Patents by Inventor Brian C. Auman
Brian C. Auman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20120227790Abstract: The assemblies of the present disclosure comprise an electrode, and a polyimide film. The polyimide film comprises a sub-micron filler and a polyimide. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.Type: ApplicationFiled: November 19, 2010Publication date: September 13, 2012Applicant: E. I DU PONT DE NEMOURS AND COMPANYInventors: Brian C. Auman, Meredith L. Dunbar, Tao He, Kostantinos Kourtakis
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Publication number: 20120228616Abstract: The present disclosure is directed to a thin film transistor composition. The thin film transistor composition has a semiconductor material and a substrate. The substrate is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.Type: ApplicationFiled: November 19, 2010Publication date: September 13, 2012Applicant: E.I. DU PONT DE NEMOURS AND COMPANYInventors: Brian C. Auman, Meredith L. Dunbar, Tao He, Kostantinos Kourtakis
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Publication number: 20120231264Abstract: The present disclosure is directed to a wire wrap composition having a polyimide layer and a bonding layer. The polyimide layer is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.Type: ApplicationFiled: November 19, 2010Publication date: September 13, 2012Applicant: E. I. Du Pont De Nemours And CompanyInventors: Brian C. Auman, Meredith L. Dunbar, Tao He, Kostantinos Kourtakis
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Publication number: 20120231263Abstract: The present disclosure is directed to a coverlay comprising a polyimide film and an adhesive layer. The polyimide film is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.Type: ApplicationFiled: November 19, 2010Publication date: September 13, 2012Applicant: E.I. DU PONT DE NEMOURS AND COMPANYInventors: Brian C. Auman, Meredith L. Dunbar, Tao He, Kostantinos Kourtakis
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Publication number: 20120009406Abstract: The films of the present disclosure have a thickness from about 8 to about 150 microns and contain from about 40 to about 95 weight percent of a polyimide derived from: i. at least one aromatic dianhydride, at least about 85 mole percent of such aromatic dianhydride being a rigid rod type monomer, and ii. at least one aromatic diamine, at least about 85 mole percent of such aromatic diamine being a rigid rod type monomer. The films of the present disclosure further comprise a filler that: i. is less than about 800 nanometers in at least one dimension; ii. has an aspect ratio greater than about 3:1; iii. is less than the thickness of the film in all dimensions; and iv. is present in an amount from about 5 to about 60 weight percent of the total weight of the film.Type: ApplicationFiled: May 11, 2009Publication date: January 12, 2012Applicant: E.I. DU PONT DE NEMOURS AND COMPANYInventors: Brian C. Auman, Salah Boussaad, Thomas Edward Carney, Kostantinos Kourtakis, John W. Simmons
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Publication number: 20110220179Abstract: The assemblies of the present disclosure comprise an electrode, and a polyimide film. The polyimide film contains from about 40 to about 95 weight percent of a polyimide derived from at least one aromatic dianhydride component, and at least one aromatic diamine component. The aromatic dianhydride and aromatic diamine component are selected from the group consisting of rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of A:B is 20-80:80-20. A is the mole percent of rigid rod dianhydride and rigid rod diamine, and B is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The polyimide films of the present disclosure further comprise a filler that is less than about 100 nanometers in all dimensions and is present in an amount from about 5 to about 60 weight percent of the total weight of the polyimide film.Type: ApplicationFiled: September 16, 2010Publication date: September 15, 2011Applicant: E. I. DU PONT DE NEMOURS AND COMPANYInventors: Kostantinos KOURTAKIS, Brian C. AUMAN
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Publication number: 20110220178Abstract: The assemblies of the present invention comprise an electrode, an light absorber layer and a polyimide film. The polyimide film contains from about 40 to about 95 weight percent of a polyimide derived from: i. at least one aromatic dianhydride, at least about 85 mole percent of such aromatic dianhydride being a rigid rod type dianhydride, and ii. at least one aromatic diamine, at least about 85 mole percent of such aromatic diamine being a rigid rod type diamine. The polyimide films of the present disclosure further comprise a filler that: i. is less than about 100 nanometers in all dimensions; and ii. is present in an amount from about 5 to about 60 weight percent of the total weight of the polyimide film.Type: ApplicationFiled: September 16, 2010Publication date: September 15, 2011Applicant: E. I. DU PONT DE NEMOURS AND COMPANYInventors: Kostantinos KOURTAKIS, Brian C. AUMAN, Salah BOUSSAAD
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Publication number: 20110121296Abstract: A process for forming at least one transistor on a substrate is described. The substrate comprises a polyimide and a nanoscopic filler. The polyimide is derived substantially or wholly from rigid rod monomers and the nanoscopic filler has an aspect ratio of at least 3:1. The substrates of the present disclosure are particularly well suited for thin film transistor applications, due at least in part to high resistance to hygroscopic expansion and relatively high levels of thermal and dimensional stability.Type: ApplicationFiled: November 20, 2009Publication date: May 26, 2011Applicant: E. I. DU PONT DE NEMOURS AND COMPANYInventors: Brian C. Auman, Thomas Edward Carney
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Publication number: 20110120545Abstract: A process for forming at least one photovoltaic component on a substrate is described. The substrate comprises a polyimide and a sub-micron filler. The polyimide is derived substantially or wholly from rigid rod monomers and the sub-micron filler has an aspect ratio of at least 3:1. The substrates of the present disclosure are particularly well suited for photovoltaic applications, due at least in part to high resistance to hygroscopic expansion and relatively high levels of thermal and dimensional stability.Type: ApplicationFiled: November 20, 2009Publication date: May 26, 2011Applicant: E. I. DU PONT DE NEMOURS AND COMPANYInventors: BRIAN C. AUMAN, Thomas Edward Carney, Kostantinos Kourtakis, Salah Boussaad
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Publication number: 20110124806Abstract: A film is disclosed, containing 40-100 weight percent polyimide. The polyimide is derived from a dianhydride component and a diamine component. The dianhydride component is at least 3,3?,4,4?-biphenyl tetracarboxylic dianhydride (BPDA), and optionally is also pyromellitic dianhydride (PMDA) in a mole ratio of 50-100:50-0 (BPDA:PMDA). The diamine component comprises 1,5-naphthalenediamine (1,5-ND) and 1,4-diaminobenzene (PPD) and/or meta phenylene diamine (MPD) in a mole ratio of 15-95:85-5 (1,5-ND:PPD+MPD). The films have exceptional high temperature storage modulus (elastic modulus) and exceptionally low high temperature creep (eplast).Type: ApplicationFiled: November 20, 2009Publication date: May 26, 2011Applicant: E.I. DU PONT DE NEMOURS AND COMPANYInventors: John W. Simmons, Brian C. Auman, Kostantinos Kourtakis, Salah Boussaad
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Publication number: 20110123796Abstract: An interposer film for IC packaging is disclosed. The interposer film comprises a substrate that supports a plurality of electrically conductive domains. The substrate contains a rigid rod type polyimide and about 5-60 wt % filler. The filler has at least one dimension that (on average) is less than about 800 nanometers, and the filler also has an average aspect ratio greater than about 3:1.Type: ApplicationFiled: November 20, 2009Publication date: May 26, 2011Applicant: E.I. DUPONT DE NEMOURS AND COMPANYInventors: BRIAN C. AUMAN, Thomas Edward Carney, Kostantinos Kourtakis, Salah Boussaad
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Publication number: 20110056539Abstract: The assemblies of the present invention comprise an electrode, an absorber layer and a polyimide film. The polyimide film contains from about 40 to about 95 weight percent of a polyimide derived from: i. at least one aromatic dianhydride, at least about 85 mole percent of such aromatic dianhydride being a rigid rod type dianhydride, and ii. at least one aromatic diamine, at least about 85 mole percent of such aromatic diamine being a rigid rod type diamine. The polyimide films of the present disclosure further comprise a filler that: i. is less than about 800 nanometers in at least one dimension; ii. has an aspect ratio greater than about 3:1 ; iii. is less than the thickness of the polyimide film in all dimensions; and iv. is present in an amount from about 5 to about 60 weight percent of the total weight of the polyimide film.Type: ApplicationFiled: May 18, 2009Publication date: March 10, 2011Applicant: E.I. DU PONT DE NEMOURS AND COMPANYInventors: Brian C Auman, Salah Boussaad, Thomas Edward Carney, Kostantinos Kourtakis, John W. Simmons
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Publication number: 20100323161Abstract: The present invention is related to a polyimide copper clad laminate and the process of making the same. The laminate comprises a layer of polyimide and a layer of copper foil, wherein the polyimide layer is made from a polyimide precursor comprising a diamine monomer, a dianhydride monomer, an organic solvent and a silane coupling agent having one or more organic functional groups, and the copper foil is a smooth copper foil. The polyimide layer of the present invention provides high transparency, good dimensional stability, good mechanical properties and good adhesion to the copper foil.Type: ApplicationFiled: January 30, 2009Publication date: December 23, 2010Applicant: E. I. Du Pont De Nemours and CompanyInventors: Yu-Jean Chen, Brian C. Auman, Sheng-Yu Huang, Tsutomu Mutoh, Ming-Te We, Yu-Chih Yeh
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Patent number: 7745516Abstract: Water absorption resistant polyimide/epoxy-based compositions, like pastes (or solutions), are particularly useful to make electronic screen-printable materials and electronic components. A group of hydrophobic epoxies (and soluble polyimides) was discovered to be particularly resistant to moisture absorption. The polyimide/epoxy pastes made with these epoxies (and these polyimides) may optionally contain thermal crosslinking agents, adhesion promoting agents, blocked isocyanates, and other inorganic fillers. The polyimide/epoxy pastes of the present invention can have a glass transition temperature greater than 250° C., a water absorption factor of less than 2%, and a positive solubility measurement.Type: GrantFiled: October 12, 2005Date of Patent: June 29, 2010Assignee: E. I. du Pont de Nemours and CompanyInventors: Thomas Eugene Dueber, John D. Summers, Brian C. Auman, Munirpallam Appadorai Subramanian, Nyrissa S. Rogado
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Publication number: 20100108140Abstract: The present disclosure relates to a device for thermally cooling while electrically insulating. The device contains a first adhesive layer, substrate, a second adhesive layer and a heat sink. The first adhesive layer and the second adhesive layer are a vinyl or acrylic based polymer. The adhesive layers and the substrate may contain thermally conductive fillers, light absorbing pigments or mixtures of both.Type: ApplicationFiled: October 30, 2009Publication date: May 6, 2010Applicant: E. I. DU PONT DE NEMOURS AND COMPANYInventors: Brian C. Auman, Carl Haeger, Philip Roland Lacourt, Mark Elliott McAlees, Stanley Duane Merritt, George Wyatt Prejean, Harland Lee Tate
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Patent number: 7691471Abstract: The present invention is directed to the use polycyclic diamines. These diamines, when polymerized with dianhydrides, and optionally other non-polycyclic diamines are used to form new polyamic acids. The polyamic acids can be imidized to form a new class of useful polyimide resins and polyimide films, particularly in electronics type applications.Type: GrantFiled: June 26, 2009Date of Patent: April 6, 2010Assignee: E. I. du Pont de Nemours and CompanyInventors: Jiang Ding, Christian Peter Lenges, Christopher Dennis Simone, Brian C. Auman
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Publication number: 20090297858Abstract: The present disclosure relates to a multilayer insulation structure having superior abrasion resistance. The multilayer insulation structure has a first polyimide outer layer, a polyimide core layer and an optional second polyimide outer layer. The first and second polyimide outer layers contain a fluoropolymer micropowder. The first and second polyimide outer layers have a combined weight of from 10 to 80 weight % of the total weight of the multilayer insulation structure. The abrasion resistance of the multilayer insulation structure is from 1500 to 18300 scrape cycles. The multilayer insulation structure is useful as wire or cable insulation wrap.Type: ApplicationFiled: May 29, 2008Publication date: December 3, 2009Applicant: E. I. DU PONT DE NEMOURS AND COMPANYInventors: DANNY E. GLENN, BRIAN C. AUMAN, KUPPUSAMY KANAKARAJAN, PHILIP ROLAND LACOURT
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Publication number: 20090288699Abstract: Laminate structures are disclosed, comprising a metal foil supporting a polyimide dielectric layer. The polyimide dielectric layer comprises a polyimide derived from at least one aromatic rigid rod diamine and at least one aromatic rigid rod dianhydride to provide a thermally and dimensionally stable polyimide. A bottom electrode is formed directly on the polyimide dielectric layer surface, and a CIGS absorber layer is formed directly on the bottom electrode. The CIGS laminates of the present disclosure can be incorporated into CIGS type solar cells, and the laminates further allow such CIGS solar cells to be monolithically integrated into a photovoltaic module on a single substrate.Type: ApplicationFiled: May 14, 2009Publication date: November 26, 2009Applicant: E.I. DU PONT DE NEMOURS AND COMPANYInventors: Brian C. Auman, Salah Boussaad, Thomas Edward Carney, Kuppusamy Kanakarajan, Kostantinos Kourtakis, John W. Simmons
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Publication number: 20090263640Abstract: The present invention is directed to the use polycyclic diamines. These diamines, when polymerized with dianhydrides, and optionally other non-polycyclic diamines are used to form new polyamic acids. The polyamic acids can be imidized to form a new class of useful polyimide resins and polyimide films, particularly in electronics type applications.Type: ApplicationFiled: June 26, 2009Publication date: October 22, 2009Applicant: E.I. DU PONT DE NEMOURS AND COMPANYInventors: JIANG DING, CHRISTIAN PETER LENGES, CHRISTOPHER DENNIS SIMONE, BRIAN C. AUMAN
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Publication number: 20090229809Abstract: The present disclosure relates to a device for thermally cooling while electrically insulating. The device contains a first adhesive layer, polyimide substrate, a second adhesive layer and a heat sink. The first adhesive layer and the second adhesive layer are a vinyl or acrylic polymer. The polyimide substrate has at least two polyimide layers. The polyimide layers are derived from at least one aromatic dianhydride and at least one aromatic diamine. The adhesive layers and the polyimide layers may contain thermally conductive fillers, light absorbing pigments or mixtures of both.Type: ApplicationFiled: February 12, 2009Publication date: September 17, 2009Applicant: E. I. DU PONT DE NEMOURS AND COMPANYInventors: Brian C. AUMAN, Carl HAEGER, Philip Roland LACOURT, Mark Elliott MCALEES, Stanley Duane MERRITT, George Wyatt PREJEAN, Harland Lee TATE