Patents by Inventor Brent Boudreaux
Brent Boudreaux has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20050236142Abstract: A heat sink is built including a three dimensional array of cylindrical openings for air to flow through instead of fins. By having a larger surface area than heat sinks with fins, this high surface area heat sink results in increased heat transfer to the surrounding air than a similarly sized heat sink with fins. Heat sinks including an array of cylindrical openings may be manufactured through extrusion, stamping, and other common techniques.Type: ApplicationFiled: April 26, 2004Publication date: October 27, 2005Inventor: Brent Boudreaux
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Patent number: 6958445Abstract: A system composes a circuit board, electronic devices mounted on a first surface of the circuit board, and an electromagnetic interference (EMI) shield removably mounted to the first surface of the circuit board. The EMI shield defines a chamber to contain the electronic devices. An electrically conductive member is mounted to a second surface of the circuit board. At least an electrically conductive structure extends from the first surface to the second surface of the circuit board to electrically connect the EMI shield to the electrically conductive member.Type: GrantFiled: December 16, 2004Date of Patent: October 25, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: Brent A. Boudreaux, Richard A. Schumacher
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Publication number: 20050219820Abstract: In one embodiment, a thermal dissipation system comprises a plurality of thermal members having surfaces adapted for transferring heat from heat generating elements, a heat sink, and a plurality of heat pipes, each of the heat pipes coupled between a respective one of the plurality of thermal members and the heat sink, wherein the plurality of heat pipes possess a sufficient amount of flexibility to enable each of the plurality of thermal members to be disposed over a range of positions relative to the heat sink.Type: ApplicationFiled: April 1, 2004Publication date: October 6, 2005Inventors: Christian Belady, Eric Peterson, Brent Boudreaux, Shaun Harris, Roy Zeighami
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Patent number: 6947286Abstract: A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Heat-generating devices are thermally coupled with a thermal pad on one or more of the printed circuit boards. The thermal pad is then thermally coupled with the heat sink. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector.Type: GrantFiled: January 6, 2005Date of Patent: September 20, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: Christian L. Belady, Shaun L. Harris, Gary Wayne Williams, Brent A. Boudreaux
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Publication number: 20050191149Abstract: Disclosed is a fastener assembly comprising a first wedge portion having an angled end, a second wedge portion having an angled end, and a fastener extending through the first wedge portion and the second wedge portion, wherein a portion of the fastener protrudes from one of the first and second wedge portions for interfacing with a component to be mounted, wherein the angled end of the first wedge portion and the angled end of the second wedge portion are interfaced when the fastener is extended through the first wedge portion and the second wedge portion.Type: ApplicationFiled: January 24, 2005Publication date: September 1, 2005Inventors: Brent Boudreaux, Eric Peterson, Brandon Rubenstein
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Patent number: 6922340Abstract: A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Heat-generating devices are thermally coupled with a thermal pad on one or more of the printed circuit boards. The thermal pad is then thermally coupled with the heat sink. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector.Type: GrantFiled: July 13, 2004Date of Patent: July 26, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: Christian L. Belady, Shaun L. Harris, Gary Wayne Williams, Brent A. Boudreaux
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Publication number: 20050152117Abstract: A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Heat-generating devices are thermally coupled with a thermal pad on one or more of the printed circuit boards. The thermal pad is then thermally coupled with the heat sink. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector.Type: ApplicationFiled: January 6, 2005Publication date: July 14, 2005Inventors: Christian Belady, Shaun Harris, Gary Williams, Brent Boudreaux
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Patent number: 6910271Abstract: A thermal interface pad is constructed from a plurality of thermal interface plate assemblies. Alternate thermal interface plate assemblies are rotated about 180 degrees from each other within the pad. Each plate assembly includes one or more spring members configured such that the completed thermal interface pad includes a plurality of spring members on at least two sides of the pad. The thermal interface plate assemblies are configured to allow the thermal interface pad to vary greatly in thickness. The pad is sufficiently adjustable in thickness to accommodate gross tolerance differences between multiple heat generating and sinking devices. Rods inserted in openings in the plates may be used to align the plate assemblies and to apply compressive force to the plates, improving the thermal conductivity between adjacent plates and greatly decreasing the overall thermal resistance of the thermal interface pad.Type: GrantFiled: October 29, 2002Date of Patent: June 28, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: Eric C. Peterson, Brent A. Boudreaux, Christian L. Belady
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Publication number: 20050136728Abstract: Embodiments of a routing system for electronic module assemblies are disclosed that may incorporate a module base having at least one routing end and a channel formed across a length of the at least one routing end, wherein the channel has a dimension that allows a wire to be routed from the module base to a connection point external to the module base and allows the wire to be bent within the channel in a direction of the connection point.Type: ApplicationFiled: December 19, 2003Publication date: June 23, 2005Inventors: Gary Williams, Brent Boudreaux, Shaun Harris, Paul Wirtzberger
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Publication number: 20050132571Abstract: A thermal interface pad is constructed from a plurality of thermal interface plate assemblies. Alternate thermal interface plate assemblies are rotated about 180 degrees from each other within the pad. Each plate assembly includes one or more spring members configured such that the completed thermal interface pad includes a plurality of spring members on at least two sides of the pad. The thermal interface plate assemblies are configured to allow the thermal interface pad to vary greatly in thickness. The pad is sufficiently adjustable in thickness to accommodate gross tolerance differences between multiple heat generating and sinking devices. Rods inserted in openings in the plates may be used to align the plate assemblies and to apply compressive force to the plates, improving the thermal conductivity between adjacent plates and greatly decreasing the overall thermal resistance of the thermal interface pad.Type: ApplicationFiled: February 1, 2005Publication date: June 23, 2005Inventors: Eric Peterson, Brent Boudreaux, Christian Belady
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Patent number: 6900987Abstract: A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Heat-generating devices are thermally coupled with a thermal pad on one or more of the printed circuit boards. The thermal pad is then thermally coupled with the heat sink. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector.Type: GrantFiled: July 13, 2004Date of Patent: May 31, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: Christian L. Belady, Shaun L. Harris, Gary Wayne Williams, Brent A. Boudreaux
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Patent number: 6873530Abstract: A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Heat-generating devices are thermally coupled with a thermal pad on one or more of the printed circuit boards. The thermal pad is then thermally coupled with the heat sink. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector.Type: GrantFiled: July 13, 2004Date of Patent: March 29, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: Christian L. Belady, Shaun L. Harris, Gary Wayne Williams, Brent A. Boudreaux
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Patent number: 6862186Abstract: A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Heat-generating devices are thermally coupled with a thermal pad on one or more of the printed circuit boards. The thermal pad is then thermally coupled with the heat sink. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector.Type: GrantFiled: July 13, 2004Date of Patent: March 1, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: Christian L. Belady, Shaun L. Harris, Gary Wayne Williams, Brent A. Boudreaux
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Publication number: 20040257772Abstract: A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Heat-generating devices are thermally coupled with a thermal pad on one or more of the printed circuit boards. The thermal pad is then thermally coupled with the heat sink. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector.Type: ApplicationFiled: July 13, 2004Publication date: December 23, 2004Inventors: Christian L. Belady, Shaun L. Harris, Gary Wayne Williams, Brent A. Boudreaux
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Publication number: 20040257773Abstract: A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Heat-generating devices are thermally coupled with a thermal pad on one or more of the printed circuit boards. The thermal pad is then thermally coupled with the heat sink. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector.Type: ApplicationFiled: July 13, 2004Publication date: December 23, 2004Inventors: Christian L. Belady, Shaun L. Harris, Gary Wayne Williams, Brent A. Boudreaux
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Publication number: 20040246680Abstract: A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Heat-generating devices are thermally coupled with a thermal pad on one or more of the printed circuit boards. The thermal pad is then thermally coupled with the heat sink. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector.Type: ApplicationFiled: July 13, 2004Publication date: December 9, 2004Inventors: Christian L. Belady, Shaun L. Harris, Gary Wayne Williams, Brent A. Boudreaux
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Publication number: 20040246681Abstract: A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Heat-generating devices are thermally coupled with a thermal pad on one or more of the printed circuit boards. The thermal pad is then thermally coupled with the heat sink. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector.Type: ApplicationFiled: July 13, 2004Publication date: December 9, 2004Inventors: Christian L. Belady, Shaun L. Harris, Gary Wayne Williams, Brent A. Boudreaux
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Patent number: 6819562Abstract: A cooling apparatus for stacked components. Heat generating components may be mounted on two sides of a first printed circuit board. A second circuit board may be stacked over the first circuit board with a thermally conductive frame disposed between the two boards. The frame includes a cross member thermally coupled to the heat generating component on the top side of the first circuit board. The heat generating component on the bottom side of the first circuit board is thermally coupled to one leg of a thermally-conductive strap. The strap has a second leg that is thermally coupled to one end of the thermally conductive frame and also to one end of a heat distribution member mounted adjacent the second circuit board. The apparatus functions to channel heat from the first board's top and bottom components to the heat distribution member via the thermally-conductive frame and the thermally-conductive strap.Type: GrantFiled: January 31, 2003Date of Patent: November 16, 2004Assignee: Hewlett-Packard Development Company, L.P.Inventors: Brent A. Boudreaux, Roy M. Zeighami, Christian L. Belady
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Publication number: 20040225821Abstract: An apparatus comprises a plurality of logically independent processors, a system bus, and a cache control and bus bridge device in communication with the plurality of processors such that the cache control and bus bridge device is logically interposed between the processors and the system bus, and wherein the processors and cache control and bus bridge device are disposed in a module form factor such that the apparatus is a drop-in replacement for a standard single processor module.Type: ApplicationFiled: March 15, 2004Publication date: November 11, 2004Inventors: David A. Klein, Christian L. Belady, Shaun L. Harris, Michael C. Day, Jeffrey P. Christenson, Brent A. Boudreaux, Stuart C. Haden, Eric Peterson, Jeffrey N. Metcalf, James S. Wells, Gary W. Williams, Paul A. Wirtzberger, Roy M. Zeighami, Greg Huff
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Patent number: 6816378Abstract: A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Heat-generating devices are thermally coupled with a thermal pad on one or more of the printed circuit boards. The thermal pad is then thermally coupled with the heat sink. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector.Type: GrantFiled: April 28, 2003Date of Patent: November 9, 2004Assignee: Hewlett-Packard Development Company, L.P.Inventors: Christian L. Belady, Shaun L. Harris, Gary Wayne Williams, Brent A. Boudreaux