Abstract: In embodiments of touch-screen surface temperature control, a computing device includes a touch-screen display with a touch surface for user interaction. The computing device also includes a cooling system that cools a surface temperature on the touch surface of the touch-screen display. A temperature service is implemented to activate the cooling system to decrease the surface temperature on the touch surface of the display based on projected user interaction with the touch surface of the touch-screen display.

Abstract: Indirect thermal fan control is described. In one or more implementations, a speed of a fan may be adjusted based on indirect measurements of temperature. For example, a temperature of air entering an enclosure and a current draw of an electrical component within the enclosure may be determined. A speed of a fan may then be adjusted based on the temperature of the air and the current draw of the component to change a flow of the air over the electrical component.

Abstract: Flow measurement systems and methods are provided. A flow measurement system can include at least one heat-producing computing device (160) having at least one fluid inlet (120) and one fluid outlet (130). The system can further include at least one inlet fluid inlet temperature sensor (140) and at least one outlet fluid temperature sensor (150). At least one current sensor (160) measuring the current supplied to at least a portion of the at least one heat-producing computing device (110) can also be included with the system (100). The system can also include at least one calculating device (180) adapted to calculate the inlet fluid flow rate based at least in part upon the sensed inlet fluid temperature, the sensed outlet fluid temperature, and the sensed current flow.

Abstract: An embodiment of a system and method disaggregate I/O resources from a server's compute resources, such as CPU and memory, by moving the server's local I/O devices to a remote location apart from the server's compute resources. An embodiment uses optical technology to accomplish the fast communication speeds needed between the compute resources and the remotely located I/O resources. Specifically, an embodiment uses fiber-optic cables and electrical-to-optical conversion to facilitate communication between the compute resources and the I/O resources. The compute resources and the remotely located I/O resources can be designed differently to allow conductive liquid cooling for the compute resources and air cooling for the I/O resources.

Abstract: Methods and means related to rejecting heat through thermal storage are provided. A heat sink includes internal cavities containing a phase-change material. Heat from a thermal load is rejected by flowing fluid coolant at a normal operating temperature. Failure of the fluid coolant system causes heat storage within the phase-change material at a temperature slightly greater than the normal operating temperature. Restoration of the fluid coolant system results in stored heat rejection and a return to a normal operating temperature. Normal operation of the thermal load can be performed while efforts are made to restore the fluid coolant system.

Abstract: A cooling system for a blade enclosure is disclosed. The cooling system comprises a thermal bus bar (TBB) 1220 positioned in the middle of the blade enclosure. The TBB 122 has a front face and a back face. When blades are inserted into the blade enclosure, a heat transfer plate 584 on the blade makes thermal contact with either the front or back face of the TBB 122. The TBB 122 is cooled, thereby cooling the blades.

Abstract: A cooling apparatus for a printed circuit board assembly is disclosed. The cooling apparatus comprises a main printed circuit (PC) board 202. The main PC board 202 has a plurality of connectors 210 mounted, in a parallel row, onto the top side of the main PC board 202. A first liquid cooling manifold 204 is positioned along one end of the parallel row of connectors 210 and a second liquid cooling manifold 206 is positioned along the other end of the parallel row of connectors 210. A plurality of heat sink devices 208, each having an elongated shape, run parallel to, and on each side of, the plurality of connectors 210. The plurality of heat sink devices 208 are coupled to the first and second liquid cooling manifolds.

Abstract: One embodiment of the present invention employs two articulated cable-management arms, each articulated cable-management arm pivotally mounted, at a first end, to a system frame or rack and pivotally mounted, at a second end, to a component-system enclosure or sliding component-system-enclosure mount. The articulated cable-management arms provide mechanical channels through which cables connected to the back of a component-system enclosure are routed together to a structural member of the rack or frame.

Abstract: A cooling apparatus is disclosed. The cooling apparatus comprising a printed circuit (PC) board with an integrated circuit (IC) socket mounted onto the top side of the PC board. A mounting frame generally in the shape of a plate, with a first opening passing through the center of the plate, is mounted on the top side of the PC board with the IC socket located inside the first opening. A cold plate is attached to the mounting frame, the cold plate has an opening that passes through the cold plate. The opening in the cold plate is sized to allow an IC to be inserted into the IC socket through the opening. A fluid passageway is formed inside the cold plate. A fluid inlet port and a fluid outlet port are mounted on the cold plate and coupled to a first end and a second end of the fluid passageway, respectively. A heat spreader is removably attached to the top side of the cold plate wherein the bottom side of the heat spreader is configured to contact the top side of an IC when the IC is mounted in the IC socket.

Abstract: An apparatus comprising a heat dispersion device having a first end. The first end has a shape different than that of the remainder of the heat dispersion device. The apparatus also comprises a jacket coupled to the heat dispersion device at the first end. The jacket has another shape associated with that of the remainder of the heat dispersion device.

Abstract: A cooling system for a computer blade is disclosed. The cooling system comprises a main printed circuit (PC) board with at least one component mounted on a top side of the main PC board. A heat transfer plate is located at the first end of the main PC board. An airflow divider is mounted on, and is perpendicular with, the top side of the main PC board. The airflow divider runs in an axis generally parallel with the first side of the main PC board. A lid is coupled to the main PC board thereby enclosing the main PC board, the heat transfer plate and the airflow divider. The lid encloses a first airflow channel running along the first side of the main PC board and a second airflow channel running along the second side of the main PC board. A fan is located on top side of the main PC board in the first airflow channel. The fan is configured to re-circulate air from the second airflow channel through the first airflow channel, past the heat transfer plate, and then back into the second airflow channel.

Abstract: Example systems and methods associated with positioning and securing an electronic module to a circuit board are described. In one embodiment, an electronic module comprises at least one connectible portion configured to connect to a circuit board and at least one extended portion having an opening therethrough. In one example, the opening can be configured to maintain a threaded device and to allow the threaded device to move within the opening. The threaded device can be configured to engage a securing device for adjustably securing the at least one extended portion to the circuit board.

Abstract: A subassembly of an apparatus, in one example, includes a first body member and a bias member. A fastener extending through the subassembly applies a compression force to the subassembly. A precompression member is engageable with the subassembly and the bias member so as to impart a precompression force to the bias member. In one example, the fastener is a screw engageable with a threaded plate and biased by a leaf spring which is precompressed to facilitate initial engagement of the screw and the threaded plate.

Abstract: An apparatus for protecting an array of pins of an electronic device is provided. The apparatus includes a pin protector defining an array of holes therethrough, wherein each hole is configured to receive one of the pins. The apparatus also comprises a spring element configured to bias the pin protector away from the electronic device toward an end of each of the pins. The spring element is also configured to allow the pin protector to be retracted toward the electronic device to expose the pins for insertion into a socket or similar component.

Abstract: An apparatus for protecting an array of pins of an electronic device is provided. The apparatus includes a pin protector defining an array of holes therethrough, wherein each hole is configured to receive one of the pins. The apparatus also comprises a spring element configured to bias the pin protector away from the electronic device toward an end of each of the pins. The spring element is also configured to allow the pin protector to be retracted toward the electronic device to expose the pins for insertion into a socket or similar component.

Abstract: An apparatus comprising a heat dispersion device having a first end. The first end has a shape different than that of the remainder of the heat dispersion device. The apparatus also comprises a jacket coupled to the heat dispersion device at the first end. The jacket has another shape associated with that of the remainder of the heat dispersion device.

Abstract: A method of transferring heat from a heat source to a heat sink using a variable-gap thermal-interface device is provided. The method comprises providing and rotating a multi-axis rotary spherical joint to an orientation to compensate for misalignment between the heat source and heat sink. The method further comprises providing a shim of thickness sufficient to fill a gap between the heat source and multi-axis rotary spherical joint, and inserting the shim to fill the gap.

Abstract: An apparatus and method for installing an electrical support structure, such as a printed circuit board or card within a computerized device, are disclosed. In at least some embodiments, the apparatus includes a first structure, a second structure supported by the first structure and capable of movement with respect to the first structure along a first direction, and a third structure slidingly supported by the second structure. Sliding motion of the third structure with respect to the second structure results in movement of the third structure relative to the first structure that is along a second direction different from the first direction.

Abstract: Disclosed is a device for insertion and removal of a circuit board into a mating connector positioned within a housing, the device having a first end for pivotal engagement with the circuit board and adapted to mate with a front surface of the housing when the circuit board to which the device is pivotally engaged begins to engage the connector, and a second end disposed longitudinally from the first end and adapted with a latch for releasably mating with a protrusion on the board such that when the board is engaged with the connector the second end becomes releasably mated to the protrusion thereby latching the board to the connector.

Abstract: A processor module includes a processor and a voltage regulator both mounted on a carrier. The voltage regulator is mounted with its contacts under compression to ensure good electrical contact with pads on the carrier. Heat sinks mounted respectively on the processor and the voltage regulator are rigidly coupled to each other to provide rigidity to the module and thus maintain the desired compression of the voltage regulator contacts.