Abstract: Random, melt-processible copolyimides are disclosed herein. These copolyimides are semicrystalline and exhibit recoverable (semi)crystallinity from their melts. Associated processes, which entail either solution polymerization or melt polymerization, for producing and fabricating these copolyimides into useful articles having a predetermined shape are also disclosed.

Abstract: Random, melt-processible copolyimides are disclosed herein. These copolyimides are semicrystalline and exhibit recoverable (semi)crystallinity from their melts. Associated processes, which entail either solution polymerization or melt polymerization, for producing and fabricating these copolyimides into useful articles having a predetermined shape are also disclosed.

Abstract: Random, melt-processible copolyimides are disclosed herein. These copolyimides are semicrystalline and exhibit recoverable (semi)crystallinity from their melts. Associated processes, which entail either solution polymerization or melt polymerization, for producing and fabricating these copolyimides into useful articles having a predetermined shape are also disclosed.

Abstract: Random, melt-processible copolyimides are disclosed herein. These copolyimides are semicrystalline and exhibit recoverable (semi)crystallinity from their melts. Associated processes, which entail either solution polymerization or melt polymerization, for producing and fabricating these copolyimides into useful articles having a predetermined shape are also disclosed.

Abstract: Segmented, melt-processible, semicrystalline copolyimides are disclosed herein. These polymers are comprised of an amorphous or semicrystalline A segment (soft segment) and a semicrystalline B segment (hard segment), wherein the level of semicrystallinity in the A segment is less than that in the B segment. These copolyimides are semicrystalline and exhibit melting points in the range from about 330-395° C. In preferred embodiments, these copolyimides are end-capped and are crystallizable from their melts (i.e., they exhibit recoverable semicrystallinity). These copolyimides either inherently have suitably low melt visocosities to be melt-processible or can be made to have suitably low melt viscosities to be melt-processible by addition of certain additives. Tailoring of the melting points and glass transition temperatures of these copolyimides can be effected by changing their molecular architecture.

Abstract: A photosensitive resin composition comprising an aromatic polyimide precursor, wherein a 35 &mgr;m film made by imidating ring closure on a silicon substrate has a light transmittance at a wavelength of 365 nm of at least 1% and a residual stress of at most 25 MPa. The composition can be patterned through i-line exposure followed by development with alkaline solutions, and can be imidized into low-stress polyimide patterns. Electronic components having the polyimide patterns have high reliability.

Abstract: A photosensitive resin composition comprising an aromatic polyimide precursor, wherein a 10 &mgr;m thick layer of precursor has light transmittance at a wavelength of 365 nm of at least 1% and a 10 &mgr;m thick polyimide film made from the resin composition by imidation ring closure and deposited on a silicon substrate results in a residual stress of at most 25 MPa. The composition can be patterned through i-line exposure followed by development with alkaline solutions, and can be imidized into low-stress polyimide patterns. Electronic components having the polyimide patterns have high reliability.

Abstract: A poly(2,6-piperazinedione) liquid crystal alignment film providing high voltage holding ratio and high tilt angle when used in active matrix and super twisted nematic liquid crystal displays.

Abstract: Copolyimides from 1,4-bis(4-aminophenoxy)-2-phenylbenzene and m- or p-phenylene diamine with biphenyl dianhydride exhibit a high Tg and reduced melt viscosity.

Abstract: This invention concerns novel fluorine-containing diamines, polyamides and polyimides. The compounds are useful in the formation of moisture resistant films, fibers and shaped articles.

Abstract: This invention concerns novel fluorine-containing diamines, polyamides and polyimides. The compounds are useful in the formation of moisture resistant films, fibers and shaped articles.

Abstract: 1-[2,2-bis(trifluoromethyl)-3,3,4,4,5,5,5-heptafluoropentyl]-3,5-diaminoben zene and 1-[2,2-bis(trifluoromethyl)-3,3,4,4,5,5,5-heptafluoropentyl]-4-aminobenzen e, as well as fluorinated polymers, preferably polyimides. The perfuuoroalkyl group of these amines is connected to the benzene ring through a tertiary carbon atom followed by a methylene group. This renders the amines more reactive than other amines, where the perfluoroalkyl group is connected directly to the benzene ring. The absence of hydrogen from the group containing the tertiary carbon atom which is adjacent to the perfluorinated groups, prohibits dehydrofluorination.

Abstract: Polyimide compositions, films, and electronic devices using polyimides, based on 9,9-bis(perfluoroalkyl)xanthene-2,3,6,7-tetracarboxylic dianhydride or 9-aryl-9(perfluoroalkyl)xanthene-2,3,6,7-tetracarboxylic dianhydride and 3,3',4,4'-biphenyl tetracarboxylic dianhydride or 2,2-bis(3,4-carboxyphenyl)hexafluoropropane dianhydride and benzidine derivatives which offer a combination of desirable properties including, low linear coefficient of thermal expansion, low moisture absorption, high glass transition temperature, low dielectric constant, and improved tensile elongation.

Abstract: Soluble polymeric precursors having oligomeric imide and amic acid segments, which are suitable to form segmented, preferably insoluble, polyimide copolymers.

Abstract: Polyethers based on 9,9-bis-perfluoroalkyl-3,6-dihydroxy-xanthene or 9-aryl-9-perfluoroalkyl-3,6-dihydroxy-xanthene and another constituent selected from aryl, sulfone, aryl ketone, benzonitrile, and imide. These polyethers are useful as dielectric films in electronic devices.

Abstract: Rigid fluorine-containing compounds, monomers, and polymers based on pentacyclic core systems, such as 12H,14H-5, 7-dioxapentacene with perfluoroalkyl and/or aryl groups in the 12, 14 positions, and 5H,12H-7, 14-dioxapentacene, with perfluoroalkyl and/or aryl groups in the 5,12 positions. These monomers have utility in the preparation of advanced high-performance polymers, particularly polyimides. The rigid pentacyclic core decreases the coefficient of thermal expansion of the polymers, while the fluorinated substituents improve the dielectric constant and water absorption properties. Each monomer unit contains within its pentacyclic core two-O-bridges, and two --CRR.sub.f bridges (where R is aryl, substituted aryl or perfluoroalkyl, and R.sub.f is perfluoroalkyl).

Abstract: Liquid Crystal Display Devices having alignment layers of polyimides which are characterized by pendant perfluorinated chains, preferably linear, and having more than 6 perfluorinated carbon atoms. These alignment layers are capable to provide the Liquid Crystal Display Devices with stable tilt angles of 5 or more degrees.

Abstract: Polyimide compositions, films, and electronic devices using polyimides, based on 9-aryl-9(perfluoroalkyl)-xanthene-2,3,6,7-dianhydride and one or more diamines from a selected group, which offers to the polyimides a combination of desirable properties including solubility, pseudo rod-like structure, low linear coefficient of thermal expansion, high glass transition temperature, low dielectric constant, and high modulus.

Abstract: Perfluoroalkylated diaminoesitylene and polymers, preferably polyimides, made therefrom. The necessarily obtainable meta-substitution position of the perfluoroalkyl group with respect to both amino-groups provides an improved diamine and compositions of matter resulting therefrom.

Abstract: Formation of polyimide film with a preselected coefficient of thermal expansion is disclosed employing relationships between cure temperature and heating rates.