Patents by Inventor Brandon A. Rubenstein
Brandon A. Rubenstein has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10519960Abstract: A fan failure detection and reporting system organizes fans having similar characteristics into groups. The system establishes, for a given fan group, one or more reference characteristics and identifies, for each reference characteristic, a measure of tolerance. The system identifies as a problem fan a fan having a performance characteristic, obtained via monitoring, which exceeds a corresponding reference characteristic for the group to which the fan belongs by the measure of tolerance for the corresponding reference characteristic, and generates a notification that at least identifies the problem fan. In embodiments, the system is capable of determining the fan characteristics that are used for grouping and for identifying problem fans by monitoring the fans during operation thereof. Consequently, the system is capable of detecting problem fans even when the system initially has limited or no knowledge concerning the fans.Type: GrantFiled: June 7, 2016Date of Patent: December 31, 2019Assignee: Microsoft Technology Licensing LLCInventors: Bryan D. Kelly, Brandon A. Rubenstein
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Publication number: 20170350403Abstract: A fan failure detection and reporting system is described. The system organizes fans having similar characteristics into groups. The system establishes, for a given fan group, one or more reference characteristics and identifies, for each reference characteristic, a measure of tolerance. The system identifies as a problem fan a fan having a performance characteristic, obtained via monitoring, which exceeds a corresponding reference characteristic for the group to which the fan belongs by the measure of tolerance for the corresponding reference characteristic, and generates a notification that at least identifies the problem fan. In embodiments, the system is capable of determining the fan characteristics that are used for grouping and for identifying problem fans by monitoring the fans during operation thereof. Consequently, the system is capable of detecting problem fans even when the system initially has limited or no knowledge concerning the fans.Type: ApplicationFiled: June 7, 2016Publication date: December 7, 2017Inventors: Bryan D. Kelly, Brandon A. Rubenstein
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Patent number: 9606586Abstract: A heat transfer device is described. In one or more implementations, a device includes a housing that is moveable through a plurality of orientations involving at least two dimensions during usage, a heat-generating device disposed within the housing, and a heat transfer device disposed within the housing. The heat transfer device has a plurality of heat pipes configured to transfer heat using thermal conductivity and phase transition from the heat-generating device, the plurality of heat pipes arranged to provide generally uniform heat transfer from the heat-generating device during movement of the housing through the plurality of orientations.Type: GrantFiled: January 23, 2012Date of Patent: March 28, 2017Assignee: Microsoft Technology Licensing, LLCInventor: Brandon A. Rubenstein
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Patent number: 8934235Abstract: A heat transfer device is described. In one or more implementations, a heat transfer device includes a heat sink and a thermal storage enclosure disposed proximal to at least a portion of the heat sink. The thermal storage enclosure configured to be disposed proximal to a heat-generating component of a device. The thermal storage enclosure includes a phase change material configured to have a melting temperature that is below a temperature at which a cooling fan of the device is set to operate to cool the heat-generating device.Type: GrantFiled: January 23, 2012Date of Patent: January 13, 2015Assignee: Microsoft CorporationInventors: Brandon A. Rubenstein, Jeffrey Taylor Stellman
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Publication number: 20140277821Abstract: Indirect thermal fan control is described. In one or more implementations, a speed of a fan may be adjusted based on indirect measurements of temperature. For example, a temperature of air entering an enclosure and a current draw of an electrical component within the enclosure may be determined. A speed of a fan may then be adjusted based on the temperature of the air and the current draw of the component to change a flow of the air over the electrical component.Type: ApplicationFiled: June 2, 2014Publication date: September 18, 2014Applicant: Microsoft CorporationInventor: Brandon A. Rubenstein
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Patent number: 8768532Abstract: Indirect thermal fan control is described. In one or more implementations, a speed of a fan may be adjusted based on indirect measurements of temperature. For example, a temperature of air entering an enclosure and a current draw of an electrical component within the enclosure may be determined. A speed of a fan may then be adjusted based on the temperature of the air and the current draw of the component to change a flow of the air over the electrical component.Type: GrantFiled: July 15, 2011Date of Patent: July 1, 2014Assignee: Microsoft CorporationInventor: Brandon A. Rubenstein
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Publication number: 20130186596Abstract: A heat transfer device is described. In one or more implementations, a heat transfer device includes a heat sink and a thermal storage enclosure disposed proximal to at least a portion of the heat sink. The thermal storage enclosure configured to be disposed proximal to a heat-generating component of a device. The thermal storage enclosure includes a phase change material configured to have a melting temperature that is below a temperature at which a cooling fan of the device is set to operate to cool the heat-generating device.Type: ApplicationFiled: January 23, 2012Publication date: July 25, 2013Applicant: MICROSOFT CORPORATIONInventors: Brandon A. Rubenstein, Jeffrey Taylor Stellman
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Publication number: 20130186598Abstract: A heat transfer device is described. In one or more implementations, a device includes a housing that is moveable through a plurality of orientations involving at least two dimensions during usage, a heat-generating device disposed within the housing, and a heat transfer device disposed within the housing. The heat transfer device has a plurality of heat pipes configured to transfer heat using thermal conductivity and phase transition from the heat-generating device, the plurality of heat pipes arranged to provide generally uniform heat transfer from the heat-generating device during movement of the housing through the plurality of orientations.Type: ApplicationFiled: January 23, 2012Publication date: July 25, 2013Applicant: MICROSOFT CORPORATIONInventor: Brandon A. Rubenstein
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Publication number: 20130063368Abstract: In embodiments of touch-screen surface temperature control, a computing device includes a touch-screen display with a touch surface for user interaction. The computing device also includes a cooling system that cools a surface temperature on the touch surface of the touch-screen display. A temperature service is implemented to activate the cooling system to decrease the surface temperature on the touch surface of the display based on projected user interaction with the touch surface of the touch-screen display.Type: ApplicationFiled: September 14, 2011Publication date: March 14, 2013Applicant: MICROSOFT CORPORATIONInventors: Avi R. Geiger, Brandon A. Rubenstein
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Publication number: 20130018523Abstract: Indirect thermal fan control is described. In one or more implementations, a speed of a fan may be adjusted based on indirect measurements of temperature. For example, a temperature of air entering an enclosure and a current draw of an electrical component within the enclosure may be determined. A speed of a fan may then be adjusted based on the temperature of the air and the current draw of the component to change a flow of the air over the electrical component.Type: ApplicationFiled: July 15, 2011Publication date: January 17, 2013Inventor: Brandon A. Rubenstein
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Patent number: 7480143Abstract: A method of transferring heat from a heat source to a heat sink using a variable-gap thermal-interface device is provided. The method comprises providing and rotating a multi-axis rotary spherical joint to an orientation to compensate for misalignment between the heat source and heat sink. The method further comprises providing a shim of thickness sufficient to fill a gap between the heat source and multi-axis rotary spherical joint, and inserting the shim to fill the gap.Type: GrantFiled: April 21, 2003Date of Patent: January 20, 2009Assignee: Hewlett-Packard Development Company, L.P.Inventors: Andrew D. Delano, Brandon A. Rubenstein, Eugene Miksch
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Patent number: 7408788Abstract: Disclosed is a device for insertion and removal of a circuit board into a mating connector positioned within a housing, the device having a first end for pivotal engagement with the circuit board and adapted to mate with a front surface of the housing when the circuit board to which the device is pivotally engaged begins to engage the connector, and a second end disposed longitudinally from the first end and adapted with a latch for releasably mating with a protrusion on the board such that when the board is engaged with the connector the second end becomes releasably mated to the protrusion thereby latching the board to the connector.Type: GrantFiled: March 5, 2003Date of Patent: August 5, 2008Assignee: Hewlett-Packard Development Company, L.P.Inventor: Brandon A. Rubenstein
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Patent number: 7270572Abstract: Systems, methodologies, media, and other embodiments associated with connecting a cable to a computer component are described. One exemplary system embodiment includes a component connector comprising at least one signal pin and a plurality of ground pins positioned along a parameter of the at least one signal pin to surround the at least one signal pin. The example system may also include a receptacle connected to and in electrical contact with the plurality of ground pins. The receptacle can be configured with an opening to allow a cable connector to connect to the at least one signal pin.Type: GrantFiled: July 30, 2004Date of Patent: September 18, 2007Assignee: Hewlett-Packard Development Company, L.P.Inventors: Brandon A. Rubenstein, Robert Blakely
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Patent number: 7233497Abstract: A heat sink surface mounts to a printed circuit board in direct separation, thermal and physical, from components on the board. The heat sink cools the components by conducting heat from the components through the printed circuit board to the heat sink.Type: GrantFiled: October 6, 2004Date of Patent: June 19, 2007Assignee: Hewlett-Packard Development Company, L.P.Inventors: Glenn C. Simon, Derek S. Schumacher, Brandon A. Rubenstein
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Patent number: 6985359Abstract: A variable-gap thermal-interface device for transferring heat from a heat source to a heat sink is provided. The device comprises a multi-axis rotary spherical joint comprising a spherically concave surface having a first radius of curvature in slideable contact with a spherically convex surface having the same first radius of curvature. The device further comprises a block having a proximal end rotatably coupled with the heat sink through the rotary spherical joint and having a distal end opposite the proximal end. The device further comprises a wedge having a variable thickness separating a first surface and a second surface opposite and inclined relative to the first surface, such that the first surface is thermally coupled with the distal end of the block, and the second surface is thermally coupled with the heat source.Type: GrantFiled: April 21, 2003Date of Patent: January 10, 2006Assignee: Hewlett-Packard Development Company, L.P.Inventors: Andrew D. Delano, Bradley E. Clements, Brandon A. Rubenstein
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Patent number: 6967843Abstract: Disclosed is an electronic board comprising a plurality of individual devices, each device having a plurality of connectors, the connectors mated to receptacles on the board, and a heat dissipating cover connected to the board and forming a cavity incarcerating the plurality of devices, the cover thermally contacting a plurality of the individual devices, the cover having a dimensional pattern such that its outer surface area is greater than its planar area.Type: GrantFiled: February 11, 2003Date of Patent: November 22, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: Brandon A. Rubenstein, Bradley E. Clements
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Patent number: 6948235Abstract: In one embodiment, an apparatus for facilitating installation of a shroud on a pin grid comprises a first alignment structure including a first plurality of longitudinal elements adapted to be inserted within each gap of the pin grid along a first direction and a first handle extending in a perpendicular manner to the plurality of longitudinal elements, and a second alignment structure including a second plurality of longitudinal elements adapted to be inserted within each gap of the pin grid along a second direction and a second handle extending in a perpendicular manner to the second plurality of longitudinal elements, wherein when the first alignment structure and the second alignment structures are inserted within the pin grid, the first and second handles form at least a partial frame structure to receive the shroud in a position to receive pins of the pin grid.Type: GrantFiled: April 22, 2004Date of Patent: September 27, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: Brandon A. Rubenstein, Bradley E. Clements
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Publication number: 20040206478Abstract: A variable-gap thermal-interface device for transferring heat from a heat source to a heat sink is provided. The device comprises a multi-axis rotary spherical joint comprising a spherically concave surface having a first radius of curvature in slideable contact with a spherically convex surface having the same first radius of curvature. The device further comprises a block having a proximal end rotatably coupled with the heat sink through the rotary spherical joint and having a distal end opposite the proximal end. The device further comprises a wedge having a variable thickness separating a first surface and a second surface opposite and inclined relative to the first surface, such that the first surface is thermally coupled with the distal end of the block, and the second surface is thermally coupled with the heat source.Type: ApplicationFiled: April 21, 2003Publication date: October 21, 2004Inventors: Andrew D. Delano, Bradley E. Clements, Brandon A. Rubenstein
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Publication number: 20040207985Abstract: A method of transferring heat from a heat source to a heat sink using a variable-gap thermal-interface device is provided. The method comprises providing and rotating a multi-axis rotary spherical joint to an orientation to compensate for misalignment between the heat source and heat sink. The method further comprises providing a shim of thickness sufficient to fill a gap between the heat source and multi-axis rotary spherical joint, and inserting the shim to fill the gap.Type: ApplicationFiled: April 21, 2003Publication date: October 21, 2004Inventors: Andrew D. Delano, Brandon A. Rubenstein, Eugene Miksch
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Publication number: 20040207986Abstract: A system for heat sink hold-down is provided. The system comprises a heat source; and a heat sink hold-down assembly. The assembly comprises a bolster plate to rigidly support the heat source and a heat sink. The heat sink comprises a heat sink base operable to transfer heat and to press the heat source against the bolster plate, and a longitudinal post having a first end attached substantially orthogonally near the center of said heat sink base. The post is operable to transfer a compressive force substantially symmetrically to the heat sink base. The assembly further comprises a lever spring contacting the second end of the post. The lever spring is operable to apply a compressive force to the post in response to a bending moment. The assembly further comprises a cap rigidly coupled to the bolster plate and operable to apply a bending moment to the lever spring.Type: ApplicationFiled: April 21, 2003Publication date: October 21, 2004Inventor: Brandon A. Rubenstein