Patents by Inventor Brennan Peterson
Brennan Peterson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240126181Abstract: A method including obtaining (i) measurements of a parameter of the feature, (ii) data related to a process variable of a patterning process, (iii) a functional behavior of the parameter defined as a function of the process variable based on the measurements of the parameter and the data related to the process variable, (iv) measurements of a failure rate of the feature, and (v) a probability density function of the process variable for a setting of the process variable, converting the probability density function of the process variable to a probability density function of the parameter based on a conversion function, where the conversion function is determined based on the function of the process variable, and determining a parameter limit of the parameter based on the probability density function of the parameter and the measurements of the failure rate.Type: ApplicationFiled: November 16, 2023Publication date: April 18, 2024Applicant: ASML NETHERLANDS B.V.Inventors: Abraham SLACHTER, Stefan HUNSCHE, Wim Tjibbo TEL, Anton Bernhard VAN OOSTEN, Koenraad VAN INGEN SCHENAU, Gijsbert RISPENS, Brennan PETERSON
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Publication number: 20240108107Abstract: A trekking pole or the like includes a grip top fixed at the top end. A user's glove supports a puck. The puck is placed on a release button then slid into a locking channel on the grip top, from the release button into the locking channel. Thereafter, the release button automatically locks the puck in the channel. When the release button is pressed down, the puck can be removed. A magnet on the release button can assist in locating the puck properly on the release button and also in withdrawing the puck from the locking channel.Type: ApplicationFiled: September 26, 2023Publication date: April 4, 2024Inventors: Kenneth Peterson, Lucy Davis, Jonathan Cohen, Brennan Wade
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Patent number: 11822255Abstract: A method including obtaining (i) measurements of a parameter of the feature, (ii) data related to a process variable of a patterning process, (iii) a functional behavior of the parameter defined as a function of the process variable based on the measurements of the parameter and the data related to the process variable, (iv) measurements of a failure rate of the feature, and (v) a probability density function of the process variable for a setting of the process variable, converting the probability density function of the process variable to a probability density function of the parameter based on a conversion function, where the conversion function is determined based on the function of the process variable, and determining a parameter limit of the parameter based on the probability density function of the parameter and the measurements of the failure rate.Type: GrantFiled: July 30, 2021Date of Patent: November 21, 2023Assignee: ASML Netherlands B.V.Inventors: Abraham Slachter, Stefan Hunsche, Wim Tjibbo Tel, Anton Bernhard Van Oosten, Koenraad Van Ingen Schenau, Gijsbert Rispens, Brennan Peterson
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Patent number: 11187994Abstract: A method for controlling a manufacturing process for manufacturing semiconductor devices, the method including: obtaining performance data indicative of the performance of the manufacturing process, the performance data including values for a performance parameter across a substrate subject to the manufacturing process; and determining a process correction for the manufacturing process based on the performance data and at least one control characteristic related to a dynamic behavior of one or more control parameters of the manufacturing process, wherein the determining is further based on an expected stability of the manufacturing process when applying the process correction.Type: GrantFiled: July 3, 2019Date of Patent: November 30, 2021Assignee: ASML Netherlands B.V.Inventors: Mohammad Reza Kamali, Brennan Peterson
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Publication number: 20210356874Abstract: A method including obtaining (i) measurements of a parameter of the feature, (ii) data related to a process variable of a patterning process, (iii) a functional behavior of the parameter defined as a function of the process variable based on the measurements of the parameter and the data related to the process variable, (iv) measurements of a failure rate of the feature, and (v) a probability density function of the process variable for a setting of the process variable, converting the probability density function of the process variable to a probability density function of the parameter based on a conversion function, where the conversion function is determined based on the function of the process variable, and determining a parameter limit of the parameter based on the probability density function of the parameter and the measurements of the failure rate.Type: ApplicationFiled: July 30, 2021Publication date: November 18, 2021Applicant: ASML NETHERLANDS B.V.Inventors: Abraham SLACHTER, Stefan HUNSCHE, Wim Tjibbo TEL, Anton Bernhard VAN OOSTEN, Koenraad VAN INGEN SCHENAU, Gijsbert RISPENS, Brennan PETERSON
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Patent number: 11087065Abstract: A method for controlling a processing apparatus used in a semiconductor manufacturing process to form a structure on a substrate, the method including: obtaining a relationship between a geometric parameter of the structure and a performance characteristic of a device including the structure; and determining a process setting for the processing apparatus associated with a location on the substrate, wherein the process setting is at least partially based on an expected value of the geometric parameter of the structure when using the processing setting, a desired performance characteristic of the device and an expected physical yield margin or defect yield margin associated with the location on the substrate.Type: GrantFiled: August 15, 2019Date of Patent: August 10, 2021Assignee: ASML Netherlands B.V.Inventors: Sunit Sondhi Mahajan, Abraham Slachter, Brennan Peterson, Koen Wilhelmus Cornelis Adrianus Van Der Straten, Antonio Corradi, Pieter Joseph Marie Wöltgens
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Patent number: 11079687Abstract: A method including obtaining (i) measurements of a parameter of the feature, (ii) data related to a process variable of a patterning process, (iii) a functional behavior of the parameter defined as a function of the process variable based on the measurements of the parameter and the data related to the process variable, (iv) measurements of a failure rate of the feature, and (v) a probability density function of the process variable for a setting of the process variable, converting the probability density function of the process variable to a probability density function of the parameter based on a conversion function, where the conversion function is determined based on the function of the process variable, and determining a parameter limit of the parameter based on the probability density function of the parameter and the measurements of the failure rate.Type: GrantFiled: December 17, 2018Date of Patent: August 3, 2021Assignee: ASML Netherlands B.V.Inventors: Abraham Slachter, Stefan Hunsche, Wim Tjibbo Tel, Anton Bernhard Van Oosten, Koenraad Van Ingen Schenau, Gijsbert Rispens, Brennan Peterson
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Publication number: 20210088917Abstract: A measurement mark is disclosed. According to certain embodiments, the measurement mark includes a set of first test structures developed in a first layer on a substrate, each of the set of first test structures comprising a plurality of first features made of first conducting material. The measurement mark also includes a set of second test structures developed in a second layer adjacent to the first layer, each of the set of second test structures comprising a plurality of second features made of second conducting material. The measurement mark is configured to indicate connectivity between the set of first test structures and associated second test structures in the set of second test structures when imaged using a voltage-contrast imaging method.Type: ApplicationFiled: December 7, 2018Publication date: March 25, 2021Inventors: Cyrus Emil TABERY, Simon Hendrik Celine VAN GORP, Simon Philip Spencer HASTINGS, Brennan PETERSON
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Patent number: 10948837Abstract: An apparatus for determining information relating to at least one target alignment mark in a semiconductor device substrate. The target alignment mark is initially at least partially obscured by an opaque carbon or metal layer on the substrate. The apparatus includes an energy delivery system configured to emit a laser beam for modifying at least one portion of the opaque layer to cause a phase change and/or chemical change in the at least one portion that increases the transparency of the portion. An optical signal can propagate through the modified portion to determine information relating to the target alignment mark.Type: GrantFiled: June 18, 2018Date of Patent: March 16, 2021Assignee: ASML Netherlands B.V.Inventors: An Gao, Sanjaysingh Lalbahadoersing, Andrey Alexandrovich Nikipelov, Alexey Olegovich Polyakov, Brennan Peterson
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Publication number: 20210018850Abstract: A method including obtaining (i) measurements of a parameter of the feature, (ii) data related to a process variable of a patterning process, (iii) a functional behavior of the parameter defined as a function of the process variable based on the measurements of the parameter and the data related to the process variable, (iv) measurements of a failure rate of the feature, and (v) a probability density function of the process variable for a setting of the process variable, converting the probability density function of the process variable to a probability density function of the parameter based on a conversion function, where the conversion function is determined based on the function of the process variable, and determining a parameter limit of the parameter based on the probability density function of the parameter and the measurements of the failure rate.Type: ApplicationFiled: December 17, 2018Publication date: January 21, 2021Applicant: ASML NETHERLANDS B.V.Inventors: Abraham SLACHTER, Stefan HUNSCHE, Wim Tjibbo TEL, Anton Bernhard VAN OOSTEN, Koenraad VAN INGEN SCHENAU, Gijsbert RISPENS, Brennan PETERSON
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Patent number: 10883924Abstract: There is set forth herein in one embodiment, a structure including a metallic grating having a grating pattern, the metallic grating including a critical dimension. The metallic grating can output a spectral profile when exposed to electromagnetic radiation, the spectral profile having a feature. The grating pattern can be configured so that a change of the critical dimension produces a shift in a value of the feature of the spectral profile. A method can include propagating input electromagnetic radiation onto a metallic grating having a two dimensional periodic grating pattern and measuring a critical dimension of the metallic grating using output electromagnetic radiation from the metallic grating.Type: GrantFiled: September 8, 2015Date of Patent: January 5, 2021Assignee: THE RESEARCH FOUNDATION OF STATE UNIVERSITY OF NEW YORKInventors: Sam O' Mullane, Alain C. Diebold, Brennan Peterson, Nicholas Keller
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Publication number: 20200159134Abstract: An apparatus for determining information relating to at least one target alignment mark in a semiconductor device substrate. The target alignment mark is initially at least partially obscured by an opaque carbon or metal layer on the substrate. The apparatus includes an energy delivery system configured to emit a laser beam for modifying at least one portion of the opaque layer to cause a phase change and/or chemical change in the at least one portion that increases the transparency of the portion. An optical signal can propagate through the modified portion to determine information relating to the target alignment mark.Type: ApplicationFiled: June 18, 2018Publication date: May 21, 2020Applicant: ASML NETHERLANDS B.V.Inventors: An GAO, Sanjaysingh LALBAHADOERSING, Audrey Alexandrovich NIKIPELOV, Alexey Olegovich POLYAKOV, Brennan PETERSON
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Publication number: 20200152527Abstract: A method for revealing sensor targets on a substrate covered with a layer, the method including: obtaining locations of first areas on the substrate with yielding target portions and of second areas on the substrate with non-yielding target portions; at least partially removing feature regions of the layer covering sensor targets in the second areas to reveal sensor targets in the second areas; measuring a location of the revealed sensor targets in the second areas; determining a location of sensor targets in the first areas based on the measured location of the revealed sensor targets in the second areas; and at least partially removing sensor target regions of the layer covering the sensor targets in the first areas using the determined location of the sensor targets in the first areas.Type: ApplicationFiled: May 28, 2018Publication date: May 14, 2020Applicant: ASML NETHERLANDS B.V.Inventors: Andre Bernardus JEUNINK, Victoria VORONINA, Tamara DRUZHININA, Brennan PETERSON, Johannes Adrianus Cornelis Maria PIJNENBURG
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Publication number: 20200097633Abstract: A method for controlling a processing apparatus used in a semiconductor manufacturing process to form a structure on a substrate, the method including: obtaining a relationship between a geometric parameter of the structure and a performance characteristic of a device including the structure; and determining a process setting for the processing apparatus associated with a location on the substrate, wherein the process setting is at least partially based on an expected value of the geometric parameter of the structure when using the processing setting, a desired performance characteristic of the device and an expected physical yield margin or defect yield margin associated with the location on the substrate.Type: ApplicationFiled: August 15, 2019Publication date: March 26, 2020Applicant: ASML NETHERLANDS B.V.Inventors: Sunit Sondhi MAHAJAN, Abraham SLACHTER, Brennan PETERSON, Koen Wilhelmus Cornelis Adrianus VAN DER STRATEN, Antonio CORRADI, Pieter Joseph Marie WÖLTGENS
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Publication number: 20190378012Abstract: Disclosed is a method of determining a characteristic of interest relating to a structure on a substrate formed by a lithographic process, the method comprising: obtaining an input image of the structure; and using a trained neural network to determine the characteristic of interest from said input image. Also disclosed is a reticle comprising a target forming feature comprising more than two sub-features each having different sensitivities to a characteristic of interest when imaged onto a substrate to form a corresponding target structure on said substrate. Related methods and apparatuses are also described.Type: ApplicationFiled: May 29, 2019Publication date: December 12, 2019Applicant: ASML Netherlands B.V.Inventors: Lorenzo Tripodi, Patrick Warnaar, Grzegorz Grzela, Mohammadreza Hajiahmadi, Farzad Farhadzadeh, Patricius Aloysius Jacobus Tinnemans, Scott Anderson Middlebrooks, Adrianus Cornelis Matheus Koopman, Frank Staals, Brennan Peterson, Anton Bernhard Van Oosten
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Patent number: 10283317Abstract: A method for TEM sample preparation and analysis that can be used in a FIB-SEM system without re-welds, unloads, user handling of the lamella, or a motorized flip stage. The method allows a dual beam FIB-SEM system with a typical tilt stage to be used to extract a sample to from a substrate, mount the sample onto a TEM sample holder capable of tilting, thin the sample using FIB milling, and rotate the sample so that the sample face is perpendicular to an electron column for STEM imaging.Type: GrantFiled: May 15, 2017Date of Patent: May 7, 2019Assignee: FEI CompanyInventors: Paul Keady, Brennan Peterson, Guus Das, Craig Matthew Henry, Larry Dworkin, Jeff Blackwood, Stacey Stone, Michael Schmidt
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Patent number: 10254110Abstract: An optical metrology device determines physical characteristics of at least one via in a sample, such as a through-silicon vias (TSV), using signal strength data for modeling of the bottom critical dimension (BCD) and/or for refinement of the data used to determine a physical characteristic of the via, such as BCD and/or depth. The metrology device obtains interferometric data and generates height and signal strength data, from which statistical properties may be obtained. The height and signal strength data for the via is refined by removing noise using the statistical property, and the BCD for the via may be determined using the refined height and signal strength data. In one implementation, a signal strength via map for a via is generated using signal strength data and is fit to a model to determine the BCD for the via.Type: GrantFiled: December 15, 2014Date of Patent: April 9, 2019Assignee: Nanometrics IncorporatedInventors: Ke Xiao, Brennan Peterson, Timothy A. Johnson
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Publication number: 20170250055Abstract: A method for TEM sample preparation and analysis that can be used in a FIB-SEM system without re-welds, unloads, user handling of the lamella, or a motorized flip stage. The method allows a dual beam FIB-SEM system with a typical tilt stage to be used to extract a sample to from a substrate, mount the sample onto a TEM sample holder capable of tilting, thin the sample using FIB milling, and rotate the sample so that the sample face is perpendicular to an electron column for STEM imaging.Type: ApplicationFiled: May 15, 2017Publication date: August 31, 2017Applicant: FEI CompanyInventors: Paul Keady, Brennan Peterson, Guus Das, Craig Matthew Henry, Larry Dworkin, Jeff Blackwood, Stacey Stone, Michael Schmidt
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Patent number: 9653260Abstract: A method for TEM sample preparation and analysis that can be used in a FIB-SEM system without re-welds, unloads, user handling of the lamella, or a motorized flip stage. The method allows a dual beam FIB-SEM system with a typical tilt stage to be used to extract a sample to from a substrate, mount the sample onto a TEM sample holder capable of tilting, thin the sample using FIB milling, and rotate the sample so that the sample face is perpendicular to an electron column for STEM imaging.Type: GrantFiled: November 30, 2012Date of Patent: May 16, 2017Assignee: FEI CompanyInventors: Paul Keady, Brennan Peterson, Guus Das, Craig Henry, Larry Dworkin, Jeff Blackwood, Stacey Stone, Michael Schmidt
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Publication number: 20160069792Abstract: There is set forth herein in one embodiment, a structure including a metallic grating having a grating pattern, the metallic grating including a critical dimension. The metallic grating can output a spectral profile when exposed to electromagnetic radiation, the spectral profile having a feature. The grating pattern can be configured so that a change of the critical dimension produces a shift in a value of the feature of the spectral profile. A method can include propagating input electromagnetic radiation onto a metallic grating having a two dimensional periodic grating pattern and measuring a critical dimension of the metallic grating using output electromagnetic radiation from the metallic grating.Type: ApplicationFiled: September 8, 2015Publication date: March 10, 2016Inventors: Sam O'Mullane, Alain C. Diebold, Brennan Peterson, Nicholas Keller