang Wook Bong, Byeong Cheol Moon
  • Patent number: 10763032
    Abstract: A thin film-type inductor includes a body and a first external electrode and a second external electrode, each disposed on an external surface of the body. The body includes a support member, a first coil, a second coil, a magnetic material surrounding the support member. The first coil is disposed on an upper surface of the support member, and the second coil is disposed on a lower surface of the support member. The support member includes through-hole and a via electrode therein. A portion of one of an upper surface and a lower surface of the via electrode opposes the magnetic material.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: September 1, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Boum Seock Kim, Byeong Cheol Moon, Kang Wook Bong
  • Patent number: 10741321
    Abstract: A thin film type inductor includes first, second and third exposed portions exposed to a first end surface of a body and fourth, fifth and sixth exposed portions exposed to a second end surface of the body opposing the first end surface of the body among external surfaces of the body. The first, second and third exposed portions are formed to be exposed symmetrically to the fourth, fifth and sixth exposed portions opposing the first, second and third exposed portions, respectively.
    Type: Grant
    Filed: January 3, 2018
    Date of Patent: August 11, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Boum Seock Kim, Kang Wook Bong, Byeong Cheol Moon, Joung Gul Ryu
  • Patent number: 10566130
    Abstract: A coil component includes an insulating layer having a coil shape, first and second coil conductor layers on opposing surfaces of the insulating layer, each having a coil shape corresponding to that of the insulating layer, and an encapsulant encapsulating the insulating layer and the first and second coil conductor layers.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: February 18, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kang Wook Bong, Boum Seock Kim, Jae Hun Kim, Jong Sik Yoon, Byeong Cheol Moon
  • Patent number: 10515754
    Abstract: A coil component includes an insulating layer having a coil shape, first and second coil conductor layers on opposing surfaces of the insulating layer, each having a coil shape corresponding to that of the insulating layer, and an encapsulant encapsulating the insulating layer and the first and second coil conductor layers.
    Type: Grant
    Filed: April 14, 2017
    Date of Patent: December 24, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kang Wook Bong, Boum Seock Kim, Jae Hun Kim, Jong Sik Yoon, Byeong Cheol Moon
  • Publication number: 20190378644
    Abstract: A coil component includes an insulating layer having a coil shape, first and second coil conductor layers on opposing surfaces of the insulating layer, each having a coil shape corresponding to that of the insulating layer, and an encapsulant encapsulating the insulating layer and the first and second coil conductor layers.
    Type: Application
    Filed: August 22, 2019
    Publication date: December 12, 2019
    Inventors: Kang Wook BONG, Boum Seock KIM, Jae Hun KIM, Jong Sik YOON, Byeong Cheol MOON
  • Publication number: 20190362886
    Abstract: A coil electronic component includes a body including a support member, an internal coil supported by the support member, and an encapsulant encapsulating the support member and the internal coil, and external electrodes disposed on an external surface of the body and connected to the internal coil, wherein the internal coil includes a plurality of coil patterns, each of the plurality of coil patterns includes a lower coil pattern in contact with the support member and an upper coil pattern on the lower coil pattern, a line width and a thickness of the lower coil pattern are uniform in along the internal coil, and a line width and a thickness of the upper coil pattern are increased in a direction from the center of the internal coil to the outermost portion of the internal coil.
    Type: Application
    Filed: November 6, 2018
    Publication date: November 28, 2019
    Inventors: Kang Wook BONG, Byeong Cheol MOON, Boum Seock KIM
  • Publication number: 20190326055
    Abstract: There are provided a coil component and a method of manufacturing the same. The coil component includes: a body portion including a magnetic material; a coil portion disposed in the body portion; and an electrode portion disposed on the body portion, wherein the coil portion includes a support member having groove portions formed in at least one surface thereof and a coil conductor layer filling the groove portions and protruding onto the at least one surface of the support member, the groove portions having planar spiral shapes.
    Type: Application
    Filed: November 14, 2018
    Publication date: October 24, 2019
    Inventors: Kang Wook BONG, Byeong Cheol MOON, Boum Seock KIM
  • Publication number: 20190221356
    Abstract: A coil component includes: a body in which a coil part is embedded, wherein the coil part includes: a support member; a pattern wall disposed on the support member; and a coil pattern extending between the pattern walls on the support member and including a plurality of winding turns. A width of an intermediate winding turn between innermost and outermost winding turns, among the plurality of winding turns of the coil pattern, is larger than widths of the innermost and outermost winding turns.
    Type: Application
    Filed: August 21, 2018
    Publication date: July 18, 2019
    Inventors: Kang Wook BONG, Mi Geum KIM, Boum Seock KIM
  • Publication number: 20190221358
    Abstract: A coil component includes a body part including a magnetic material; a coil part disposed in the body part; and an electrode part disposed on the body part, wherein the coil part includes a supporting member, a coil conductor disposed on at least one surface of the supporting member and having a conductor pattern of a planar coil shape, and an insulator filling a space between the conductor patterns and covering an outer surface of the conductor pattern, and the conductor pattern has an aspect ratio (H1/W1), which is a ratio of a height H1 to a width W1, of 3 to 9, and a method of manufacturing the same.
    Type: Application
    Filed: March 26, 2019
    Publication date: July 18, 2019
    Inventors: Jae Hun KIM, Young Ku LYU, Boum Seock KIM
  • Publication number: 20190198234
    Abstract: An inductor includes a body including a coil having a support member having a through hole and disposed on at least one surface of the support member, and a magnetic material encapsulating the support member and the coil, and filling the through hole, and external electrodes disposed on external surfaces of the body. The coil includes a plurality of coil patterns and an insulating layer disposed on surfaces of the plurality of coil patterns to insulate the plurality of adjacent coil patterns from each other, and the insulating layer includes a ceramic material.
    Type: Application
    Filed: August 13, 2018
    Publication date: June 27, 2019
    Inventors: Ji Hyung JUNG, Boum Seock KIM, Kang Wook BONG
  • Publication number: 20190180905
    Abstract: A coil component includes: a body including a support member, a coil, and a magnetic material; and external electrodes disposed on an external surface of the body. The coil may include first and second coils supported by one surface and the other surface of the support member, respectively, and the first and second coils may include first and second seed patterns, respectively. A thickness of the first seed pattern may be thinner than that of the second seed pattern. Warpage properties of the first support member adjacent to the first seed pattern may be greater than those of the second support member adjacent to the second seed pattern.
    Type: Application
    Filed: July 5, 2018
    Publication date: June 13, 2019
    Inventors: Joung Gul RYU, Boum Seock KIM, Kang Wook BONG, Byeong Cheol MOON
  • Publication number: 20190180929
    Abstract: An inductor includes a support member; a coil including a plurality of coil patterns disposed on one surface or the other surface of the support member, an insulating layer surrounding the coil, and an encapsulant encapsulating the support member and the coil patterns. At least portions of the insulating layer may be disposed to be recessed from the one surface or the other surface of the support member toward a center of the support member.
    Type: Application
    Filed: July 10, 2018
    Publication date: June 13, 2019
    Inventors: Young Min HUR, Boum Seock KIM, Dong Ho HAN
  • Patent number: 10276294
    Abstract: A coil component includes a body part including a magnetic material; a coil part disposed in the body part; and an electrode part disposed on the body part, wherein the coil part includes a supporting member, a coil conductor disposed on at least one surface of the supporting member and having a conductor pattern of a planar coil shape, and an insulator filling a space between the conductor patterns and covering an outer surface of the conductor pattern, and the conductor pattern has an aspect ratio (H1/W1), which is a ratio of a height H1 to a width W1, of 3 to 9, and a method of manufacturing the same.
    Type: Grant
    Filed: August 4, 2016
    Date of Patent: April 30, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Hun Kim, Young Ku Lyu, Boum Seock Kim
  • Publication number: 20190115142
    Abstract: A thin film type inductor includes: a body including a support member including a through hole, upper and lower coils disposed on upper and lower surfaces of the support member, respectively, and a via penetrating through the support member while connecting the upper and lower coils to each other; and external electrodes disposed on an external surface of the body. A coil pattern directly connected to the via may include an inclined surface.
    Type: Application
    Filed: May 21, 2018
    Publication date: April 18, 2019
    Inventors: Jae Hun KIM, Boum Seock KIM, Byeong Cheol MOON
  • Publication number: 20190088402
    Abstract: The coil electronic component includes: a body including a support member having a through-hole, an internal coil disposed on one or more of upper and lower surfaces of the support member, and an encapsulant encapsulating the support member and the internal coil; and external electrodes disposed on an external surface of the body and connected to the internal coil. The internal coil has coil patterns including an innermost and an outermost coil patterns. A portion of cross section of the innermost coil pattern has a different width than a remainder of the cross section of the innermost coil pattern.
    Type: Application
    Filed: May 8, 2018
    Publication date: March 21, 2019
    Inventors: Jae Hun KIM, Byeong Cheol MOON, Boum Seock KIM