Abstract: A package for a surface-emitting laser encloses the die between a sub-mount and a cap. The sub-mount and the cap can be formed using wafer processing techniques that permit a wafer level packaging process which attaches multiple die to a sub-mount wafer, attaches caps either separated or as part of a cap wafer to the sub-mount wafer, and cuts the structure to separate individual packages. The cap includes a transparent plate that can be processed to incorporate an optical element such as a lens. An alignment post attached to the cap indicates the position of an optical signal from the laser and fits snugly into one end of a sleeve while an optical fiber connector fits into the other end.

Abstract: Optoelectronic device packaging assemblies and methods of making the same are described. In one aspect, an optoelectronic device packaging assembly includes an electrical sub-mount that includes a mounting area, a device turning mount, and a light-emitting device. The device turning mount has a sub-mount mounting side that is attached to the mounting area of the electrical sub-mount and a device mounting side that has a device mounting area that is oriented in a plane that is substantially perpendicular to the mounting area of the electrical sub-mount. The light-emitting device includes one or more semiconductor layers that terminate at a common light-emitting surface and are operable to emit light from the light-emitting surface. The light-emitting device is attached to the device mounting area of the device turning mount with the light-emitting surface oriented in a plane that is substantially parallel to the mounting area of the electrical sub-mount.

Abstract: An optical subassembly includes a substrate, a group of solder features on the substrate, a die on the substrate, and a cap on the substrate and over the die. The cap includes (1) a lens over the die and (2) an inner or outer surface that snap-fits to the solder features.

Abstract: An optical subassembly includes a substrate, a group of solder features on the substrate, a die on the substrate, and a cap on the substrate and over the die. The cap includes (1) a lens over the die and (2) an inner or outer surface that snap-fits to the solder features.

Abstract: A sub-assembly or package for a die in the receiving section of an optical transceiver includes a semiconductor sub-mount that is electrically connected to the die and a cap that is bonded to the sub-mount to hermetically seal the die in a cavity. The die can be flip-chip bonded to the sub-mount and can include a diffractive optical element fabricated on a back side of the die. Active circuitry such as an amplifier for an output signal from a photosensor on the die can be integrated into the sub-mount. For an OSA, a post can be attached to the package along a path of an optical signal to the photosensor. The post facilitates alignment of an optical fiber. A flexible or rigid circuit can be soldered to external terminals of the sub-mount.

Abstract: Fiber optic connectors and methods of making the same are described. In one aspect, a fiber optic connector includes a support surface and at least one alignment pin. The support surface has at least one optical communication port. Each alignment pin has an elongated distal end and a flanged proximal end with a bottom surface that is fixedly attached to the support surface.

Abstract: A sub-assembly or package for a die in the receiving section of an optical transceiver includes a semiconductor sub-mount that is electrically connected to the die and a cap that is bonded to the sub-mount to hermetically seal the die in a cavity. The die can be flip-chip bonded to the sub-mount and can include a diffractive optical element fabricated on a back side of the die. Active circuitry such as an amplifier for an output signal from a photosensor one the die can be integrated into the sub-mount. For an OSA, a post can be attached to the package along a path of an optical signal to the photosensor. The post facilitates alignment of an optical fiber. A flexible or rigid circuit can be soldered to external terminals of the sub-mount.

Abstract: A package for a surface-emitting laser encloses the die between a sub-mount and a cap. The sub-mount and the cap can be formed using wafer processing techniques that permit a wafer level packaging process which attaches multiple die to a sub-mount wafer, attaches caps either separated or as part of a cap wafer to the sub-mount wafer, and cuts the structure to separate individual packages. The cap includes a transparent plate that can be processed to incorporate an optical element such as a lens. An alignment post attached to the cap indicates the position of an optical signal from the laser and fits snugly into one end of a sleeve while an optical fiber connector fits into the other end.

Abstract: A sub-assembly or package for a die in the receiving section of an optical transceiver includes a semiconductor sub-mount that is electrically connected to the die and a cap that is bonded to the sub-mount to hermetically seal the die in a cavity. The die can be flip-chip bonded to the sub-mount and can include a diffractive optical element fabricated on a back side of the die. Active circuitry such as an amplifier for an output signal from a photosensor on the die can be integrated into the sub-mount. For an OSA, a post can be attached to the package along a path of an optical signal to the photosensor. The post facilitates alignment of an optical fiber. A flexible or rigid circuit can be soldered to external terminals of the sub-mount.

Abstract: A package for an optoelectronic device includes a hermetically sealed cavity into which a mirror or other optical element is integrated. For a side-emitting laser, an integrated mirror turns the light emitted from the laser inside the cavity so that the light exits through a top surface of the package. The packaging can be implemented for individual lasers or at the wafer level. A wafer level process fabricates sub-mounts in a first wafer, fabricates depressions with reflective areas in a second wafer, electrically connects optoelectronic devices to respective sub-mounts on the first wafer, and bonds a second wafer to the first wafer with the lasers hermetically sealed in cavities corresponding to the depressions in the second wafer. The reflective areas in the depressions act as turning mirrors for side emitting lasers.

Abstract: An optoelectronic package or sub-assembly includes an edge-emitting laser and a reflector that directs a beam from the laser through a sub-mount. The sub-mount contains passive or active circuit elements that are electrically connected to the laser. The laser can be protected from the environment using either a cap in which the reflector is integrated or using an encapsulant encasing the laser. An alignment post that is sized to fit into a sleeve is mounted where the optical signal emerges from the sub-mount. Plugging the post into one end of the sleeve and inserting an optical fiber into the other end of the sleeve so that the optical fiber abuts the post will then align the optical fiber to receive the optical signal.

Abstract: A sub-assembly or package for a die in the receiving section of an optical transceiver includes a semiconductor sub-mount that is electrically connected to the die and a cap that is bonded to the sub-mount to hermetically seal the die in a cavity. The die can be flip-chip bonded to the sub-mount and can include a diffractive optical element fabricated on a back side of the die. Active circuitry such as an amplifier for an output signal from a photosensor on the die can be integrated into the sub-mount. For an OSA, a post can be attached to the package along a path of an optical signal to the photosensor. The post facilitates alignment of an optical fiber. A flexible or rigid circuit can be soldered to external terminals of the sub-mount.

Abstract: A package for a surface-emitting laser encloses the die between a sub-mount and a cap. The sub-mount and the cap can be formed using wafer processing techniques that permit a wafer level packaging process which attaches multiple die to a sub-mount wafer, attaches caps either separated or as part of a cap wafer to the sub-mount wafer, and cuts the structure to separate individual packages. The cap includes a transparent plate that can be processed to incorporate an optical element such as a lens. An alignment post attached to the cap indicates the position of an optical signal from the laser and fits snugly into one end of a sleeve while an optical fiber connector fits into the other end.

Abstract: Fiber optic connectors and methods of making the same are described. In one aspect, a fiber optic connector includes a support surface and at least one alignment pin. The support surface has at least one optical communication port. Each alignment pin has an elongated distal end and a flanged proximal end with a bottom surface that is fixedly attached to the support surface.

Abstract: Optoelectronic device packaging assemblies and methods of making the same are described. In one aspect, an optoelectronic device packaging assembly includes an electrical sub-mount that includes a mounting area, a device turning mount, and a light-emitting device. The device turning mount has a sub-mount mounting side that is attached to the mounting area of the electrical sub-mount and a device mounting side that has a device mounting area that is oriented in a plane that is substantially perpendicular to the mounting area of the electrical sub-mount. The light-emitting device includes one or more semiconductor layers that terminate at a common light-emitting surface and are operable to emit light from the light-emitting surface. The light-emitting device is attached to the device mounting area of the device turning mount with the light-emitting surface oriented in a plane that is substantially parallel to the mounting area of the electrical sub-mount.

Abstract: Waveguide based connector systems for optically coupling a fiber optic cable and an optoelectronic device and a method of fabricating the same are described. In one aspect, a connector system comprises an optical waveguide and an optical turn assembly. The optical waveguide has a first end and a second end. The first end of the optical waveguide is connectable to the fiber optic cable in an orientation aligned with a line-side connection axis. The optical turn assembly has a first optical port that is connected to the second end of the optical waveguide in an orientation aligned with a device-side connection axis, a second optical port that is oriented to communicate optically with the optoelectronic device along a device communication axis substantially intersecting the device-side connection axis, and an optical turn system that is operable to guide light along a path between the first optical port and the second optical port.