Patents by Inventor Bowei Zhang

Bowei Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8111128
    Abstract: A method for arranging a plurality of thermally isolated microstructures over at least one cavity, each of the microstructures housing at least part of a thermally-trimmable resistor, the thermally-trimmable resistor having at least a functional resistor, the method comprising: providing pairs of facing microstructures; grouping together sets of pairs of facing microstructures, each of the sets having at least one pair of facing microstructures; and arranging microstructures within a given set to have each microstructure exposed to heat from a same number of facing, side, and diagonal neighbors of microstructures from a same resistor.
    Type: Grant
    Filed: February 6, 2008
    Date of Patent: February 7, 2012
    Assignee: Sensortechnics GmbH
    Inventors: Oleg Grudin, Salman Saed, Tommy Tsang, Bowei Zhang, Leslie M. Landsberger, L. Richard Williston
  • Publication number: 20110220631
    Abstract: There is described a method for stabilizing a post-trimming resistance of a thermally isolated electrical component made from a thermally mutable material, the method comprising: generating at least one heating pulse, the at least one heating pulse having an initial amplitude corresponding to a trimming temperature, a slope corresponding to a given cooling rate and a duration corresponding to a given cooling time; and applying the at least one heating pulse to one of the thermally isolated electrical component and a heating device in heat transfer communication with the thermally isolated electrical component, after a trimming process, in order to cause the electrical component to cool in accordance with the given cooling rate, the given cooling rate being slower than a passive cooling rate determined by the thermal isolation of the electrical component
    Type: Application
    Filed: March 16, 2009
    Publication date: September 15, 2011
    Inventors: Oleg Grudin, Yougui Liao, Leslie M. Landsberger, Gennadiy Frolov, Lyudmila Grudina, Gerald Arzoumanian, Saed Salman, Tommy Tsang, Bowei Zhang
  • Publication number: 20100073121
    Abstract: A method for arranging a plurality of thermally isolated microstructures over at least one cavity, each of the microstructures housing at least part of a thermally-trimmable resistor, the thermally-trimmable resistor having at least a functional resistor, the method comprising: providing pairs of facing microstructures; grouping together sets of pairs of facing microstructures, each of the sets having at least one pair of facing microstructures; and arranging microstructures within a given set to have each microstructure exposed to heat from a same number of facing, side, and diagonal neighbors of microstructures from a same resistor.
    Type: Application
    Filed: February 6, 2008
    Publication date: March 25, 2010
    Applicant: MICROBRIDGE TECHNOLOGIES INC.
    Inventors: Oleg Grudin, Salman Saed, Tommy Tsang, Bowei Zhang, Leslie M. Landsberger, L. Richard Williston