Abstract: A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Heat-generating devices are thermally coupled with a thermal pad on one or more of the printed circuit boards. The thermal pad is then thermally coupled with the heat sink. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector.

Abstract: A sealed pouch constructed of thermally conductive flexible material containing a low melting point, thermally conductive material is placed between two components that require thermal continuity. This assembly is then loaded in compression and heated to the melting point of the low melting point, thermally conductive material, which then melts within the sealed pouch, and conforms to the shape of the two components. The sealed pouch also may contain a springy material made of a metal, or a solder compatible plastic or organic to help maintain shape of the pouch in some applications.

Abstract: Disclosed is a fastener assembly comprising a first wedge portion having an angled end, a second wedge portion having an angled end, and a fastener extending through the first wedge portion and the second wedge portion, wherein a portion of the fastener protrudes from one of the first and second wedge portions for interfacing with a component to be mounted, wherein the angled end of the first wedge portion and the angled end of the second wedge portion are interfaced when the fastener is extended through the first wedge portion and the second wedge portion.

Abstract: A cooling apparatus for stacked components. Heat generating components may be mounted on two sides of a first printed circuit board. A second circuit board may be stacked over the first circuit board with a thermally conductive frame disposed between the two boards. The frame includes a cross member thermally coupled to the heat generating component on the top side of the first circuit board. The heat generating component on the bottom side of the first circuit board is thermally coupled to one leg of a thermally-conductive strap. The strap has a second leg that is thermally coupled to one end of the thermally conductive frame and also to one end of a heat distribution member mounted adjacent the second circuit board. The apparatus functions to channel heat from the first board's top and bottom components to the heat distribution member via the thermally-conductive frame and the thermally-conductive strap.

Abstract: A power module assembly for multi-chip printed circuit boards: A heat distribution plate has first and second fields of receptacles integrally formed therein. The receptacles are populated with first and second fields of thermally-conductive pins. A power module printed circuit board is mounted to the heat distribution plate and has first and second clearance holes formed therein. The first and second fields of pins protrude through the first and second clearance holes. A multi-chip printed circuit board may be mounted underneath the power module such that the thermally-conductive pins contact a surface of first and second supplied chips. The supplied chips are physically close to the power module, and thermal management for the supplied chips is provided by virtue of contact between the supplied chips and the thermally-conductive pins. Space on the multi-chip printed circuit board is conserved.

Abstract: A power module assembly for multi-chip printed circuit boards: A heat distribution plate has first and second fields of receptacles integrally formed therein. The receptacles are populated with first and second fields of thermally-conductive pins. A power module printed circuit board is mounted to the heat distribution plate and has first and second clearance holes formed therein. The first and second fields of pins protrude through the first and second clearance holes. A multi-chip printed circuit board may be mounted underneath the power module such that the thermally-conductive pins contact a surface of first and second supplied chips. The supplied chips are physically close to the power module, and thermal management for the supplied chips is provided by virtue of contact between the supplied chips and the thermally-conductive pins. Space on the multi-chip printed circuit board is conserved.

Abstract: The input/output expansion system (“I/O expansion system”) for an external or main computing unit includes a rack; at least one I/O expansion module mounted to the rack, the I/O expansion module comprising at least one I/O circuit card; a utilities control module mounted to the rack, the utilities control module being configured to receive a command from the external computer unit and generating a signal in response to the command for distribution to at least one I/O expansion module; and expansion power chassis mounted to the rack, the an expansion power chassis being electrically connected to a power source and being configured to distribute the power to the at least one I/O expansion module and the utilities control module.

Abstract: A thermal interface pad is constructed from a plurality of thermal interface plate assemblies. Alternate thermal interface plate assemblies are rotated about 180 degrees from each other within the pad. Each plate assembly includes one or more spring members configured such that the completed thermal interface pad includes a plurality of spring members on at least two sides of the pad. The thermal interface plate assemblies are configured to allow the thermal interface pad to vary greatly in thickness. The pad is sufficiently adjustable in thickness to accommodate gross tolerance differences between multiple heat generating and sinking devices. Rods inserted in openings in the plates may be used to align the plate assemblies and to apply compressive force to the plates, improving the thermal conductivity between adjacent plates and greatly decreasing the overall thermal resistance of the thermal interface pad.

Abstract: A heat sink is constructed including at least one thermally conductive pedestal, allowing configuration of the heat sink to make contact with a plurality of heat-generating electronic devices where the devices may not be co-planar due to tolerance stack-up. The pedestals may be raised and lowered and tilted as needed to match the heights and tilts of the electronic devices. Within the heat sink is a cavity above the pedestal that may be filled with a thermally conductive material, such as solder, or a thermally conductive liquid, during construction to create a low thermal resistance contact between the pedestal and the heat sink fins. Also, thermally conductive material, such as thermal paste or a thermal pad, may be used between the heat generating device and the pedestal to create a low thermal resistance contact.

Abstract: A heat sink is constructed including at least one thermally conductive pedestal, allowing configuration of the heat sink to make contact with a plurality of heat-generating electronic devices where the devices may not be co-planar due to tolerance stack-up. The pedestals may be raised and lowered and tilted as needed to match the heights and tilts of the electronic devices. Within the heat sink is a cavity above the pedestal that may be filled with a thermally conductive material, such as solder, or a thermally conductive liquid, during construction to create a low thermal resistance contact between the pedestal and the heat sink fins. Also, thermally conductive material, such as thermal paste or a thermal pad, may be used between the heat generating device and the pedestal to create a low thermal resistance contact.

Abstract: A cable management system includes an opposed pair of articulated A-frame support assemblies that are connected by a cable support platform, such as a roller. The A-frame support assemblies may be reach between an electrical system chassis and an equipment rack in a manner that permits the elevation of the cable support platform to change concomitant with extensile and de-extensile motion of the electrical system chassis relative to the equipment rack. This change in elevation manages slack in the cable to feed cable forwardly during extensile motion of the electrical system chassis and to pull cable rearwardly with de-extensile motion.

Abstract: A sealed pouch constructed of thermally conductive flexible material containing a low melting point, thermally conductive material is placed between two components that require thermal continuity. This assembly is then loaded in compression and heated to the melting point of the low melting point, thermally conductive material, which then melts within the sealed pouch, and conforms to the shape of the two components. The sealed pouch also may contain a springy material made of a metal, or a solder compatible plastic or organic to help maintain shape of the pouch in some applications.

Abstract: The invention provides EMI cable shield termination apparatus. The apparatus includes (a) a cable exit panel coupled to a first electronic system and (b) one or more clamps coupled to the exit panel. The exit panel serves as an interface for one or more cables coupled to the first electronic system; the clamps provide mechanical coupling, and EMI shielding, for the cables to that interface. The exit panel couples to electrical ground such as through connection to the chassis of the first electronic system. The clamps also couple to ground through connection with the exit panel. Preferably, one end of the cables attaches to the clamps, at the interface formed by the exit panel, and the other end of the cables attach to respective ferrules coupled to a second electronics system. Beneficially, the apparatus reduces EMI effects generated from the first electronic system and coupled into the second electronic system.

Abstract: A heat-activated self-aligning heat sink is built thermally connecting at least one heat-generating devices on a substrate to the heat sink body, where the heat-generating devices may not be co-planar with each other due to tolerance stack-up or parallel with the heat sink body. A pedestal is attached to the substrate to support the heat sink body. A plug or floating pedestal is placed on top of each heat-generating device and held within the pedestal allowing sufficient movement for the bottom surface of the plug to fully contact the top surface of the heat-generating device. A quantity of a low melting temperature, thermally conductive material, such as solder, or a thermally conductive liquid, is placed over each plug and a heat sink body is placed over the assembly. When heated, the thermal material melts, forming a low impedance thermal junction between the plug and the heat sink body regardless of planarity differences between the two devices.

Abstract: A shielded cable assembly contains one or more hardpoints that resist damage arising from possible collapse of the shielded cable assembly under strong compressional forces that are exerted by a clamp assembly in the form of a separable block having first and second opposed members. The hardpoint contains a conduit that protects a data transfer line or cable bundle by compressing electromagnetic shielding between the conduit and the clamp assembly. Cable electromagnetic shielding may be exposed over a selected hardpoint for use as needed in a particular application.

Abstract: A shielded cable assembly contains a hardpoint that resists damage arising from possible collapse of the shielded cable assembly under strong compressional forces that are exerted by a clamp assembly in the form of a separable block having first and second opposed members. The hardpoint contains a conduit that protects a data transfer line or cable bundle by compressing electromagnetic shielding between the conduit and the clamp assembly.

Abstract: The invention provides EMI cable shield termination apparatus. The apparatus includes (a) a cable exit panel coupled to a first electronic system and (b) one or more clamps coupled to the exit panel. The exit panel serves as an interface for one or more cables coupled to the first electronic system; the clamps provide mechanical coupling, and EMI shielding, for the cables to that interface. The exit panel couples to electrical ground such as through connection to the chassis of the first electronic system. The clamps also couple to ground through connection with the exit panel. Preferably, one end of the cables attaches to the clamps, at the interface formed by the exit panel, and the other end of the cables attach to respective ferrules coupled to a second electronics system. Beneficially, the apparatus reduces EMI effects generated from the first electronic system and coupled into the second electronic system.

Abstract: A cable management system includes an opposed pair of articulated A-frame support assemblies that are connected by a cable support platform, such as a roller. The A-frame support assemblies may be reach between an electrical system chassis and an equipment rack in a manner that permits the elevation of the cable support platform to change concomitant with extensile and de-extensile motion of the electrical system chassis relative to the equipment rack. This change in elevation manages slack in the cable to feed cable forwardly during extensile motion of the electrical system chassis and to pull cable rearwardly with de-extensile motion.

Abstract: The input/output expansion system (“I/O expansion system”) for an external or main computing unit includes a rack; at least one I/O expansion module mounted to the rack, the I/O expansion module comprising at least one I/O circuit card; a utilities control module mounted to the rack, the utilities control module being configured to receive a command from the external computer unit and generating a signal in response to the command for distribution to at least one I/O expansion module; and expansion power chassis mounted to the rack, the an expansion power chassis being electrically connected to a power source and being configured to distribute the power to the at least one I/O expansion module and the utilities control module.

Abstract: A shielded cable assembly contains a hardpoint that resists damage arising from possible collapse of the shielded cable assembly under strong compressional forces that are exerted by a clamp assembly in the form of a separable block having first and second opposed members. The hardpoint contains a conduit that protects a data transfer line or cable bundle by compressing electromagnetic shielding between the conduit and the clamp assembly.