Abstract: There are provided a piezoelectric vibration module and a vibration generating apparatus including the same. The piezoelectric vibration module includes: a piezoelectric actuator including a piezoelectric element deformed in both a first direction and a second direction perpendicular to the first direction through the application of electrical power thereto; at least one first rod transferring deformation force of the piezoelectric actuator in the first direction; at least one second rod converting deformation force of the piezoelectric actuator in the second direction into deformation force in the first direction and transferring the converted deformation force; and a mass body connected to the first and second rods and disposed on the piezoelectric actuator so that displacement is generated in the first direction.

Abstract: Disclosed herein are a method of improving sensitivity of a terrestrial magnetism sensor and an apparatus using the same. A method of forming a terrestrial magnetism sensor includes: cleaning a surface of the terrestrial magnetism sensor; and depositing a thermoelectric material as a thin film on the cleaned surface of the terrestrial magnetism sensor. Therefore, a sensing error of the terrestrial magnetism sensor that has been generated due to heat in the prior art is decreased, thereby making it possible to allow the terrestrial magnetism sensor to calculate an accurate sensing value.

Abstract: The present invention provides an epoxy resin composition for sealing a geomagnetic sensor module, including: an epoxy resin; a curing agent; and a phase change material, and provides a geomagnetic sensor module sealed with the epoxy resin composition. The present invention is advantageous in that a geomagnetic sensor can be maintained at a predetermined temperature because a sealing material including a phase change material is used.

Abstract: Disclosed herein are a Hall sensor and a method of manufacturing the Hall sensor. The Hall sensor includes: a flexible substrate in which a groove is formed; a magnetic field flux concentrator formed in the groove of the flexible substrate; an electrode that is patterned to contact the magnetic field flux concentrator; a passivation layer formed around the electrode; and a sensor layer stacked on the passivation layer.

Abstract: Disclosed herein are a giant magneto-resistive sensor including a free layer stacked on a substrate and having a rotatable magnetic moment; a ferromagnetic fixed layer having a magnetic moment; a pin layer disposed neighboring the fixed layer; and a spacer layer disposed between the free layer and the fixed layer and having a roughness in an interface contacting the fixed layer, and a method of manufacturing the giant magneto-resistive sensor.

Abstract: Disclosed herein is an ultrasonic sensor including: an epoxy molding part: a piezoelectric ceramic stacked on an upper portion of the epoxy molding part; a sound absorbing material contacting sides of the piezoelectric ceramic and spaced apart from an upper portion of the piezoelectric ceramic to thereby enclose the piezoelectric ceramic and absorbing vibration; a case spaced apart from sides and a lower surface of the sound absorbing material to thereby enclose the sound absorbing material and having a shape in which a bottom surface including the epoxy molding part stacked thereon protrudes upwardly; and a molding material filled on an upper surface of the sound absorbing material and between the sides and the lower surface of the sound absorbing material and the case.

Abstract: There is provided an ultrasonic sensor including: a piezoelectric vibration element; and a capacitor integrally formed with the piezoelectric vibration element.

Abstract: Disclosed herein are an ultrasonic sensor and a method of manufacturing the same. The ultrasonic sensor includes: a case having one end closed and the other end opened; a piezoelectric element fixedly coupled to one end of an inner portion of the case; a sound absorbing member coupled to an upper surface of the piezoelectric element so as to cover a portion of the piezoelectric element; a conductive member having one end connected to the piezoelectric element and the other end connected to the sound absorbing member; and a lead wire electrically coupled to the conductive member and the case.

Abstract: There are provided an electronic paper display device and a method for manufacturing the same. The electronic paper display device includes a first substrate having a first electrode made of transparent material and formed thereon; a second substrate arranged opposite to the first substrate with a predetermined space and having a second electrode formed thereon; a display element layer formed between the first substrate and the second substrate and having a plurality of display elements arranged thereon, the display elements having optical characteristics changed by voltage applied to the first and second electrodes; and vibration parts formed on the first substrate or the second substrate and configured to apply vibrations to the display elements by the voltage applied to the first and second electrodes.

Abstract: Disclosed herein is an ultrasonic sensor, including: a case partitioning an inner space; a temperature-compensation ceramic maintaining a temperature of a sensor to be constant; sockets accommodating the temperature-compensation ceramic; a negative (?) terminal and a positive (+) terminal connected to the sockets, respectively; a piezoelectric ceramic connected to the positive (+) terminal and vibrating when power is supplied thereto; and an acoustic absorbent absorbing vibration of the piezoelectric ceramic.

Abstract: There is provided a haptic feedback device and an electronic device having the same. The haptic feedback device includes a display panel receiving contact pressure applied thereto; an actuator generating vibrations so as to give different types of haptic feedback according to a change in the contact pressure applied to the display panel; a support plate supporting the actuator; a bonding portion provided between an end portion of the actuator in a lengthwise direction thereof and the support plate so as to fix the actuator to the support plate; and a vibration space expanding portion formed to be recessed in a portion of the support plate corresponding to the actuator.

Abstract: Disclosed herein are a multi-sensing apparatus and a method thereof. The multi-sensing apparatus includes a plurality of ultrasonic sensors including a wave transmission unit transmitting an ultrasonic wave signal of a corresponding transmission frequency, and a wave reception unit receiving and outputting the ultrasonic wave signal transmitted from the wave transmission unit, and an analyzed integrated circuit controlling each of the wave transmission units of the plurality of ultrasonic sensors to transmit the ultrasonic wave signal of the corresponding transmission frequency, receiving an ultrasonic reflected signal received from each of the reception wave units, and computing and outputting a distance of an object sensed by a corresponding ultrasonic sensor using a time difference between a transmission time and a reception time.

Abstract: Disclosed herein are an ultrasonic sensor including: a cylindrical case; a piezoelectric element; a sound absorbing material; a temperature compensation capacitor inserted into and fixed to the groove; a first pin terminal connected to one electrode of the temperature compensation capacitor and an exposed electrode of the piezoelectric element while penetrating through the groove of the sound absorbing material; a second pin terminal inserted into and fixed to the groove of the sound absorbing material and connected to the other electrode of the temperature compensation capacitor; and a lead wire inserted into and fixed to the groove of the sound absorbing material and having one terminal connected to the second pin terminal and the other terminal connected to an inner wall of the case, and a method for manufacturing the same.

Abstract: Disclosed herein is an ultrasonic sensor including: a cylindrical case; a piezoelectric element disposed on a bottom surface of an inner portion of the case; first and second terminals to which each of positive and negative voltages is applied from the outside; a connection member including a conductive member having a first area to which the first terminal is connected and a second area to which the second terminal is connected and a support member adhered to a lower surface of the conductive member; and a temperature compensation element penetrating between the first and second areas of the conductive member and being then inserted into the support member.

Abstract: Disclosed herein is an ultrasonic sensor including: an epoxy molding part: a piezoelectric ceramic stacked on an upper portion of the epoxy molding part; a sound absorbing material contacting sides of the piezoelectric ceramic and spaced apart from an upper portion of the piezoelectric ceramic to thereby enclose the piezoelectric ceramic and absorbing vibration; a case spaced apart from sides and a lower surface of the sound absorbing material to thereby enclose the sound absorbing material and having a shape in which a bottom surface including the epoxy molding part stacked thereon protrudes upwardly; and a molding material filled on an upper surface of the sound absorbing material and between the sides and the lower surface of the sound absorbing material and the case.

Abstract: Disclosed herein is an ultrasonic sensor including: a conductive case; a piezoelectric element fixed to a bottom surface of the case through a conductive adhesive; a temperature compensation capacitor positioned on the piezoelectric element; a first lead wire and electrically connected to one surface of the temperature compensation capacitor; a first wire electrically connecting one surface of the temperature compensation capacitor and the case to each other; a second lead wire and electrically connected to the other surface of the temperature compensation capacitor; a second wire electrically connecting the other surface of the temperature compensation capacitor and an upper surface of the piezoelectric element to each other; and a fixing part fixing the first lead wire and the first wire to one surface of the temperature compensation capacitor and fixing the second lead wire and the second wire to the other surface thereof.

Abstract: Disclosed herein are a case for an ultrasonic sensor and an ultrasonic sensor using the same. The case for an ultrasonic sensor has a cylindrical shape and includes a disposition area of a piezoelectric element and a first groove formed in an inner side bottom surface thereof, wherein the first groove is formed along an edge of the disposition area of the piezoelectric element.

Abstract: Disclosed herein is an ultrasonic sensor including: a case; a piezoelectric element mounted on an inner side bottom surface of the case; a first sound absorbing material having a through-hole formed at an area thereof corresponding to a mounting area of the piezoelectric element and including the piezoelectric element disposed at a portion thereof based on a thickness of the through-hole; and a second sound absorbing material formed on the first sound absorbing material so as to cover the entire surface of the first sound absorbing material including the through-hole, wherein the through-hole formed has a thickness thicker than that of the piezoelectric element.

Abstract: Disclosed herein is an ultrasonic sensor including: a case including an inner space formed therein and including an electrode layer formed on an inner side wall surface thereof; a piezoelectric element seated on the electrode layer on a lower surface of the case, configured in a stack type, and including anode and cathode terminals formed on an outer peripheral surface thereof; a sound absorbing material fixed to an upper portion of the piezoelectric element; and first and second lead wires led from the outside of the case and electrically connected to the electrode layer formed on the inner side wall surface of the case.

Abstract: Disclosed herein is an ultrasonic sensor including: a case including an inner space formed therein; a substrate seated on a bottom surface of the case in the inner space thereof and including a plurality of piezoelectric elements and temperature compensation capacitors mounted in a row therein; and a sound absorbing material mounted on an upper portion of the substrate.