Patents by Inventor Brett Arnold Dunlap
Brett Arnold Dunlap has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11545405Abstract: A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. The fill material includes vias at peripheral locations around the sensor integrated circuit. The fingerprint sensor package can further include a redistribution layer on the sensing side which redistributes connections of the sensor integrated circuit to the vias. The connections can further be directed through the vias to a ball grid array on the connection side. Some aspects also include electrostatic discharge traces positioned at least partially around a perimeter of the connection side. Methods of manufacturing are also disclosed.Type: GrantFiled: April 24, 2020Date of Patent: January 3, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Ronald Patrick Huemoeller, David Bolognia, Robert Francis Darveaux, Brett Arnold Dunlap
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Publication number: 20200365480Abstract: A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. The fill material includes vias at peripheral locations around the sensor integrated circuit. The fingerprint sensor package can further include a redistribution layer on the sensing side which redistributes connections of the sensor integrated circuit to the vias. The connections can further be directed through the vias to a ball grid array on the connection side. Some aspects also include electrostatic discharge traces positioned at least partially around a perimeter of the connection side. Methods of manufacturing are also disclosed.Type: ApplicationFiled: April 24, 2020Publication date: November 19, 2020Inventors: Ronald Patrick Huemoeller, David Bolognia, Robert Francis Darveaux, Brett Arnold Dunlap
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Publication number: 20200335476Abstract: A method of forming a plurality of electronic component packages includes attaching electronic components to a carrier, wherein high aspect ratio spaces exist between the electronic components. A dielectric sheet is laminated around the electronic components thus filling the spaces and forming a package body. The spaces are completely and reliably filled by the dielectric sheet and thus the package body has an absence of voids. Further, an upper surface of the package body is planar, i.e., has an absence of ripples or other non-uniformities. Further, lamination of the dielectric sheet is performed with a low cost lamination system.Type: ApplicationFiled: January 28, 2020Publication date: October 22, 2020Inventor: Brett Arnold Dunlap
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Patent number: 10636717Abstract: A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. The fill material includes vias at peripheral locations around the sensor integrated circuit. The fingerprint sensor package can further include a redistribution layer on the sensing side which redistributes connections of the sensor integrated circuit to the vias. The connections can further be directed through the vias to a ball grid array on the connection side. Some aspects also include electrostatic discharge traces positioned at least partially around a perimeter of the connection side. Methods of manufacturing are also disclosed.Type: GrantFiled: September 5, 2017Date of Patent: April 28, 2020Assignee: Amkor Technology, Inc.Inventors: Ronald Patrick Huemoeller, David Bolognia, Robert Francis Darveaux, Brett Arnold Dunlap
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Patent number: 10546833Abstract: A method of forming a plurality of electronic component packages includes attaching electronic components to a carrier, wherein high aspect ratio spaces exist between the electronic components. A dielectric sheet is laminated around the electronic components thus filling the spaces and forming a package body. The spaces are completely and reliably filled by the dielectric sheet and thus the package body has an absence of voids. Further, an upper surface of the package body is planar, i.e., has an absence of ripples or other non-uniformities. Further, lamination of the dielectric sheet is performed with a low cost lamination system.Type: GrantFiled: June 27, 2017Date of Patent: January 28, 2020Assignee: Amkor Technology, Inc.Inventor: Brett Arnold Dunlap
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Publication number: 20180090409Abstract: A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. The fill material includes vias at peripheral locations around the sensor integrated circuit. The fingerprint sensor package can further include a redistribution layer on the sensing side which redistributes connections of the sensor integrated circuit to the vias. The connections can further be directed through the vias to a ball grid array on the connection side. Some aspects also include electrostatic discharge traces positioned at least partially around a perimeter of the connection side. Methods of manufacturing are also disclosed.Type: ApplicationFiled: September 5, 2017Publication date: March 29, 2018Inventors: Ronald Patrick Huemoeller, David Bolognia, Robert Francis Darveaux, Brett Arnold Dunlap
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Publication number: 20170294405Abstract: A method of forming a plurality of electronic component packages includes attaching electronic components to a carrier, wherein high aspect ratio spaces exist between the electronic components. A dielectric sheet is laminated around the electronic components thus filling the spaces and forming a package body. The spaces are completely and reliably filled by the dielectric sheet and thus the package body has an absence of voids. Further, an upper surface of the package body is planar, i.e., has an absence of ripples or other non-uniformities. Further, lamination of the dielectric sheet is performed with a low cost lamination system.Type: ApplicationFiled: June 27, 2017Publication date: October 12, 2017Inventor: Brett Arnold Dunlap
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Patent number: 9754852Abstract: A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. The fill material includes vias at peripheral locations around the sensor integrated circuit. The fingerprint sensor package can further include a redistribution layer on the sensing side which redistributes connections of the sensor integrated circuit to the vias. The connections can further be directed through the vias to a ball grid array on the connection side. Some aspects also include electrostatic discharge traces positioned at least partially around a perimeter of the connection side. Methods of manufacturing are also disclosed.Type: GrantFiled: August 1, 2016Date of Patent: September 5, 2017Assignee: Amkor Technology, Inc.Inventors: Ronald Patrick Huemoeller, David Bolognia, Robert Francis Darveaux, Brett Arnold Dunlap
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Patent number: 9691734Abstract: A method of forming a plurality of electronic component packages includes attaching electronic components to a carrier, wherein high aspect ratio spaces exist between the electronic components. A dielectric sheet is laminated around the electronic components thus filling the spaces and forming a package body. The spaces are completely and reliably filled by the dielectric sheet and thus the package body has an absence of voids. Further, an upper surface of the package body is planar, i.e., has an absence of ripples or other non-uniformities. Further, lamination of the dielectric sheet is performed with a low cost lamination system.Type: GrantFiled: December 7, 2009Date of Patent: June 27, 2017Inventor: Brett Arnold Dunlap
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Patent number: 9013011Abstract: A staggered die MEMS package includes a substrate having a converter cavity formed therein. A converter electronic component is mounted within the converter cavity. Further, a MEMS electronic component is mounted to both the substrate and the converter electronic component in a staggered die arrangement. By staggering the MEMS electronic component directly on the converter electronic component instead of locating the MEMS electronic component in a side by side arrangement with the converter electronic component, the total package width of the staggered die MEMS package is minimized. Further, by locating the converter electronic component within the converter cavity and staggering the MEMS electronic component directly on the converter electronic component, the total package height, sometimes called Z-height, of the staggered die MEMS package is minimized.Type: GrantFiled: March 11, 2011Date of Patent: April 21, 2015Assignee: Amkor Technology, Inc.Inventors: Bob Shih-Wei Kuo, Brett Arnold Dunlap, Louis B. Troche, Jr., Ahmer Syed, Russell Shumway
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Patent number: 8941250Abstract: A redistribution pattern is formed on active surfaces of electronic components while still in wafer form. The redistribution pattern routes bond pads of the electronic components to redistribution pattern terminals on the active surfaces of the electronic components. The bond pads are routed to the redistribution pattern terminals while still in wafer form, which is a low cost and high throughput process, i.e., very efficient process.Type: GrantFiled: February 17, 2014Date of Patent: January 27, 2015Inventors: Robert Francis Darveaux, Brett Arnold Dunlap, Ronald Patrick Huemoeller
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Patent number: 8937381Abstract: A fan out buildup substrate stackable package includes an electronic component having an active surface having bond pads. A package body encloses the electronic component. A first die side buildup dielectric layer is applied to the active surface of the electronic component and to a first surface of the package body. A first die side circuit pattern is formed on the first die side buildup dielectric layer and electrically connected to the bond pads. Through vias extend through the package body and the first die side buildup dielectric layer, the through vias being electrically connected to the first die side circuit pattern. The fan out buildup substrate stackable package is extremely thin and provides a high density interconnect on both sides of the package allowing additional devices to be stacked thereon.Type: GrantFiled: December 3, 2009Date of Patent: January 20, 2015Assignee: Amkor Technology, Inc.Inventors: Brett Arnold Dunlap, Alexander William Copia
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Patent number: 8753730Abstract: A method of fabricating a plurality of electronic component packages includes coupling a tape to a panel. Electronic components are coupled to the tape and encapsulated to form a molded wafer. The molded wafer is mechanically separated from the panel without heating by breaking a mechanical separation adhesive of the tape. By mechanically separating the molded wafer from the panel without heating, warpage of the molded wafer associated with heating is avoided.Type: GrantFiled: November 19, 2012Date of Patent: June 17, 2014Inventors: Brett Arnold Dunlap, Robert Francis Darveaux
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Patent number: 8653674Abstract: A redistribution pattern is formed on active surfaces of electronic components while still in wafer form. The redistribution pattern routes bond pads of the electronic components to redistribution pattern terminals on the active surfaces of the electronic components. The bond pads are routed to the redistribution pattern terminals while still in wafer form, which is a low cost and high throughput process, i.e., very efficient process.Type: GrantFiled: September 15, 2011Date of Patent: February 18, 2014Inventors: Robert Francis Darveaux, Brett Arnold Dunlap, Ronald Patrick Huemoeller
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Patent number: 8535961Abstract: A method of forming a light emitting diode (LED) package includes mounting a LED structure to a carrier, overmolding the LED structure in a package body, backgrinding the package body to expose the LED structure, removing the carrier, and forming a redistribution layer (RDL) buildup structure comprising a RDL circuit pattern coupled to a LED of the LED structure. The LED package is formed without a substrate in one embodiment. By forming the LED package without a substrate, the thickness of the LED package is minimized. Further, by forming the LED package without a substrate, heat removal from the LED is maximized as is electrical performance. Further still, by forming the LED package without a substrate, the fabrication cost of the LED package is minimized.Type: GrantFiled: December 9, 2010Date of Patent: September 17, 2013Assignee: Amkor Technology, Inc.Inventors: Bob Shih-Wei Kuo, Brett Arnold Dunlap, David Bolognia
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Patent number: 8337657Abstract: A method of fabricating a plurality of electronic component packages includes coupling a tape to a panel. Electronic components are coupled to the tape and encapsulated to form a molded wafer. The molded wafer is mechanically separated from the panel without heating by breaking a mechanical separation adhesive of the tape. By mechanically separating the molded wafer from the panel without heating, warpage of the molded wafer associated with heating is avoided.Type: GrantFiled: October 27, 2010Date of Patent: December 25, 2012Assignee: Amkor Technology, Inc.Inventors: Brett Arnold Dunlap, Robert Francis Darveaux
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Patent number: RE47890Abstract: A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. The fill material includes vias at peripheral locations around the sensor integrated circuit. The fingerprint sensor package can further include a redistribution layer on the sensing side which redistributes connections of the sensor integrated circuit to the vias. The connections can further be directed through the vias to a ball grid array on the connection side. Some aspects also include electrostatic discharge traces positioned at least partially around a perimeter of the connection side. Methods of manufacturing are also disclosed.Type: GrantFiled: July 11, 2017Date of Patent: March 3, 2020Assignee: Amkor Technology, Inc.Inventors: Ronald Patrick Huemoeller, David Bolognia, Robert Francis Darveaux, Brett Arnold Dunlap