Packaging for fingerprint sensors and methods of manufacture
A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. The fill material includes vias at peripheral locations around the sensor integrated circuit. The fingerprint sensor package can further include a redistribution layer on the sensing side which redistributes connections of the sensor integrated circuit to the vias. The connections can further be directed through the vias to a ball grid array on the connection side. Some aspects also include electrostatic discharge traces positioned at least partially around a perimeter of the connection side. Methods of manufacturing are also disclosed.
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This Application is a continuation of U.S. application Ser. No. 15/225,565, filed Aug. 1, 2016, expected to issue as U.S. Pat. No. 9,754,852 on Sep. 12, 2017 and titled “PACKAGING FOR FINGERPRINT SENSORS AND METHODS OF MANUFACTURE,” which is a divisional of U.S. patent application Ser. No. 13/420,188, filed Mar. 14, 2012, now U.S. Pat. No. 9,406,580, issued Aug. 2, 2016, and titled PACKAGING FOR FINGERPRINT SENSORS AND METHODS OF MANUFACTURE,” which claims priority to U.S. Provisional Application 61/453,460, entitled PACKAGING FOR FINGERPRINT SENSORS AND METHODS OF MANUFACTURE, filed on Mar. 16, 2011, each of which is hereby incorporated herein by reference in its entirety.
BACKGROUND OF THE DISCLOSED SUBJECT MATTERConventional fingerprint sensors include an integrated circuit, such as a silicon die, with an exposed top surface portion for receiving human touch. Due to the exposed top surface, packaging of the integrated circuit can be difficult. For example, conventional packages encapsulate the integrated circuit while exposing a portion of the top surface, but must provide room for wire connections from the top surface to peripheral connection points on a substrate below the integrated circuit. The substrate is provided with additional connection points in order to allow connection of the fingerprint sensor package to a host device. See, U.S. Pat. No. 7,251,351 issued Jul. 31, 2007, to Mathiassen et al. for Sensor Unit, Especially for Fingerprint Sensors; U.S. Pat. No. 6,710,41 issued Mar. 23, 2004, to Chou et al. for Wafer Level Packing of Micro Electromechanical Device.
Some fingerprint sensors provide the silicon die attached to an underside of a flexible substrate, where human touch over the top of the flexible substrate can be sensed indirectly by the silicon die, as discussed in U.S. Pat. No. 7,099,496, issued to Benkley, on Aug. 29, 2006, entitled SWIPED APERTURE CAPACTIVE FINGERPRINT SENSING SYSTEMS AND METHODS, and U.S. Pat. No. 7,751,601, issued on Jul. 6, 2010, to Benkley, entitled FINGER SENSING ASSEMBLIES AND METHODS OF MAKING, both of which are assigned to the assignee of the present application and incorporated by reference. In such fingerprint sensors, the silicon die is either attached directly under the surface to be touched for sensing through the flexible substrate, or attached remote from the surface to be touched and a separate array of metal traces in communication with the silicone die is located directly under the surface to be touched for sensing through the flexible substrate. Rigid substrates or rigid bases must be coupled to the flexible substrate or positioned under the flexible substrate to provide support for the flexible substrate and/or the silicon die when connected to a host device.
Kim et al., “Application of Through Mold Via (TMV) as PoP Base Package,” 2008 Electronic Components and Technology Conference, IEEE (2008) discusses the application of through mold vias (“TMV”) in a “fan-out” wafer level packaging (“WLFO package”) arrangement for a package on package (“PoP”) device. The disclosure of Kim et al. is incorporated by reference.
SUMMARYAn aspect of the disclosed subject matter provides a fingerprint sensor package including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device. The fingerprint sensor package can also be adapted and configured to include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. Additionally, the fill material can include vias at peripheral locations around the sensor integrated circuit. The fingerprint sensor package can further be adapted and configured to include a redistribution layer on the sensing side which redistributes connections of the sensor integrated circuit to the vias. The connections can further be directed through the vias to a ball grid array on a connection side. Some aspects also include electrostatic discharge traces positioned at least partially around a perimeter of the connection side.
Another aspect of the disclosure provides for the fabrication of the sensors.
INCORPORATION BY REFERENCEAll publications, patents, and patent applications mentioned in this specification are herein incorporated by reference to the same extent as if each individual publication, patent, or patent application was specifically and individually indicated to be incorporated by reference, for all possible purposes and to the same extent as if the disclosure of which was reproduced in the present application in its entirety.
The novel features of the disclosed subject matter are set forth with particularity in the appended claims. A better understanding of the features and advantages of the present disclosed subject matter will be obtained by reference to the following detailed description that sets forth illustrative embodiments, in which the principles of the disclosed subject matter are utilized, and the accompanying drawings of which:
The following discussion is presented to enable a person skilled in the art to make and use embodiments of the disclosed subject matter. Various modifications to the illustrated embodiments will be readily apparent to those skilled in the art, and the generic principles herein can be applied to other embodiments and applications without departing from embodiments of the disclosed subject matter. Thus, embodiments of the disclosed subject matter are not intended to be limited to embodiments shown, but are to be accorded the widest scope consistent with the principles and features disclosed herein. The following detailed description is to be read with reference to the figures, in which like elements in different figures have like reference numerals. The figures, which are not necessarily to scale, depict selected embodiments and are not intended to limit the scope of embodiments of the disclosed subject matter. Skilled artisans will recognize the examples provided herein have many useful alternatives which fall within the scope of embodiments of the disclosed subject matter and/or the appended claims.
As shown in
In at least some aspects, the sensing side redistribution layer 30 can include a metal layer 36 with metal redistribution traces 36′, a metal sensor array (not shown), and, optionally, additional metal traces (not shown). The metal layer 36 can be positioned between a first passivation layer 38 and a second passivation layer 40, as shown in
Fingerprint information sensed by the sensor array (not shown) can be transmitted to the sensor integrated circuit 28 via wireless or wired communication technologies. For example, in one aspect, a circuit side 42 of the sensor integrated circuit 28 (e.g., the side facing the sensing side 12) can include a radio frequency receiver (not shown) and each trace of the sensor array (not shown) can include a radio frequency transmitter (not shown) for transmitting the sensed fingerprint information to the radio frequency receiver (not shown). In other aspects, the sensor integrated circuit 28 can include a plurality of radiofrequency receivers (not shown), e.g., formed on the sensor side 42 of the integrated circuit 28, for receiving information transmitted from one or more of the radio frequency transmitter traces (not shown) of the sensor array (not shown), e.g., also formed on the sensor side 42 of the integrated circuit 28. The sensor integrated circuit 28 can also include drive and sense electronics for interpreting the fingerprint information received. In addition, the sensing side coating layer 32 can provide substantial protection against mechanical abrasion and/or mechanical wear of the sensor integrated circuit 28 and the sensing side redistribution layer 30, while such traces as may be formed on the sensor side 42 of the integrated circuit 28 can be similarly protected by layers 30 and 32.
In other aspects, the circuitry on the sensor side 42 of the sensor integrated circuit 28 can include an embedded pixel array (not shown) for directly sensing fingerprint information. In one example, the embedded pixel array (not shown) can sense fingerprint information through the sensing side redistribution layer 30 and/or the sensing side coating layer 32. In another example, the embedded pixel array (not shown) can be substantially exposed on the sensing side 12 so that the finger directly touches the sensor integrated circuit 28 for sensing, e.g., through an opening formed in the layers 30 and 32. The sensor integrated circuit 28 can also include the drive and sense electronics for interpreting the fingerprint information sensed by the pixel array (not shown).
The mold filler 16 can provide the fingerprint sensor package 10 with substantial strength and durability, and can substantially protect the sensor integrated circuit 28 from physical damage. As shown in
Conventional electronic components, such as integrated circuits 28 in fingerprint sensor packages 10, can be exposed to electrostatic discharge (ESD) from various different sources, such as the human body (e.g., during a finger swipe). Contact between the sources and a grounded integrated circuit can generate large enough currents through the integrated circuit to cause significant damage. As shown in
ESD can build up on the sensing side 12 as a user swipes his or her finger. This charge can continue to increase in potential until the path of least resistance is found and the charge is dissipated. The ESD discharge traces 54 can create the shortest discharge path for ESD, thus preventing ESD from discharging to the sensor integrated circuit 28 or any other components of the fingerprint sensing package 10 and potentially damaging them. In some aspects, the ESD discharge traces 54 can completely surround the outside perimeter of the connection side 14. In other aspects, the ESD discharge traces 54 can partially surround the outside perimeter of the connection side 14. Also, in some aspects, the ESD discharge traces 54 can be positioned on the sensing side 12 to completely or at least partially surround the sensor array (not shown).
At steps 86 and 88, the new wafer 82 can be turned over for processing of layers on the sensing side 12, as shown in
In some aspects, the sensing side redistribution layer 30 can have a thickness between about 22.5 micrometers and about 31 micrometers. For example, the first passivation layer 38, e.g., formed of a dielectric, such as, amorphous silicon dioxide (“SiO2”), can have a thickness of about 11 micrometers, the metal layer 36 can have a thickness of about 9 micrometers, and the second passivation layer 40, e.g., also of SiO2 can have a thickness of about 11 micrometers. In addition, in some aspects, the sensing side coating layer 32 can have a thickness of between about 15 micrometers and 25 micrometers. In some aspects, the thickness of the second passivation layer 40 and the sensing side coating layer 32 may be thin enough to allow sufficient sensing of fingerprint information by the sensor array (not shown), which may be formed, e.g., in the metal layer 36 or on the sensor side 42 of the integrated circuit 28.
Following processing of the sensing side 12, the new wafer 82 can be turned over for processing of the connection side 14. At step 90, the mold filler 16 can be laser ablated from the connection side 14 to create vias 44 in line with the electrical redistribution connection locations 48 on the sensing side 12. At step 92, the connection side redistribution layer 34 can be applied to the connection side 14 including, at step 94, applying a copper layer 34 to the connection side 14 and, at step 96, etching the copper to provide routing connections, e.g., from the vias 44 to BGA 25 connection points 50. Also, at step 96, etching of the copper can provide electrostatic discharge traces 54, as described above, between the die 60. At step 98, the vias 44 can be filled with a filler material 52 and at step 100, the BGA 25 solder balls 26 can be attached at the BGA 25 connection points 50, as shown, e.g., in
Following attachment of the BGA 25 solder balls 26, the packages can be laser marked (e.g., on the connection side 14) at step 102 with additional identification information. At step 104, final testing can be performed on the packages. At step 106, individual fingerprint sensor packages 10 can be separated, as shown in
In some aspects, the fingerprint sensor package 10, as shown in
As shown in
As shown in
A silicon wafer including a plurality of die 60 (i.e., sensor integrated circuits 28) can be sawed apart and the die 60 can be distributed on a sticky tape or similar material so that the circuit side 42 of the die 60 are attached to the sticky tape. Also, a panel of interposer boards 112 can be split apart and the individual interposer boards 112 can be distributed onto the sticky tape in between the die, for example in the orientation shown in
After the die 60 and the interposer boards 112 are distributed onto the sticky tape, the mold filler 16 can be applied to substantially cover and fill between the die 60 and the interposer boards 112, substantially fixing the die 60 and the interposer boards 112 in place in relation to one another and creating a new wafer. The sticky tape can be removed and a sensing side redistribution layer 30 can be applied to the sensing side 12 of the new wafer. The sensing side redistribution layer 30 can electrically connect the die 60 and the interposer boards 112, as described above. The sensing side redistribution layer 30 can also include the metal sensor array (not shown) including the image sensor drivers and pick-ups (not shown) and/or the velocity sensor drivers and pick-ups (not shown). The sensing side redistribution layer 30 can be coated, for example with a sensing side coating layer 32. The connection side 14 of the new wafer can be laser ablated to expose BGA 25 solder ball 26 connection points 50 on the interposer boards 112 and the BGA 25 solder balls 26 can then be applied to the BGA 25 solder ball 26 connection points 50. The new wafer can then be sawed apart at the saw lines 117, as shown in
In one embodiment, the fingerprint sensor package 10, as shown in
Turning now to
If a package constructed using a supporting filler, such as a wafer level fan out (“WLFO”) construction technique, and uses-through is made with through-mold vias (“TMVs”) formed through the molded filler material, the package can be made much thinner. It is, also, much easier to do the TMV, if the WLFO is connected to a multilayer printed circuit board “PCB”. Multilayer PCBs are relatively cheap, and can also be used to adjust the height of the package very easily. A connection to a common reference voltage, e.g., a grounded connection “EGND” 160 could be placed around the edge of the PCB 150, as seen, e.g., in
While preferred embodiments of the present disclosed subject matter have been shown and described herein, it will be obvious to those skilled in the art that such embodiments are provided by way of example only. Numerous variations, changes, and substitutions will now occur to those skilled in the art without departing from the disclosed subject matter. It should be understood that various alternatives to the embodiments of the disclosed subject matter described herein may be employed in practicing the disclosed subject matter. It is intended that the following claims define the scope of the disclosed subject matter and that methods and structures within the scope of these claims and their equivalents be covered thereby.
Claims
1. A fingerprint sensor package comprising:
- a sensor die having a die top side, a die bottom side, and die lateral sides, wherein the sensor die comprises sensing electronics;
- a sensing area on the die top side;
- a top side trace, at least a portion of which is directly above the sensor die;
- a bottom side trace, at least a portion of which is directly below the sensor die;
- a conductive via that electrically connects the top side trace and the bottom side trace; an encapsulant that covers at least the die lateral sides;
- and a protective layer that covers the sensing area;
- wherein the protective layer is separated from the die top side by at least one intervening layer; wherein a lateral side of the protective layer, a lateral side of the at least one intervening layer, and a lateral side of the encapsulant are coplanar.
2. The fingerprint sensor package of claim 1, wherein the protective layer covers the entire die top side.
3. The fingerprint sensor package of claim 2, wherein the protective layer covers an entire top side of the encapsulant.
4. The fingerprint sensor package of claim 1, wherein:
- the protective layer comprises a plurality of lateral sides; and
- the encapsulant comprises a plurality of lateral sides, each of which is coplanar with a respective one of the lateral sides of the protective layer.
5. The fingerprint sensor package of claim 1, wherein the protective layer is less than 25 microns thick.
6. A fingerprint sensor package comprising:
- a sensor die having a die top side, a die bottom side, and die lateral sides, w herein the sensor die comprises sensing electronics;
- a sensing area on the die top side;
- a top side trace, at least a portion of which is directly above the sensor die;
- a bottom side trace, at least a portion of which is directly below the sensor die;
- a conductive via that electrically connects the top side trace and the bottom side trace;
- and an encapsulant that covers at least a portion of the die bottom side and covers at least a portion of each of the die lateral sides;
- a connection point directly below the sensor die; and a conductive ball attached to the connection point,
- Wherein an upper end of the conductive ball is higher than a lowest surface of the encapsulant, and a lower end of the conductive ball is lower than the lowest surface of the encapsulant.
7. The fingerprint sensor package of claim 6, wherein the encapsulant covers the entire die bottom side.
8. The fingerprint sensor package of claim 6, wherein a lowest surface of the encapsulant is at least as low as a lowest surface of the bottom side trace.
9. The fingerprint sensor package of claim 6, wherein a top side of the encapsulant is substantially coplanar with the die top side.
4151512 | April 24, 1979 | Rigannati et al. |
4225850 | September 30, 1980 | Chang et al. |
4310827 | January 12, 1982 | Asi |
4353056 | October 5, 1982 | Tsikos |
4405829 | September 20, 1983 | Rivest et al. |
4525859 | June 25, 1985 | Bowles et al. |
4550221 | October 29, 1985 | Mabusth |
4580790 | April 8, 1986 | Doose |
4758622 | July 19, 1988 | Gosselin |
4817183 | March 28, 1989 | Sparrow |
5076566 | December 31, 1991 | Kriegel |
5109427 | April 28, 1992 | Yang |
5140642 | August 18, 1992 | Hau et al. |
5305017 | April 19, 1994 | Gerpheide |
5319323 | June 7, 1994 | Fong |
5325442 | June 28, 1994 | Knapp |
5420936 | May 30, 1995 | Fitzpatrick et al. |
5422807 | June 6, 1995 | Mitra et al. |
5456256 | October 10, 1995 | Schneider et al. |
5543591 | August 6, 1996 | Gillespie et al. |
5569901 | October 29, 1996 | Bridgelall et al. |
5623552 | April 22, 1997 | Lane |
5627316 | May 6, 1997 | Winter et al. |
5650842 | July 22, 1997 | Maase et al. |
5818956 | October 6, 1998 | Tuli |
5848176 | December 8, 1998 | Harra et al. |
5850450 | December 15, 1998 | Schweitzer et al. |
5852670 | December 22, 1998 | Setlak et al. |
5717777 | February 10, 1998 | Wong et al. |
5781651 | July 14, 1998 | Hsiao et al. |
5801681 | September 1, 1998 | Sayag |
5838306 | November 17, 1998 | O'Connor |
5864296 | January 26, 1999 | Upton |
5887343 | March 30, 1999 | Salatino et al. |
5892824 | April 6, 1999 | Beatson et al. |
5903225 | May 11, 1999 | Schmitt et al. |
5915757 | June 29, 1999 | Tsuyama et al. |
5920384 | July 6, 1999 | Borza |
5920640 | July 6, 1999 | Salatino et al. |
5940526 | August 17, 1999 | Setlak et al. |
5962810 | October 5, 1999 | Glenn |
5963679 | October 5, 1999 | Setlak |
5999637 | December 7, 1999 | Toyoda et al. |
6002815 | December 14, 1999 | Immega et al. |
6016355 | January 18, 2000 | Dickinson et al. |
6052475 | April 18, 2000 | Upton |
6067368 | May 23, 2000 | Setlak et al. |
6073343 | June 13, 2000 | Petrick et al. |
6076566 | June 20, 2000 | Lowe |
6088585 | July 11, 2000 | Schmitt et al. |
6098175 | August 1, 2000 | Lee |
6118318 | September 12, 2000 | Fifield et al. |
6134340 | October 17, 2000 | Hsu et al. |
6157722 | December 5, 2000 | Lemer et al. |
6161213 | December 12, 2000 | Lofstrom |
6175407 | January 16, 2001 | Santor |
6182076 | January 30, 2001 | Yu et al. |
6182892 | February 6, 2001 | Angelo et al. |
6185318 | February 6, 2001 | Jain et al. |
6234031 | May 22, 2001 | Suga |
6241288 | June 5, 2001 | Bergenek et al. |
6246566 | June 12, 2001 | Glenn |
6288346 | September 11, 2001 | Ojiri et al. |
6289114 | September 11, 2001 | Mainguet |
6292272 | September 18, 2001 | Okauchi et al. |
6317508 | November 13, 2001 | Okauchi et al. |
6320394 | November 20, 2001 | Tartagni |
6332193 | December 18, 2001 | Glass et al. |
6333989 | December 25, 2001 | Borza |
6337919 | January 8, 2002 | Duton |
6342406 | January 29, 2002 | Glenn |
6346739 | February 12, 2002 | Lepert et al. |
6347040 | February 12, 2002 | Fries et al. |
6357663 | March 19, 2002 | Takahashi et al. |
6362633 | March 26, 2002 | Tartagni |
6360004 | March 19, 2002 | Akizuki |
6392636 | May 21, 2002 | Ferrari et al. |
6399994 | June 4, 2002 | Shobu |
6400836 | June 4, 2002 | Senior |
6408087 | June 18, 2002 | Kramer |
6473072 | October 29, 2002 | Comiskey et al. |
6509501 | January 21, 2003 | Eicken et al. |
6509560 | January 21, 2003 | Glenn |
6525547 | February 25, 2003 | Hayes |
6525932 | February 25, 2003 | Ohnishi et al. |
6539101 | March 25, 2003 | Black |
6580816 | June 17, 2003 | Kramer et al. |
6597289 | July 22, 2003 | Sabatini |
6631201 | October 7, 2003 | Dickinson et al. |
6643389 | November 4, 2003 | Raynal et al. |
6672174 | January 6, 2004 | Deconde et al. |
6710419 | March 23, 2004 | Bailey |
6710416 | March 23, 2004 | Chou et al. |
6710461 | March 23, 2004 | Chou et al. |
6738050 | May 18, 2004 | Comiskey et al. |
6741729 | May 25, 2004 | Bjorn et al. |
6757002 | June 29, 2004 | Oross et al. |
6766040 | July 20, 2004 | Catalano et al. |
6785407 | August 31, 2004 | Tschudi et al. |
6836230 | December 28, 2004 | Le Pailleur et al. |
6838905 | January 4, 2005 | Doyle |
6873356 | March 29, 2005 | Kanbe et al. |
6876072 | April 5, 2005 | Wang et al. |
6886104 | April 26, 2005 | McClurg et al. |
6897002 | May 24, 2005 | Teraoka et al. |
6898299 | May 24, 2005 | Brooks |
6924496 | August 2, 2005 | Manansala |
6937748 | August 30, 2005 | Schneider et al. |
6941001 | September 6, 2005 | Bolle et al. |
6941810 | September 13, 2005 | Okada |
6950540 | September 27, 2005 | Higuchi |
6959874 | November 1, 2005 | Bardwell |
6963626 | November 8, 2005 | Shaeffer et al. |
6970584 | November 29, 2005 | O'Gorman et al. |
6980672 | December 27, 2005 | Saito et al. |
6983882 | January 10, 2006 | Cassone |
7146024 | December 5, 2006 | Benkley |
7146026 | December 5, 2006 | Russon et al. |
7146029 | December 5, 2006 | Manansala |
7013030 | March 14, 2006 | Wong et al. |
7015579 | March 21, 2006 | Okada et al. |
7020591 | March 28, 2006 | Wei et al. |
7030860 | April 18, 2006 | Hsu et al. |
7031670 | April 18, 2006 | May |
7035443 | April 25, 2006 | Wong |
7042535 | May 9, 2006 | Katoh et al. |
7043061 | May 9, 2006 | Wong |
7043644 | May 9, 2006 | DeBruine |
7046230 | May 16, 2006 | Zadesky et al. |
7064743 | June 20, 2006 | Nishikawa |
7099496 | August 29, 2006 | Benkley |
7110574 | September 19, 2006 | Haruki et al. |
7110577 | September 19, 2006 | Tschud |
7113622 | September 26, 2006 | Hamid |
7126389 | October 24, 2006 | McRae et al. |
7129926 | October 31, 2006 | Mathiassen et al. |
7136514 | November 14, 2006 | Wong |
7184581 | February 27, 2007 | Johansen et al. |
7190816 | March 13, 2007 | Mitsuyu et al. |
7194392 | March 20, 2007 | Tuken et al. |
7197168 | March 27, 2007 | Russo |
7200250 | April 3, 2007 | Chou |
7251351 | July 31, 2007 | Mathiassen et al. |
7258279 | August 21, 2007 | Schneider et al. |
7260246 | August 21, 2007 | Fujii |
7263212 | August 28, 2007 | Kawabe |
7263213 | August 28, 2007 | Rowe |
7289649 | October 30, 2007 | Walley et al. |
7290323 | November 6, 2007 | Deconde et al. |
7308121 | December 11, 2007 | Mathiassen et al. |
7308122 | December 11, 2007 | McClurg et al. |
7447339 | November 4, 2008 | Mimura et al. |
7447911 | November 4, 2008 | Chou et al. |
7460697 | December 2, 2008 | Erhart et al. |
7463756 | December 9, 2008 | Benkley |
7356169 | April 8, 2008 | Hamid |
7360688 | April 22, 2008 | Harris |
7369685 | May 6, 2008 | Deleon |
7379569 | May 27, 2008 | Chikazawa et al. |
7408135 | August 5, 2008 | Fujeda |
7409876 | August 12, 2008 | Ganapathi et al. |
7412083 | August 12, 2008 | Takahashi |
7424618 | September 9, 2008 | Roy et al. |
7321672 | January 22, 2008 | Sasaki et al. |
7505611 | March 17, 2009 | Fyke |
7505613 | March 17, 2009 | Russo |
7565548 | July 21, 2009 | Fiske et al. |
7574022 | August 11, 2009 | Russo |
7596832 | October 6, 2009 | Hsieh et al. |
7643950 | January 5, 2010 | Getzin et al. |
7646897 | January 12, 2010 | Fyke |
7675180 | March 9, 2010 | St. Amand |
7681232 | March 16, 2010 | Nordentoft et al. |
7689013 | March 30, 2010 | Shinzaki |
7706581 | April 27, 2010 | Drews et al. |
7733697 | June 8, 2010 | Picca et al. |
7751601 | July 6, 2010 | Benkley |
7843438 | November 30, 2010 | Onoda |
7848798 | December 7, 2010 | Martinsen et al. |
7859116 | December 28, 2010 | Kelly et al. |
8031916 | October 4, 2011 | Abiko et al. |
7899216 | March 1, 2011 | Watanabe et al. |
7953258 | May 31, 2011 | Dean et al. |
8005276 | August 23, 2011 | Dean et al. |
8018065 | September 13, 2011 | Lam |
8077935 | December 13, 2011 | Geoffroy et al. |
8107212 | January 31, 2012 | Nelson et al. |
8116540 | February 14, 2012 | Dean et al. |
8131026 | March 6, 2012 | Benkley et al. |
8165355 | April 24, 2012 | Benkley et al. |
8169070 | May 1, 2012 | Poeppel et al. |
8175345 | May 8, 2012 | Gardner |
8204281 | June 19, 2012 | Satya et al. |
8716613 | May 6, 2014 | Pererselsky et al. |
8717775 | May 6, 2014 | Bolognia |
9025301 | May 5, 2015 | Adlam |
9406580 | August 2, 2016 | Erhart |
20010015431 | August 23, 2001 | Shobu |
20010026636 | October 4, 2001 | Mainget |
20010030644 | October 18, 2001 | Allport |
20010036299 | November 1, 2001 | Senior |
20010043728 | November 22, 2001 | Kramer et al. |
20020025062 | February 28, 2002 | Black |
20020061125 | May 23, 2002 | Fujii |
20020064892 | May 30, 2002 | Lepert et al. |
20020067845 | June 6, 2002 | Griffis |
20020073046 | June 13, 2002 | David |
20020089044 | July 11, 2002 | Simmons et al. |
20020089410 | July 11, 2002 | Janiak et al. |
20020096731 | July 25, 2002 | Wu et al. |
20020122026 | September 5, 2002 | Bergstrom |
20020126516 | September 12, 2002 | Jeon |
20020133725 | September 19, 2002 | Roy et al. |
20020152048 | October 17, 2002 | Hayes |
20020181749 | December 5, 2002 | Matsumoto et al. |
20030002717 | January 2, 2003 | Hamid |
20030002719 | January 2, 2003 | Hamid et al. |
20030021495 | January 30, 2003 | Cheng |
20030035570 | February 20, 2003 | Benkley |
20030063782 | April 3, 2003 | Acharya et al. |
20030068072 | April 10, 2003 | Hamid |
20030076301 | April 24, 2003 | Tsuk et al. |
20030076303 | April 24, 2003 | Huppi |
20030095096 | May 22, 2003 | Robbin et al. |
20030095690 | May 22, 2003 | Su et al. |
20030102874 | June 5, 2003 | Lane et al. |
20030123714 | July 3, 2003 | O'Gorman et al. |
20030123715 | July 3, 2003 | Uchida |
20030141959 | July 31, 2003 | Keogh et al. |
20030147015 | August 7, 2003 | Katoh et al. |
20030161510 | August 28, 2003 | Fuji |
20030161512 | August 28, 2003 | Mathiassen et al. |
20030169228 | September 11, 2003 | Mathiassen et al. |
20030174871 | September 18, 2003 | Yoshioka et al. |
20030186157 | October 2, 2003 | Teraoka et al. |
20030209293 | November 13, 2003 | Sako et al. |
20030224553 | December 4, 2003 | Manansala |
20030227094 | December 11, 2003 | Chou et al. |
20040012773 | January 22, 2004 | Puttkammer |
20040017934 | January 29, 2004 | Kocher et al. |
20040022001 | February 5, 2004 | Chu et al. |
20040042642 | March 4, 2004 | Bolle et al. |
20040050930 | March 18, 2004 | Rowe |
20040066613 | April 8, 2004 | Leitao |
20040076313 | April 22, 2004 | Bronstein et al. |
20040081339 | April 29, 2004 | Benkley |
20040096086 | May 20, 2004 | Miyasaka |
20040113956 | June 17, 2004 | Bellwood et al. |
20040120400 | June 24, 2004 | Linzer |
20040125993 | July 1, 2004 | Zhao |
20040129787 | July 8, 2004 | Saito |
20040136612 | July 15, 2004 | Meister et al. |
20040145044 | July 29, 2004 | Sugaya |
20040155752 | August 12, 2004 | Radke |
20040172339 | September 2, 2004 | Snelgrove et al. |
20040179718 | September 16, 2004 | Chou |
20040184641 | September 23, 2004 | Nagasaka et al. |
20040188838 | September 30, 2004 | Okada et al. |
20040190761 | September 30, 2004 | Lee |
20040208346 | October 21, 2004 | Baharav et al. |
20040208347 | October 21, 2004 | Baharav et al. |
20040208348 | October 21, 2004 | Baharav et al. |
20040213441 | October 28, 2004 | Tschudi |
20040215689 | October 28, 2004 | Dooley et al. |
20040228505 | November 18, 2004 | Sugimoto |
20040228508 | November 18, 2004 | Shigeta |
20040240712 | December 2, 2004 | Rowe et al. |
20040252867 | December 16, 2004 | Lan et al. |
20050031174 | February 10, 2005 | Ryhanen |
20050036665 | February 17, 2005 | Higuchi |
20050047485 | March 3, 2005 | Khayrallah et al. |
20050051859 | March 10, 2005 | Hoffman |
20050100196 | May 12, 2005 | Scott et al. |
20050100938 | May 12, 2005 | Hoffmann et al. |
20050109835 | May 26, 2005 | Jacoby et al. |
20050110103 | May 26, 2005 | Setlak |
20050111708 | May 26, 2005 | Chou |
20050123176 | June 9, 2005 | Ishii et al. |
20050129291 | June 16, 2005 | Boshra |
20050136200 | June 23, 2005 | Durell et al. |
20050139656 | June 30, 2005 | Amouse |
20050139685 | June 30, 2005 | Kozlay |
20050162402 | July 28, 2005 | Watanachote |
20050169503 | August 4, 2005 | Howell et al. |
20050174015 | August 11, 2005 | Scott et al. |
20050210271 | September 22, 2005 | Chou et al. |
20050219200 | October 6, 2005 | Weng |
20050220329 | October 6, 2005 | Payne et al. |
20050231213 | October 20, 2005 | Chou et al. |
20050238212 | October 27, 2005 | Du et al. |
20050244038 | November 3, 2005 | Benkley |
20050244039 | November 3, 2005 | Geoffroy et al. |
20050247559 | November 10, 2005 | Frey et al. |
20050249386 | November 10, 2005 | Juh |
20050258952 | November 24, 2005 | Utter et al. |
20050269402 | December 8, 2005 | Spitzer et al. |
20050274690 | December 15, 2005 | Park |
20060006224 | January 12, 2006 | Modi |
20060055500 | March 16, 2006 | Burke et al. |
20060066572 | March 30, 2006 | Yumoto et al. |
20060078176 | April 13, 2006 | Abiko et al. |
20060083411 | April 20, 2006 | Benkley |
20060110537 | May 25, 2006 | Huang et al. |
20060140461 | June 29, 2006 | Kim et al. |
20060144953 | July 6, 2006 | Takao |
20060170528 | August 3, 2006 | Funushige et al. |
20060187200 | August 24, 2006 | Martin |
20060210082 | September 21, 2006 | Devadas et al. |
20060214512 | September 28, 2006 | Watanabe et al. |
20060249008 | November 9, 2006 | Luther |
20060259873 | November 16, 2006 | Mister |
20060261174 | November 23, 2006 | Zellner et al. |
20060267125 | November 30, 2006 | Huang et al. |
20060267385 | November 30, 2006 | Steenwyk et al. |
20060271793 | November 30, 2006 | Devadas et al. |
20060287963 | December 21, 2006 | Steeves et al. |
20070031011 | February 8, 2007 | Erhart et al. |
20070036400 | February 15, 2007 | Watanabe et al. |
20070057763 | March 15, 2007 | Blattner et al. |
20070067828 | March 22, 2007 | Bychkov |
20070076926 | April 5, 2007 | Schneider et al. |
20070076951 | April 5, 2007 | Tanaka et al. |
20070086634 | April 19, 2007 | Setlak et al. |
20070090312 | April 26, 2007 | Stallinga et al. |
20070138299 | June 21, 2007 | Mitra |
20070160269 | July 12, 2007 | Kuo |
20070180261 | August 2, 2007 | Akkermans et al. |
20070196002 | August 23, 2007 | Choi et al. |
20070198141 | August 23, 2007 | Moore |
20070198435 | August 23, 2007 | Siegal et al. |
20070228154 | October 4, 2007 | Tran |
20070237366 | October 11, 2007 | Maletsky |
20070248249 | October 25, 2007 | Stoianov |
20080002867 | January 3, 2008 | Mathiassen et al. |
20080013805 | January 17, 2008 | Sengupta et al. |
20080019578 | January 24, 2008 | Saito et al. |
20080049987 | February 28, 2008 | Champagne et al. |
20080049989 | February 28, 2008 | Iseri et al. |
20080063245 | March 13, 2008 | Benkley et al. |
20080069412 | March 20, 2008 | Champagne et al. |
20080126260 | May 29, 2008 | Cox et al. |
20080169345 | July 17, 2008 | Keane et al. |
20080170695 | July 17, 2008 | Adler et al. |
20080175450 | July 24, 2008 | Scott et al. |
20080178008 | July 24, 2008 | Takahashi et al. |
20080179112 | July 31, 2008 | Qin et al. |
20080185429 | August 7, 2008 | Saville |
20080201265 | August 21, 2008 | Hewton |
20080205714 | August 28, 2008 | Benkley et al. |
20080219521 | September 11, 2008 | Benkley et al. |
20080222049 | September 11, 2008 | Loomis et al. |
20080223925 | September 18, 2008 | Saito et al. |
20080226132 | September 18, 2008 | Gardner |
20080240523 | October 2, 2008 | Benkley et al. |
20080244277 | October 2, 2008 | Orsini et al. |
20080267462 | October 30, 2008 | Nelson et al. |
20080279373 | November 13, 2008 | Erhart et al. |
20080304821 | December 11, 2008 | Jeung |
20080308917 | December 18, 2008 | Pressel et al. |
20080308924 | December 18, 2008 | Szewerenko et al. |
20090130369 | May 21, 2009 | Huang et al. |
20090153297 | June 18, 2009 | Gardner |
20090154779 | June 18, 2009 | Satyan et al. |
20090155456 | June 18, 2009 | Benkley et al. |
20090169071 | July 2, 2009 | Bond et al. |
20090174974 | July 9, 2009 | Huang et al. |
20090218698 | September 3, 2009 | Lam |
20090237135 | September 24, 2009 | Ramaraju et al. |
20090252384 | October 8, 2009 | Dean et al. |
20090252385 | October 8, 2009 | Dean et al. |
20090252386 | October 8, 2009 | Dean et al. |
20090279742 | November 12, 2009 | Abiko |
20090319435 | December 24, 2009 | Little et al. |
20090324028 | December 31, 2009 | Russo |
20100013091 | January 21, 2010 | Meyer et al. |
20100026451 | February 4, 2010 | Erhart et al. |
20100045705 | February 25, 2010 | Vertegaal et al. |
20100083000 | April 1, 2010 | Kesanupalli et al. |
20100119124 | May 13, 2010 | Satyan |
20100123657 | May 20, 2010 | Ippel |
20100127366 | May 27, 2010 | Bond et al. |
20101014836 | June 2010 | Lin et al. |
20100176823 | July 15, 2010 | Thompson et al. |
20100176892 | July 15, 2010 | Thompson et al. |
20100177940 | July 15, 2010 | Thompson et al. |
20100180136 | July 15, 2010 | Thompson et al. |
20100189314 | July 29, 2010 | Benkley et al. |
20100208953 | August 19, 2010 | Gardner et al. |
20100244166 | September 30, 2010 | Shibuta et al. |
20100272329 | October 28, 2010 | Benkley |
20100284565 | November 11, 2010 | Benkley et al. |
20100327393 | December 30, 2010 | Meinel |
20110002461 | January 6, 2011 | Erhart et al. |
20110018556 | January 27, 2011 | Le et al. |
20110079903 | April 7, 2011 | Liu |
20110090047 | April 21, 2011 | Patel |
20110102567 | May 5, 2011 | Erhart |
20110102569 | May 5, 2011 | Erhart |
20110157853 | June 30, 2011 | Gah |
20110175703 | July 21, 2011 | Benkley |
20110176307 | July 21, 2011 | Benkley |
20110182486 | July 28, 2011 | Valfridsson et al. |
20110214924 | September 8, 2011 | Pererselsky et al. |
20110267298 | November 3, 2011 | Erhart et al. |
20110298711 | December 8, 2011 | Dean et al. |
20110304001 | December 15, 2011 | Erhart et al. |
20120044639 | February 23, 2012 | Garcia |
20120256280 | October 11, 2012 | Ehart |
20160343634 | November 24, 2016 | Huemoeller et al. |
101379510 | March 2009 | CN |
2213813 | October 1973 | DE |
102012005926 | September 2013 | DE |
0929028 | January 1998 | EP |
0905646 | March 1999 | EP |
0973123 | January 2000 | EP |
1018697 | July 2000 | EP |
1139301 | October 2001 | EP |
1531419 | May 2005 | EP |
1533759 | May 2005 | EP |
1538548 | June 2005 | EP |
1624399 | February 2006 | EP |
1775674 | April 2007 | EP |
1939788 | July 2008 | EP |
2331613 | May 1999 | GB |
2480919 | December 2011 | GB |
01094418 | April 1989 | JP |
04158434 | June 1992 | JP |
2005011002 | January 2005 | JP |
2005242856 | September 2005 | JP |
10-2005-0107575 | November 2005 | KR |
10-2009-0031360 | March 2009 | KR |
200606745 | February 2006 | TW |
200620140 | June 2006 | TW |
200629167 | August 2006 | TW |
201011840 | March 2010 | TW |
1990/03620 | April 1990 | WO |
1998/58342 | December 1998 | WO |
1999/028701 | June 1999 | WO |
1999/043258 | September 1999 | WO |
2001/022349 | March 2001 | WO |
2001/094902 | December 2001 | WO |
2001/094902 | December 2001 | WO |
2001/095304 | December 2001 | WO |
2002/011066 | February 2002 | WO |
2002/047018 | June 2002 | WO |
2002/047018 | June 2002 | WO |
2002/061668 | August 2002 | WO |
2002/077907 | October 2002 | WO |
2003/063054 | July 2003 | WO |
2003/075210 | September 2003 | WO |
2004/066194 | August 2004 | WO |
2004/066693 | August 2004 | WO |
2005/0104012 | November 2005 | WO |
2005/106774 | November 2005 | WO |
2005/106774 | November 2005 | WO |
2006/040724 | April 2006 | WO |
2006/041780 | April 2006 | WO |
2007/011607 | January 2007 | WO |
2008/033264 | March 2008 | WO |
2008/033264 | March 2008 | WO |
2008/033265 | June 2008 | WO |
2008/033265 | June 2008 | WO |
2008/137287 | November 2008 | WO |
2009/002599 | December 2008 | WO |
2009/002599 | December 2008 | WO |
2009/029257 | June 2009 | WO |
2009/079219 | June 2009 | WO |
2009/079221 | June 2009 | WO |
2009/079257 | June 2009 | WO |
2009/079262 | June 2009 | WO |
2010/034036 | March 2010 | WO |
2010/036445 | April 2010 | WO |
2010/143597 | December 2010 | WO |
2011/088248 | January 2011 | WO |
2011/088252 | January 2011 | WO |
2011/053797 | May 2011 | WO |
- Decision to Refuse dated Apr. 26, 2018 corresponding to German Patent Application No. 10 2012 005 296.0.
- Examination Report dated Aug. 25, 2017 corresponding to German Patent Application No. 10 2012 005 296.0.
- Great Britain Examination Report dated Sep. 5, 2017 for Great Britain Patent Application No. GB1204480.6.
- Notice of Preliminary Rejection dated Jan. 9, 2018 corresponding to Korean Patent Application No. 10-2012-0026762.
- Complaint with Exhibits, Amkor Technology, Inc. v. Synaptics Incorporated and Validity Sensors, LLC, District of Delaware, 1 :15-cv-0091 O-GMS, Oct. 9, 2015.
- Synaptics Incorporated's Motion to Dismiss, Amkor Technology, Inc. v. Synaptics 475 Incorporated and Validity Sensors, LLC, District of Delaware, 1 :15-cv-0091 O-GMS, Dec. 18, 2015.
- Validity Sensors, LLC's Motion to Dismiss, Amkor Technology, Inc. v. Synaptics 476 Incorporated and Validity Sensors, LLC, District of Delaware, 1 :15-cv-0091 O-GMS, Dec. 18, 2015.
- Synaptics Incorporated's Brief in Support of its Motion to Dismiss, Amkor 477 Technology, Inc. v. Synaptics Incorporated and Validity Sensors, LLC, District of Delaware, 1 :15-cv-0091 O-GMS, Dec. 18, 2015.
- Validity Sensors, LLC's Brief in Support of its Motion to Dismiss, Amkor Technology, 478 Inc. v. Synaptics Incorporated and Validity Sensors, LLC, District of Delaware, 1 :15-cv-00910-GMS, Dec. 18, 2015.
- Meyer, et al., “System Integration with eWLB”, IEEE Electronic System-Integration Technology Conference (ESTC 2010), Berlin, Sep. 3, 2010.
- Taiwan Intellectual Property Office, Notice of Examination Opinion in Taiwanese Patent Application No. 1 011 08816 (dated Sep. 25, 2015).
- Kim, et al. “Application of Through Mold Via (TMV) as PoP Base Package,” 2008 Electronic Components and Technology Conference IEEE (2008).
- Matsumoto et al., Impact of Artificial “Gummy” Fingers on Fingerprint Systems, SPIE 4677 (2002), reprinted from cryptome.org 442.
- Vermasan, et al., “A500 dpi AC Capacitive Hybrid Flip-Chip CMOS ASIC/Sensor Module for Fingerprint, Navigation, and Pointer Detection With On-Chip Data Processing”, IEEE Journal of Solid State Circuits, vol. 38, No. 12, Dec. 2003, pp. 2288-2294.
- Ratha, et al. “Adaptive Flow Orientation Based Feature Extraction in Fingerprint Images,” Pattern Recognition, vol. 28 No. 11, 1657-1672, Nov. 1995.
- Ratha, et al., “A Real Time Matching System for Large Fingerprint Databases,” IEEE, Aug. 1996.
- Suh, et al., “Design and Implementation of the AEGIS Single-Chip Secure Processoring Physical Random Functions”, Computer Architecture, 2005, ISCA '05, Proceedings, 32nd International Symposium, Jun. 2005 (MIT Technical Report CSAIL CSG-TR-843, 2004.
- Rivest, et al., “A Method for Obtaining Digital Signatures and Public-Key Cryptosystems”, Communication of the ACM, vol. 21 (2), pp. 120-126. (1978).
- Hiltgen, et al., “Secure Internet Banking Authentication”, IEEE Security and Privacy, IEEE Computer Society, New York, NY, , Mar. 1, 2006 (Mar. 1, 2006), pp. 24-31, XP007908655, ISSN: 1540-7993.
- Hegt, “Analysis of Current and Future Phishing Attacks on Internet Banking Services”, Mater Thesis. Techische Universiteit Eindhoven—Department of Mathematics and Computer Science May 31, 2008 (May 31, 2008), pp. 1-149, XP002630374, Retrieved from the Internet: URL:http://alexandria.tue.nl/extral/afstversl/wsk-ilhgt2008.pdf [retrieved on Mar. 29, 2011] *pp. 127-134, paragraph 6.2*.
- Gassend, et al., “Controlled Physical Random Functions”, In Proceedings of the 18th Annual Computer Security Conference, Las Vegas, Nevada, Dec. 12, 2002.
- Wikipedia (Mar. 2003). “Integrated Circuit,” http://en.wikipedia.org/wikilintegrated_circuit. Revision as of Mar. 23, 2003.
- Wikipedia (Dec. 2006). “Integrated circuit” Revision as of Dec. 10, 2006. http://en.widipedia.org/wikilIntegrated_circuit.
- bellagiodesigns.com (Internet Archive Wayback Machine, www.bellagiodesigns.com date: Oct. 29, 2005).
- Closed Loop Systems, The Free Dictionary, http://www.thefreedictionary.com/closed-loop+system (downloaded Dec. 1, 2011).
- Feedback: Electronic Engineering, Wikipedia, p. 5 http://en.wikipedia.org/wikilFeedback#Electronic engineering (downloaded Dec. 1, 2011).
- Galy et al. (Jul. 2007) “A full fingerprint verification system for a single-line sweep sensor.” IEEE Sensors J., vol. 7 No. 7, pp. 1054-1065.
- Maltoni, “Handbook of Fingerprint Recognition”, XP002355942 Springer, New York, A, Jun. 2003 (Jun. 2003) pp. 65-69.
Type: Grant
Filed: Sep 5, 2017
Date of Patent: Apr 28, 2020
Patent Publication Number: 20180090409
Assignee: Amkor Technology, Inc. (Tempe, AZ)
Inventors: Ronald Patrick Huemoeller (Gilbert, AZ), David Bolognia (Scottsdale, AZ), Robert Francis Darveaux (Gilbert, AZ), Brett Arnold Dunlap (Queen Creek, AZ)
Primary Examiner: Mohammad M Choudhry
Application Number: 15/695,478
International Classification: G01D 11/24 (20060101); H01L 23/31 (20060101); H01L 21/56 (20060101); G06K 9/00 (20060101); H01L 23/00 (20060101);