Abstract: A process for abrasive machining of wafer-like workpieces, especially semiconductor wafers. The process uses carrier disks in which the outer periphery on which the driving forces mesh, is made of a material having a tensile strength of at least 100 N/mm2, while in the area that comes into contact with the workpieces to be machined, there is provided a plastic material, preferably having an elasticity modulus of from 1.0 to 8×104 N/mm2. The plastic material is preferably secured to the carrier disk by a layer of adhesive positioned parallel to a surface of the carrier disk. In particular, the plastic material is laminated into the carrier disk.

Abstract: An abrasive article is provided which comprises a backing and at least one three-dimensional abrasive coating bonded to a surface of the backing. The abrasive coating comprises a binder formed from a cured binder precursor having dispersed therein a plurality of diamond bead abrasive particles and a filler which comprises from about 40 to about 60 percent weight of the abrasive coating. The abrasive article is particularly suitable for abrading a glass or a glass ceramic workpiece in the presence of a lubricant.

Abstract: The present invention is a fixed abrasive article for grinding or polishing the surface of a glass workpiece. The abrasive article for grinding glass has abrasive composites containing a binder, an alkaline metal salt, and diamond abrasive particles or agglomerate particles comprising diamond particles, the composites integrally molded to a backing. The abrasive article for grinding glass is capable of removing between about 200 and 400 micrometers of glass using an RPP procedure having a polish time interval of between 10 and 15 seconds, generally about 12 seconds. The abrasive article for polishing glass comprises a backing containing fibers, and a plurality of abrasive composites integrally molded to the backing comprising an organic resin, ceria abrasive particles, and alkaline metal salt. The abrasive articles for polishing glass also provide an optimum rate of breakdown of the abrasive composites and improved adhesion between the abrasive composites and the backing.

Abstract: An abrasive article is provided which comprises a backing and at least one three-dimensional abrasive coating bonded to a surface of the backing. The abrasive coating comprises a binder formed from a cured binder precursor having dispersed therein a plurality of diamond bead abrasive particles and a filler which comprises from about 40 to about 60 percent weight of the abrasive coating. The abrasive article is particularly suitable for abrading a glass or a glass ceramic workpiece in the presence of a lubricant.

Abstract: An abrasive article includes a plurality of abrasive particles securely affixed to a substrate with a corrosion resistant matrix material. The matrix material includes a sintered corrosion resistant powder and a brazing alloy. The brazing alloy includes an element which reacts with and forms a chemical bond with the abrasive particles, thereby securely holding the abrasive particles in place. A method of forming the abrasive article includes arranging the abrasive particles in the matrix material, and applying sufficient heat and pressure to the mixture of abrasive particles and matrix material to cause the corrosion resistant powder to sinter, the brazing alloy to flow around, react with, and form chemical bonds with the abrasive particles, and allow the brazing alloy to flow through the interstices of the sintered corrosion resistant powder and form an inter-metallic compound therewith.

Abstract: A support shoe for supporting an abrasive tape having an abrasive face and an opposed back face, wherein the support shoe comprises a pressure face including a frictional engagement material for frictionally engaging the back face of the abrasive tape. The frictional engagement material comprises a plurality of cells and a first frictional engagement surface comprising a plurality of particles distributed and arranged within the plurality of cells, wherein at least some of the plurality of particles are fixed within and extend from the plurality of cells, so that when the back face of the abrasive tape contacts the first frictional engagement surface, the plurality of particles attenuate relative movement between the abrasive tape and the pressure face in response to shear forces induced during abrading. The pressure face may be curvilinear, arcuate, convex, or concave. The frictional engagement material may be attached to the pressure face by brazing, sintering, adhering, or soldering.