Abstract: In an optoelectronic assembly in which one or more beam paths are to be aligned with a corresponding number of active optical elements, the cooperation between flexible alignment features and fixed alignment features achieves elastic averaging so as to provide the target accuracy. By averaging dimensional and positional errors over a large number of localized couplings of the flexible and fixed alignment features, elastic averaging provides the same accuracy as the more costly and complex kinematic alignment techniques.

Abstract: An optoelectronic module is seated onto a substrate connector by guiding the module along an initial path portion that is misaligned with respect to the mating direction defined by the substrate connector and further includes providing a positive pressure drive along an end path portion with sufficient force to secure the optoelectronic module to the substrate connector. Where the mating is via a pin-and-socket arrangement, the positive pressure drive requires sufficient force to push the main body of the module to ensure entry of the pins into the sockets. Typically, there is a conversion from force applied in one direction to module motion in the orthogonal direction. However, a rocking cam embodiment is also described.

Abstract: In an optoelectronic assembly in which one or more beam paths are to be aligned with a corresponding number of active optical elements, the cooperation between flexible alignment features and fixed alignment features achieves elastic averaging so as to provide the target accuracy. By averaging dimensional and positional errors over a large number of localized couplings of the flexible and fixed alignment features, elastic averaging provides the same accuracy as the more costly and complex kinematic alignment techniques.

Abstract: Optoelectronic device packaging assemblies and methods of making the same are described. In one aspect, an optoelectronic device packaging assembly includes an electrical sub-mount that includes a mounting area, a device turning mount, and a light-emitting device. The device turning mount has a sub-mount mounting side that is attached to the mounting area of the electrical sub-mount and a device mounting side that has a device mounting area that is oriented in a plane that is substantially perpendicular to the mounting area of the electrical sub-mount. The light-emitting device includes one or more semiconductor layers that terminate at a common light-emitting surface and are operable to emit light from the light-emitting surface. The light-emitting device is attached to the device mounting area of the device turning mount with the light-emitting surface oriented in a plane that is substantially parallel to the mounting area of the electrical sub-mount.

Abstract: A detection system in a portable assay reader device is enabled or activated after a user applies a manual force to a portion of the reader device, to an object supporting the assay test strip, or to the assay test strip itself. The movement moves a switch from an open state to a closed state. The closed state enables a detection system to monitor one or more test regions in the assay test strip for a reaction. The detection system can include one or more imagers, one or more electrical detectors, one or more magnetic detectors, or one or more optical detectors that monitor the one or more test regions for applicable visible, electrical, magnetic, or optical reactions, respectively. The one or more imagers or detectors transmit data to a processing device to determine the results of a test.

Abstract: A package for a surface-emitting laser encloses the die between a sub-mount and a cap. The sub-mount and the cap can be formed using wafer processing techniques that permit a wafer level packaging process which attaches multiple die to a sub-mount wafer, attaches caps either separated or as part of a cap wafer to the sub-mount wafer, and cuts the structure to separate individual packages. The cap includes a transparent plate that can be processed to incorporate an optical element such as a lens. An alignment post attached to the cap indicates the position of an optical signal from the laser and fits snugly into one end of a sleeve while an optical fiber connector fits into the other end.

Abstract: An optoelectronic module is seated onto a substrate connector by guiding the module along an initial path portion that is misaligned with respect to the mating direction defined by the substrate connector and further includes providing a positive pressure drive along an end path portion with sufficient force to secure the optoelectronic module to the substrate connector. Where the mating is via a pin-and-socket arrangement, the positive pressure drive requires sufficient force to push the main body of the module to ensure entry of the pins into the sockets. Typically, there is a conversion from force applied in one direction to module motion in the orthogonal direction. However, a rocking cam embodiment is also described.

Abstract: An optoelectronic module is seated onto a substrate connector by guiding the module along an initial path portion that is misaligned with respect to the mating direction defined by the substrate connector and further includes providing a positive pressure drive along an end path portion with sufficient force to secure the optoelectronic module to the substrate connector. Where the mating is via a pin-and-socket arrangement, the positive pressure drive requires sufficient force to push the main body of the module to ensure entry of the pins into the sockets. Typically, there is a conversion from force applied in one direction to module motion in the orthogonal direction. However, a rocking cam embodiment is also described.

Abstract: A diagnostic test reader includes an assay interface, a locking mechanism, and a test unit. The assay interface is configured to receive a diagnostic assay. The locking mechanism is configured to lock the diagnostic assay within the assay interface in response to one of the diagnostic assay and the diagnostic test reader being given a first push in a first direction toward the other of the diagnostic assay and the diagnostic test reader. The locking mechanism is also configured to unlock the diagnostic assay within the assay interface in response to the one of the diagnostic assay and the diagnostic test reader being given a second push in the first direction. The test unit is configured to analyze the diagnostic assay.

Abstract: A system having a harmonic frequency actuator system is provided including providing an actuator body, the actuator body having more than one set of fingers for generating a motion for a semi-rigid element, and attaching a high frequency actuator to the actuator body forming a harmonic frequency actuator to provide motion at predetermined frequency pairs.

Abstract: A hand-held optoelectronic test system comprising a cartridge including at least one light source and sensors prealigned to permit acquisition of electro-optic data from a fluid sample reacted with a reagent, such as upon a test membrane in a reaction zone, and a reader which processes the acquired data to identify a physical change in the fluid sample. The cartridge and reader are operable for separate predetermined or controllable finite numbers of tests before becoming disposable.

Abstract: A system having a harmonic frequency actuator system is provided including providing an actuator body, the actuator body having more than one set of fingers for generating a motion for a semi-rigid element, and attaching a high frequency actuator to the actuator body forming a harmonic frequency actuator to provide motion at predetermined frequency pairs.

Abstract: Optoelectronic device packaging assemblies and methods of making the same are described. In one aspect, an optoelectronic device packaging assembly includes an electrical sub-mount that includes a mounting area, a device turning mount, and a light-emitting device. The device turning mount has a sub-mount mounting side that is attached to the mounting area of the electrical sub-mount and a device mounting side that has a device mounting area that is oriented in a plane that is substantially perpendicular to the mounting area of the electrical sub-mount. The light-emitting device includes one or more semiconductor layers that terminate at a common light-emitting surface and are operable to emit light from the light-emitting surface. The light-emitting device is attached to the device mounting area of the device turning mount with the light-emitting surface oriented in a plane that is substantially parallel to the mounting area of the electrical sub-mount.

Abstract: In an optoelectronic assembly in which one or more beam paths are to be aligned with a corresponding number of active optical elements, the cooperation between flexible alignment features and fixed alignment features achieves elastic averaging so as to provide the target accuracy. By averaging dimensional and positional errors over a large number of localized couplings of the flexible and fixed alignment features, elastic averaging provides the same accuracy as the more costly and complex kinematic alignment techniques.

Abstract: An optical subassembly (OSA) for an optoelectronic module uses an optical turn that permits mounting of the OSA on a circuit board of a primary module. A fabrication process for the OSA can achieve low complexity and high yield from the ability to fabricate the OSA separate from fabrication of the primary module. Fabrication of the OSA can include a burn-in test of an optoelectronic chip on a flex circuit that is small to reduce yield loss costs when the optoelectronic chip is defective. The OSA and the primary module can be mechanically attached and electrically connected using wire bonding techniques.

Abstract: An optoelectronic module is seated onto a substrate connector by guiding the module along an initial path portion that is misaligned with respect to the mating direction defined by the substrate connector and further includes providing a positive pressure drive along an end path portion with sufficient force to secure the optoelectronic module to the substrate connector. Where the mating is via a pin-and-socket arrangement, the positive pressure drive requires sufficient force to push the main body of the module to ensure entry of the pins into the sockets. Typically, there is a conversion from force applied in one direction to module motion in the orthogonal direction. However, a rocking cam embodiment is also described.

Abstract: A connection cable includes an optical cable and an integrated electrical connector. The integrated electrical connector is permanently fixed to the optical cable. The integrated electrical connector is for plug-in connection to a matching electrical connector on a target device.

Abstract: Waveguide based connector systems for optically coupling a fiber optic cable and an optoelectronic device and a method of fabricating the same are described. In one aspect, a connector system comprises an optical waveguide and an optical turn assembly. The optical waveguide has a first end and a second end. The first end of the optical waveguide is connectable to the fiber optic cable in an orientation aligned with a line-side connection axis. The optical turn assembly has a first optical port that is connected to the second end of the optical waveguide in an orientation aligned with a device-side connection axis, a second optical port that is oriented to communicate optically with the optoelectronic device along a device communication axis substantially intersecting the device-side connection axis, and an optical turn system that is operable to guide light along a path between the first optical port and the second optical port.

Abstract: A package for an optoelectronic device includes a hermetically sealed cavity into which a mirror or other optical element is integrated. For a side-emitting laser, an integrated mirror turns the light emitted from the laser inside the cavity so that the light exits through a top surface of the package. The packaging can be implemented for individual lasers or at the wafer level. A wafer level process fabricates sub-mounts in a first wafer, fabricates depressions with reflective areas in a second wafer, electrically connects optoelectronic devices to respective sub-mounts on the first wafer, and bonds a second wafer to the first wafer with the lasers hermetically sealed in cavities corresponding to the depressions in the second wafer. The reflective areas in the depressions act as turning mirrors for side emitting lasers.

Abstract: An optoelectronic assembly includes an optical lens element (OLE) coupled to a substrate. The substrate includes a transducer, a standing structure on the transducer, a transducer lens supported by the standing structure over the transducer, and alignment features. The OLE includes an OLE lens and co-alignment features that couple with the alignment features on the optoelectronic assembly. When the substrate is coupled to the OLE, the transducer lens is aligned with the OLE lens.