Patents by Inventor Brian D. Sawyer
Brian D. Sawyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9661739Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: GrantFiled: January 13, 2015Date of Patent: May 23, 2017Assignee: Qorvo US, Inc.Inventors: Donald Joseph Leahy, Brian D. Sawyer, Stephen Parker, Thomas Scott Morris
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Patent number: 9137934Abstract: Embodiments include devices and methods for manufacturing a module having a first shielded compartment and a second shielded compartment, wherein the first shielded compartment is electrically isolated from the second shielded compartment. Electrical conductivity is controlled in a manner in which current flow between shielded circuits is directed to reduce or eliminate energy from being coupled between one or more shielded compartments on the same module. Each module may have a plurality of individual shielded compartments, where each compartment has a dedicated ground plane. The shields for each compartment may be tied to the dedicated ground plane of the compartment. Because the dedicated ground planes are not tied together, each of the shielded compartments on the modules remains isolated from all the other shielded compartments on the modules. In some embodiments having a plurality of shielded compartments, there is at least one isolated shielded compartment depending upon the design needs of the module.Type: GrantFiled: July 25, 2011Date of Patent: September 15, 2015Assignee: RF Micro Devices, Inc.Inventors: Thomas Scott Morris, Ulrik Riis Madsen, Brian D. Sawyer, Milind Shah, John Robert Siomkos, Mark Alan Crandall, Dan Carey
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Publication number: 20150124421Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: ApplicationFiled: January 13, 2015Publication date: May 7, 2015Inventors: Donald Joseph Leahy, Brian D. Sawyer, Stephen Parker, Thomas Scott Morris
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Patent number: 8959762Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: GrantFiled: February 25, 2011Date of Patent: February 24, 2015Assignee: RF Micro Devices, Inc.Inventors: Donald Joseph Leahy, Brian D. Sawyer, Stephen Parker, Thomas Scott Morris
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Patent number: 8415567Abstract: The present invention relates to a multi-layer laminate or substrate manufacturing process for forming soldering surfaces on a substrate of a module without requiring a solder mask. In one embodiment, a substrate is provided having a substrate body, soldering pads, and a metal segment. A patterned mask is formed over the substrate such that soldering surfaces of the soldering pads remain exposed. The soldering surfaces of the soldering pads are plated to create plated soldering surfaces over the soldering pads. The plated soldering surfaces are the regions for solder placement. The patterned mask is then removed from the substrate. Next, an anti-wetting treatment is applied to the substrate such that any unplated metal surfaces react to the anti-wetting treatment to form treated surfaces. As such, the plated soldering surfaces will wet solder while the treated surface will not wet solder. In a preferred embodiment, the anti-wetting treatment is an oxidation process.Type: GrantFiled: February 4, 2010Date of Patent: April 9, 2013Assignee: RF Micro Devices, Inc.Inventors: Brian D. Sawyer, Thomas Scott Morris, Milind Shah
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Patent number: 8296941Abstract: A meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: GrantFiled: May 27, 2011Date of Patent: October 30, 2012Assignee: RF Micro Devices, Inc.Inventors: David J. Hiner, Waite R. Warren, Jr., Donald Joseph Leahy, David Jandzinski, Thomas Scott Morris, David Halchin, Milind Shah, Mark Charles Held, Brian Howard Calhoun, Brian D. Sawyer, Ulrik Riis Madsen
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Publication number: 20120217048Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: ApplicationFiled: February 25, 2011Publication date: August 30, 2012Applicant: RF MICRO DEVICES, INC.Inventors: Donald Joseph Leahy, Brian D. Sawyer, Stephen Parker, Thomas Scott Morris
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Publication number: 20120044653Abstract: Embodiments include devices and methods for manufacturing a module having a first shielded compartment and a second shielded compartment, wherein the first shielded compartment is electrically isolated from the second shielded compartment. Electrical conductivity is controlled in a manner in which current flow between shielded circuits is directed to reduce or eliminate energy from being coupled between one or more shielded compartments on the same module. Each module may have a plurality of individual shielded compartments, where each compartment has a dedicated ground plane. The shields for each compartment may be tied to the dedicated ground plane of the compartment. Because the dedicated ground planes are not tied together, each of the shielded compartments on the modules remains isolated from all the other shielded compartments on the modules. In some embodiments having a plurality of shielded compartments, there is at least one isolated shielded compartment depending upon the design needs of the module.Type: ApplicationFiled: July 25, 2011Publication date: February 23, 2012Applicant: RF MICRO DEVICES, INC.Inventors: Thomas Scott Morris, Ulrik Riis Madsen, Brian D. Sawyer, Milind Shah, John Robert Siomkos, Mark Alan Crandall, Dan Carey
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Publication number: 20120007742Abstract: A consumer electronics device can be thermally managed using forced convection. In one embodiment, the present invention includes such a consumer electronics device having a heat sink thermally coupled to a heat source. The device also includes a power supply configured to power an ion wind fan, and an ion wind fan electrically coupled to the power supply. In one embodiment, the electric coupling is temporary using a non-permanent electrical connector, and electrical contact occurs when the ion wind fan is removably retained by a retention mechanism.Type: ApplicationFiled: January 26, 2011Publication date: January 12, 2012Applicant: Ventiva, Inc.Inventors: Scott L. GOOCH, Brian D. Sawyer, Wei-Min Jeff Wang
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Publication number: 20120008249Abstract: An ion wind fan can be manufactured efficiently using insert molding. In one embodiment, the present invention includes an ion wind fan having an isolator with an emitter bus plate and an emitter attachment plate insert molded into isolator. A collector electrode is further insert molded into the isolator. The collector electrode is supported in part by two collector supports. One or more wire emitter electrodes are welded to the emitter bus plate at a first end of the emitter wires and to the emitter attachment plate at a second end of the emitter wires.Type: ApplicationFiled: June 28, 2011Publication date: January 12, 2012Applicant: Ventiva, Inc.Inventors: Brian D. SAWYER, Christopher Hizer
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Publication number: 20120008248Abstract: An ion wind fan can be made more resistant to electrical arcing by designing a supporting dielectric further from an emitter electrode. In one embodiment, such an ion wind fan according to one embodiment of the present invention has an emitter electrode and a collector electrode, and an isolator comprising a dielectric to provide electrical isolation for one or both of the emitter electrode and the collector electrode. In one embodiment, the isolator has a tapered sidewall so that the sidewall becomes thinner in the upstream direction over at least a portion of the sidewall. In one embodiment, the taper is a linear taper.Type: ApplicationFiled: May 24, 2011Publication date: January 12, 2012Applicant: Ventiva, Inc.Inventors: Brian D. Sawyer, Christopher Hizer
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Patent number: 8072062Abstract: A circuit device is placed within an opening of a conductive layer which is then partially encapsulated with an encapsulant so that the active surface of the circuit device is coplanar with the conductive layer. At least a portion of the conductive layer may be used as a reference voltage plane (e.g. a ground plane). Additionally, a circuit device may be placed on a conductive layer such that an active surface of circuit device is between conductive layer and an opposite surface of circuit device. The conductive layer has at least one opening to expose the active surface of circuit device. The encapsulant may be electrically conductive or electrically non-conductive.Type: GrantFiled: February 28, 2008Date of Patent: December 6, 2011Assignee: Freescale Semiconductor, Inc.Inventors: George R. Leal, Jie-Hua Zhao, Edward R. Prack, Robert J. Wenzel, Brian D. Sawyer, David G. Wontor, Marc Alan Mangrum
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Publication number: 20110261499Abstract: An ion wind fan can have a collector electrode that mitigates the risk of sparking. In one embodiment, an ion wind can include a wire emitter electrode held in tension in a first direction, and a collector electrode having an elongated opening having an upstream edge and a downstream edge, the elongated opening being elongated in the first direction and positioned downstream of the wire emitter electrode so that the wire emitter electrode is substantially centered along the length of the elongated opening. The downstream edge of the elongated opening includes a chamfered portion.Type: ApplicationFiled: April 26, 2010Publication date: October 27, 2011Applicant: Ventiva, Inc.Inventors: Christopher HIZER, Brian D. Sawyer
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Publication number: 20110225803Abstract: A meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: ApplicationFiled: May 27, 2011Publication date: September 22, 2011Applicant: RF MICRO DEVICES, INC.Inventors: David J. Hiner, Waite R. Warren, JR., Donald Joseph Leahy, David Jandzinski, Thomas Scott Morris, David Halchin, Milind Shah, Mark Charles Held, Brian Howard Calhoun, Brian D. Sawyer, Ulrik Riis Madsen
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Publication number: 20110198978Abstract: A solid-state light bulb using an ion wind fan and a heat sink for thermal management can electrically isolate the heat sink to make it touch-safe. In one embodiment, the present invention includes a bulb housing, at least a portion of which is made of a dielectric material and a lens made of a dielectric material, wherein the lens and the bulb together define the inside and outside of the bulb. A heat sink and an ion wind fan providing forced convection for the heat sink thermally manage the solid-state light devices in the bulb. In one embodiment, the outside of the bulb is electrically isolated from the heat sink located inside of the bulb by at least the portion of the bulb housing that is made of the dielectric material.Type: ApplicationFiled: October 12, 2010Publication date: August 18, 2011Applicant: Ventiva, Inc.Inventors: Brian D. SAWYER, SCOTT L. GOOCH
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Patent number: 7999197Abstract: A method for making a dual sided electronic module. A substrate has a first surface that is substantially parallel to a second surface. The second surface forms a cavity extending into an interior portion of the substrate. The substrate has at least one through hole connecting the cavity to the first surface. A first component is mounted with respect to the first surface, and a second component is mounted at least partially within the cavity. An encapsulant is applied to the first surface and through the at least one through hole into the cavity about the second component.Type: GrantFiled: April 20, 2009Date of Patent: August 16, 2011Assignee: RF Micro Devices, Inc.Inventors: Brian D. Sawyer, Milind Shah, Thomas Scott Morris, Carl Hinshaw
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Publication number: 20110192284Abstract: The tendency of an ion wind fan to spark can be reduced by locating the emitter support portions of an isolator away from the active portions of the emitter and collector electrodes. In one embodiment, the present invention includes an ion wind fan having a first end, and a second end. The ion wind fan, in one embodiment, has a collector electrode, an emitter electrode, and an isolator supporting the collector electrode and the emitter electrode, the emitter electrode being supported by the isolator at an emitter support having an internal edge, where the distance from the internal edge of the emitter support end of the ion wind fan is less than the distance from the edge of the collector electrode end of the ion wind fan.Type: ApplicationFiled: February 9, 2010Publication date: August 11, 2011Applicant: VENTIVA, INC.Inventors: Brian D. Sawyer, Scott L. Gooch
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Publication number: 20100199492Abstract: A meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: ApplicationFiled: April 23, 2010Publication date: August 12, 2010Applicant: RF MICRO DEVICES, INC.Inventors: David J. Hiner, Waite R. Warren, JR., Donald Joseph Leahy, David Jandzinski, Thomas Scott Morris, David Halchin, Milind Shah, Mark Charles Held, Brian Howard Calhoun, Brian D. Sawyer, Ulrik Riis Madsen
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Publication number: 20090000815Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: ApplicationFiled: December 7, 2007Publication date: January 1, 2009Applicant: RF MICRO DEVICES, INC.Inventors: David J. Hiner, Waite R. Warren, JR., Donald Joseph Leahy, David Jandzinski, Thomas Scott Morris, David Halchin, Milind Shah, Mark Charles Held, Brian Howard Calhoun, Brian D. Sawyer, Ulrik Riis Madsen
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Publication number: 20080142960Abstract: A circuit device is placed within an opening of a conductive layer which is then partially encapsulated with an encapsulant so that the active surface of the circuit device is coplanar with the conductive layer. At least a portion of the conductive layer may be used as a reference voltage plane (e.g. a ground plane). Additionally, a circuit device may be placed on a conductive layer such that an active surface of circuit device is between conductive layer and an opposite surface of circuit device. The conductive layer has at least one opening to expose the active surface of circuit device. The encapsulant may be electrically conductive or electrically non-conductive.Type: ApplicationFiled: February 28, 2008Publication date: June 19, 2008Applicant: Freescale Semiconductor, Inc.Inventors: George R. Leal, Jie-Hua Zhao, Edward R. Prack, Robert J. Wenzel, Brian D. Sawyer, David G. Wontor, Marc Alan Mangrum