Patents by Inventor Brian G. Morin

Brian G. Morin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140134496
    Abstract: An insulating (nonconductive) microporous polymeric battery separator comprised of a single layer of enmeshed microfibers and nanofibers is provided. Such a separator accords the ability to attune the porosity and pore size to any desired level through a single nonwoven fabric. Through a proper selection of materials as well as production processes, the resultant battery separator exhibits isotropic strengths, low shrinkage, high wettability levels, and pore sizes related directly to layer thickness. The overall production method is highly efficient and yields a combination of polymeric nanofibers within a polymeric microfiber matrix and/or onto such a substrate through high shear processing that is cost effective as well. The separator, a battery including such a separator, the method of manufacturing such a separator, and the method of utilizing such a separator within a battery device, are all encompassed within this invention.
    Type: Application
    Filed: November 14, 2012
    Publication date: May 15, 2014
    Inventor: Brian G. Morin
  • Publication number: 20130302608
    Abstract: A new class of high modulus polypropylene multifilament fiber and/or yarn is provided. Such a multifilament fiber and/or yarn exhibits an exceptional combination of high strength and toughness with low weight and density. The inventive fibers thus permit replacement of expensive polymeric fibers within certain applications with lower cost alternatives, or replacement of high density components with such low density fibers, without sacrificing strength or durability. Such multifilament fibers are produced through melt-spinning processes and exhibit highly unique microstructures therein, including significant void volumes, interspersed and crossed voids, and nanofilament bridges within such voids. Such microstructural characteristics appear to impart the exceptional properties noted above.
    Type: Application
    Filed: July 22, 2013
    Publication date: November 14, 2013
    Applicant: John K. Fort, Chapter 7 Trustee of NMFC, LLC, f/k/a Innegrity, LLC
    Inventor: Brian G. Morin
  • Publication number: 20130078525
    Abstract: The present invention relates to a microporous polymeric battery separator comprised of a single layer of enmeshed microfibers and nanofibers. Such a separator accords the ability to attune the porosity and pore size to any desired level through a single nonwoven fabric. As a result, the inventive separator permits a high strength material with low porosity and low pore size to levels unattained. The combination of polymeric nanofibers within a polymeric microfiber matrix and/or onto such a substrate through high shear processing provides such benefits, as well. The separator, a battery including such a separator, the method of manufacturing such a separator, and the method of utilizing such a separator within a battery device, are all encompassed within this invention.
    Type: Application
    Filed: November 20, 2012
    Publication date: March 28, 2013
    Inventors: Brian G. Morin, James L. Schaeffer
  • Publication number: 20120295165
    Abstract: The present invention relates to a microporous polymeric battery separator comprised of a single layer of enmeshed microfibers and nanofibers. Such a separator accords the ability to attune the porosity and pore size to any desired level through a single nonwoven fabric. As a result, the inventive separator permits a high strength material with low porosity and low pore size to levels unattained. The combination of polymeric nanofibers within a polymeric microfiber matrix and/or onto such a substrate through high shear processing provides such benefits, as well. The separator, a battery including such a separator, the method of manufacturing such a separator, and the method of utilizing such a separator within a battery device, are all encompassed within this invention.
    Type: Application
    Filed: May 20, 2011
    Publication date: November 22, 2012
    Inventors: Brian G. Morin, James L. Schaeffer
  • Patent number: 8168292
    Abstract: Disclosed are composites that can exhibit low transmission energy loss and can also be temperature resistant. The composites include reinforcement fibers held in a polymeric matrix. The reinforcement fibers can include an amorphous polymer component. The fibers can be woven or knit to form a fabric or can be included in a nonwoven fabric. The composites can include other fibers as well, such as fiberglass. The composites can be multi-layer structures and can include layers of other materials, for instance layers formed of polyaramids, fiberglass, or carbon fiber wovens or nonwovens. The composites can advantageously be utilized in low loss dielectric applications, such as in forming circuit board substrates.
    Type: Grant
    Filed: June 15, 2006
    Date of Patent: May 1, 2012
    Assignee: Innegra Technologies, LLC
    Inventor: Brian G. Morin
  • Patent number: 8057887
    Abstract: Disclosed are composite laminates that can exhibit high strength and/or low dielectric loss and can also be lightweight. The laminates include layers formed of high modulus polyolefin fiber. The fibers can be woven or knit to form a fabric or can be included in a nonwoven fabric that can be one or more layers of the composite structures. The layers including the high modulus polyolefin fibers can include other fibers, such as fiberglass. The composites can also include layers of other materials, for instance layers formed of polyaramids, fiberglass, or carbon fiber wovens or nonwovens. The composites can advantageously be utilized in low loss dielectric applications, such as in forming circuit board substrates, or in applications beneficially combining strength with low weight, such as automobile and boat materials.
    Type: Grant
    Filed: August 17, 2005
    Date of Patent: November 15, 2011
    Assignee: Rampart Fibers, LLC
    Inventor: Brian G. Morin
  • Patent number: 7892633
    Abstract: Disclosed are composite laminates that can exhibit high strength and/or low dielectric loss and can also be lightweight. The laminates include layers formed of high modulus polyolefin fiber. The fibers can be woven or knit to form a fabric or can be included in a nonwoven fabric that can be one or more layers of the composite structures. The layers including the high modulus polyolefin fibers can include other fibers, such as fiberglass. The composites can also include layers of other materials, for instance layers formed of polyaramids, fiberglass, or carbon fiber wovens or nonwovens. The composites can advantageously be utilized in low loss dielectric applications, such as in forming circuit board substrates, or in applications beneficially combining strength with low weight, such as automobile and boat materials.
    Type: Grant
    Filed: August 17, 2005
    Date of Patent: February 22, 2011
    Assignee: Innegrity, LLC
    Inventor: Brian G. Morin
  • Publication number: 20100173156
    Abstract: A new class of high modulus polypropylene multifilament fiber and/or yarn is provided. Such a multifilament fiber and/or yarn exhibits an exceptional combination of high strength and toughness with low weight and density. The inventive fibers thus permit replacement of expensive polymeric fibers within certain applications with lower cost alternatives, or replacement of high density components with such low density fibers, without sacrificing strength or durability. Such multifilament fibers are produced through melt-spinning processes and exhibit highly unique microstructures therein, including significant void volumes, interspersed and crossed voids, and nanofilament bridges within such voids. Such microstructural characteristics appear to impart the exceptional properties noted above.
    Type: Application
    Filed: October 30, 2009
    Publication date: July 8, 2010
    Applicant: INNEGRITY, LLC
    Inventor: Brian G. Morin
  • Patent number: 7704595
    Abstract: Disclosed are structural materials including polymeric reinforcement fibers that can provide added strength and fracture toughness to the matrix. The polymeric reinforcement fibers are polypropylene-based monofilament fibers or tape fibers exhibiting extremely favorable mechanical characteristics for structural reinforcement including modulus greater than 12 MPa and elongation less than about 10%. The disclosed reinforced composite materials can exhibit desired average residual strength values with less total fiber loading necessary to attain the ARS values as compared to previously known polymer reinforced materials. Very high strength and fracture toughness can be attained in the disclosed composite materials.
    Type: Grant
    Filed: November 4, 2008
    Date of Patent: April 27, 2010
    Assignee: Innegrity, LLC
    Inventor: Brian G. Morin
  • Patent number: 7648758
    Abstract: Disclosed are composite materials that can exhibit low transmission energy loss and can also be temperature resistant. The composites include reinforcement fibers held in a polymeric matrix. The polymeric matrix can include an amorphous polymer component. Also disclosed are methods of forming the composites. Methods can include forming amorphous thermoplastic polymer fibers, forming a fabric from the fibers, combining the fabric with reinforcement fibers, and molding the structure thus formed under heat and pressure such that the amorphous thermoplastic polymer flows and forms a polymeric matrix incorporating the reinforcement fibers. The composites can be molded from multi-layer structures that can include layers of differing materials, for instance layers formed of polyaramids, fiberglass, or carbon fiber wovens or nonwovens. The composites can advantageously be utilized in low loss dielectric applications, such as in forming circuit board substrates, radomes, antennas, and the like.
    Type: Grant
    Filed: February 6, 2007
    Date of Patent: January 19, 2010
    Assignee: Innegrity, LLC
    Inventor: Brian G. Morin
  • Patent number: 7648607
    Abstract: Disclosed are composite laminates that can exhibit high strength and/or low dielectric loss and can also be lightweight. The laminates include layers formed of high modulus polyolefin fiber. The fibers can be woven or knit to form a fabric or can be included in a nonwoven fabric that can be one or more layers of the composite structures. The layers including the high modulus polyolefin fibers can include other fibers, such as fiberglass. The composites can also include layers of other materials, for instance layers formed of polyaramids, fiberglass, or carbon fiber wovens or nonwovens. The composites can advantageously be utilized in low loss dielectric applications, such as in forming circuit board substrates, or in applications beneficially combining strength with low weight, such as automobile and boat materials.
    Type: Grant
    Filed: August 17, 2005
    Date of Patent: January 19, 2010
    Assignee: Innegrity, LLC
    Inventor: Brian G. Morin
  • Publication number: 20090169856
    Abstract: Disclosed are structural materials including polymeric reinforcement fibers that can provide added strength and fracture toughness to the matrix. The polymeric reinforcement fibers are polypropylene-based monofilament fibers or tape fibers exhibiting extremely favorable mechanical characteristics for structural reinforcement including modulus greater than 12 MPa and elongation less than about 10%. The disclosed reinforced composite materials can exhibit desired average residual strength values with less total fiber loading necessary to attain the ARS values as compared to previously known polymer reinforced materials. Very high strength and fracture toughness can be attained in the disclosed composite materials.
    Type: Application
    Filed: November 4, 2008
    Publication date: July 2, 2009
    Applicant: INNEGRITY, LLC
    Inventor: Brian G. Morin
  • Patent number: 7445834
    Abstract: Disclosed are structural materials including polymeric reinforcment fibers that can provide added strength and fracture toughness to the matrix. The polymeric reinforcement fibers are polypropylene-based monofilament fibers or tape fibers exhibiting extremely favorable mechanical characteristics for structural reinforcement including modulus greater than 12 MPa and elongation less than about 10%. The disclosed reinforced composite materials can exhibit desired average residual strength values with less total fiber loading necessary to attain the ARS values as compared to previously known polymer reinforced materials. Very high strength and fracture toughness can be attained in the disclosed composite materials.
    Type: Grant
    Filed: June 10, 2005
    Date of Patent: November 4, 2008
    Inventor: Brian G. Morin
  • Patent number: 7445842
    Abstract: Disclosed is a method of forming multifilament polyolefin yarns and yarns formed according to the disclosed method. The yarns can be polypropylene yarns and can exhibit any of a high modulus, high tenacity, and a unique crystalline structure for multifilament polyolefin yarns. The process can generally include extruding a polymeric melt including the polyolefin at a relatively high throughput and low spinline tension and quenching the filaments in a liquid bath prior to drawing the fiber bundle at a relatively high draw ratio, for example greater than 10, in some embodiments.
    Type: Grant
    Filed: May 22, 2006
    Date of Patent: November 4, 2008
    Inventor: Brian G. Morin
  • Publication number: 20080241459
    Abstract: A material having a woven layer and a nonwoven layer needled together. The woven layer contains a plurality of interwoven polypropylene tape elements and the nonwoven layer contains a plurality of intermingled polyester fiber elements.
    Type: Application
    Filed: April 29, 2008
    Publication date: October 2, 2008
    Inventors: Kenneth B. Higgins, Brian G. Morin, Martin E. Cowan
  • Publication number: 20080188153
    Abstract: Disclosed are composite materials that can exhibit low transmission energy loss and can also be temperature resistant. The composites include reinforcement fibers held in a polymeric matrix. The polymeric matrix can include an amorphous polymer component. Also disclosed are methods of forming the composites. Methods can include forming amorphous thermoplastic polymer fibers, forming a fabric from the fibers, combining the fabric with reinforcement fibers, and molding the structure thus formed under heat and pressure such that the amorphous thermoplastic polymer flows and forms a polymeric matrix incorporating the reinforcement fibers. The composites can be molded from multi-layer structures that can include layers of differing materials, for instance layers formed of polyaramids, fiberglass, or carbon fiber wovens or nonwovens. The composites can advantageously be utilized in low loss dielectric applications, such as in forming circuit board substrates, radomes, antennas, and the like.
    Type: Application
    Filed: February 6, 2007
    Publication date: August 7, 2008
    Inventor: Brian G. Morin
  • Publication number: 20080187734
    Abstract: Disclosed are composite materials that can exhibit low transmission energy loss and can also be temperature resistant. The composites include reinforcement fibers held in a polymeric matrix. The polymeric matrix can include an amorphous polymer component. Also disclosed are methods of forming the composites. Methods can include forming amorphous thermoplastic polymer fibers, forming a fabric from the fibers, combining the fabric with reinforcement fibers, and molding the structure thus formed under heat and pressure such that the amorphous thermoplastic polymer flows and forms a polymeric matrix incorporating the reinforcement fibers. The composites can be molded from multi-layer structures that can include layers of differing materials, for instance layers formed of polyaramids, fiberglass, or carbon fiber wovens or nonwovens. The composites can advantageously be utilized in low loss dielectric applications, such as in forming circuit board substrates, radomes, antennas, and the like.
    Type: Application
    Filed: February 6, 2007
    Publication date: August 7, 2008
    Inventor: Brian G. Morin
  • Publication number: 20070292674
    Abstract: Disclosed are composites that can exhibit low transmission energy loss and can also be temperature resistant. The composites include reinforcement fibers held in a polymeric matrix. The reinforcement fibers can include an amorphous polymer component. The fibers can be woven or knit to form a fabric or can be included in a nonwoven fabric. The composites can include other fibers as well, such as fiberglass. The composites can be multi-layer structures and can include layers of other materials, for instance layers formed of polyaramids, fiberglass, or carbon fiber wovens or nonwovens. The composites can advantageously be utilized in low loss dielectric applications, such as in forming circuit board substrates.
    Type: Application
    Filed: June 15, 2006
    Publication date: December 20, 2007
    Inventor: Brian G. Morin
  • Patent number: 7273648
    Abstract: A base substrate having a first side and a second side, first and second receiving loops extending from the first and second side of the base substrate, respectively, and first and second stiff loops extending from the first and second side of the base substrate, respectively. The base substrate is a flexible cloth or cloth-like material. The receiving loops are an absorbent material such as the material used in the base substrate. The stiff loops are formed of a yarn having at least one filament with a cross-section having an aspect ratio of greater than about 1.2, a corner edge, and/or at least a concave portion.
    Type: Grant
    Filed: November 17, 2003
    Date of Patent: September 25, 2007
    Assignee: Milliken & Company
    Inventors: Brian G. Morin, Michael P. Sasser, Heather J. Hayes
  • Patent number: 7074483
    Abstract: Disclosed is a method of forming multifilament polyolefin yarns and yarns formed according to the disclosed method. The yarns can be polypropylene yarns and can exhibit any of a high modulus, high tenacity, and a unique crystalline structure for multifilament polyolefin yarns. The process can generally include extruding a polymeric melt including the polyolefin at a relatively high throughput and low spinline tension and quenching the filaments in a liquid bath prior to drawing the fiber bundle at a relatively high draw ratio, for example greater than 10, in some embodiments.
    Type: Grant
    Filed: November 5, 2004
    Date of Patent: July 11, 2006
    Assignee: Innegrity, LLC
    Inventor: Brian G. Morin