Patents by Inventor Brian H. Kim

Brian H. Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10655896
    Abstract: A device includes a substrate, a micro-electro-mechanical system (MEMS) device disposed on the substrate, a controller disposed on the substrate, a heating element, and an enclosure. The heating element is configured to generate heat in response to a signal generated by the controller. The enclosure encloses the MEMS sensor device, the controller, and the heating element. The controller is configured to generate the signal responsive to temperature measurements within the enclosure. The signal causes the heating element to generate heat and maintain a predetermined temperature within the enclosure.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: May 19, 2020
    Assignee: InvenSense, Inc.
    Inventors: Muhammad Maaz Qazi, Brian H. Kim, Haijun She
  • Patent number: 10472231
    Abstract: A Micro Electro Mechanical systems (MEMS) device includes a solder bump on a substrate, a CMOS-MEMS die comprising a CMOS die and a MEMS die, and stud bumps on the CMOS die. The MEMS die is disposed between the CMOS die and the substrate. The stud bumps and the solder bumps are positioned to provide an electrical connection between the CMOS die and the substrate.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: November 12, 2019
    Assignee: Invensense, Inc.
    Inventors: Brian H. Kim, Haijun She, Mozafar Maghsoudnia
  • Publication number: 20190308874
    Abstract: A Micro Electro Mechanical systems (MEMS) device includes a solder bump on a substrate, a CMOS-MEMS die comprising a CMOS die and a MEMS die, and stud bumps on the CMOS die. The MEMS die is disposed between the CMOS die and the substrate. The stud bumps and the solder bumps are positioned to provide an electrical connection between the CMOS die and the substrate.
    Type: Application
    Filed: October 27, 2016
    Publication date: October 10, 2019
    Inventors: Brian H. Kim, Haijun She, Mozafar Maghsoudnia
  • Publication number: 20170176062
    Abstract: A device includes a substrate, a micro-electro-mechanical system (MEMS) device disposed on the substrate, a controller disposed on the substrate, a heating element, and an enclosure. The heating element is configured to generate heat in response to a signal generated by the controller. The enclosure encloses the MEMS sensor device, the controller, and the heating element. The controller is configured to generate the signal responsive to temperature measurements within the enclosure. The signal causes the heating element to generate heat and maintain a predetermined temperature within the enclosure.
    Type: Application
    Filed: December 15, 2016
    Publication date: June 22, 2017
    Inventors: Muhammad Maaz QAZI, Brian H. KIM, Haijun SHE
  • Patent number: 9583684
    Abstract: Methods and systems may provide an alignment scheme for components that may reduce positional deviation between the components. The method may include placing a first component on top of a substrate, wherein the first component includes a receiving alignment feature, and coupling a second component to the first component, wherein the coupling includes inserting a protruding alignment feature of the second component into the receiving alignment feature of the first component. In one example, the first component includes an edge-emitting semiconductor die and the second component include one or more of an optical lens and an alignment frame.
    Type: Grant
    Filed: December 3, 2015
    Date of Patent: February 28, 2017
    Assignee: Intel Corporation
    Inventors: Brian H. Kim, Simon Lee
  • Publication number: 20170044007
    Abstract: A Micro Electro Mechanical systems (MEMS) device includes a solder bump on a substrate, a CMOS-MEMS die comprising a CMOS die and a MEMS die, and stud bumps on the CMOS die. The MEMS die is disposed between the CMOS die and the substrate. The stud bumps and the solder bumps are positioned to provide an electrical connection between the CMOS die and the substrate.
    Type: Application
    Filed: October 27, 2016
    Publication date: February 16, 2017
    Inventors: Brian H. Kim, Haijun She, Mozafar Maghsoudnia
  • Patent number: 9508663
    Abstract: A Micro Electro Mechanical systems (MEMS) device includes a solder bump on a substrate, a CMOS-MEMS die comprising a CMOS die and a MEMS die, and stud bumps on the CMOS die. The MEMS die is disposed between the CMOS die and the substrate. The stud bumps and the solder bumps are positioned to provide an electrical connection between the CMOS die and the substrate.
    Type: Grant
    Filed: July 24, 2013
    Date of Patent: November 29, 2016
    Assignee: INVENSENSE, INC.
    Inventors: Brian H. Kim, Haijun She, Mozafar Maghsoudnia
  • Patent number: 9494750
    Abstract: Methods, apparatuses, and systems related to optical connector assemblies are described. In some embodiments, the connector assemblies may include an optical assembly, having an optical interconnect and an optical module, to be coupled with a host electrical connector. The connector assembly may further include springs, disposed on the optical interconnect or the host electrical connector, to facilitate a coupling of the optical interconnect with the optical module. Other embodiments are described and claimed.
    Type: Grant
    Filed: November 11, 2015
    Date of Patent: November 15, 2016
    Assignee: INTEL CORPORATION
    Inventors: Simon S. Lee, Brian H. Kim, Jennie Lou H. De Quinto
  • Publication number: 20160093791
    Abstract: A method and apparatus for sealing a device with a MEMS device with an active region is disclosed. A substrate with an opening is disposed relative to the MEMS device so as to align the active region of the MEMS device with the opening. A sealant is disposed between the MEMS device and the substrate so as to form a seal around the active region. The device includes one or more flow limiting features to inhibit the flow of sealant to the active region.
    Type: Application
    Filed: September 29, 2014
    Publication date: March 31, 2016
    Inventors: Anthony D. Minervini, Brian H. Kim, Jia Gao
  • Publication number: 20160087172
    Abstract: Methods and systems may provide an alignment scheme for components that may reduce positional deviation between the components. The method may include placing a first component on top of a substrate, wherein the first component includes a receiving alignment feature, and coupling a second component to the first component, wherein the coupling includes inserting a protruding alignment feature of the second component into the receiving alignment feature of the first component. In one example, the first component includes an edge-emitting semiconductor die and the second component include one or more of an optical lens and an alignment frame.
    Type: Application
    Filed: December 3, 2015
    Publication date: March 24, 2016
    Inventors: Brian H. Kim, Simon Lee
  • Publication number: 20160062066
    Abstract: Methods, apparatuses, and systems related to optical connector assemblies are described. In some embodiments, the connector assemblies may include an optical assembly, having an optical interconnect and an optical module, to be coupled with a host electrical connector. The connector assembly may further include springs, disposed on the optical interconnect or the host electrical connector, to facilitate a coupling of the optical interconnect with the optical module. Other embodiments are described and claimed.
    Type: Application
    Filed: November 11, 2015
    Publication date: March 3, 2016
    Inventors: Simon S. Lee, Brian H. Kim, Jennie Lou H. De Quinto
  • Patent number: 9209369
    Abstract: Methods and systems may provide an alignment scheme for components that may reduce positional deviation between the components. The method may include placing a first component on top of a substrate, wherein the first component includes a receiving alignment feature, and coupling a second component to the first component, wherein the coupling includes inserting a protruding alignment feature of the second component into the receiving alignment feature of the first component. In one example, the first component includes an edge-emitting semiconductor die and the second component include one or more of an optical lens and an alignment frame.
    Type: Grant
    Filed: December 20, 2012
    Date of Patent: December 8, 2015
    Assignee: Intel Corporation
    Inventors: Brian H. Kim, Simon Lee
  • Patent number: 9188753
    Abstract: Methods, apparatuses, and systems related to optical connector assemblies are described. In some embodiments, the connector assemblies may include an optical assembly, having an optical interconnect and an optical module, to be coupled with a host electrical connector. The connector assembly may further include springs, disposed on the optical interconnect or the host electrical connector, to facilitate a coupling of the optical interconnect with the optical module. Other embodiments are described and claimed.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: November 17, 2015
    Assignee: INTEL CORPORATION
    Inventors: Simon S. Lee, Brian H. Kim, Jennie Lou H. De Quinto
  • Patent number: 9099352
    Abstract: Embodiments of the present disclosure describe semiconductor substrate techniques and configurations for an optical receiver. In one embodiment, a system includes a semiconductor substrate having one or more optical alignment features formed in a surface of the semiconductor substrate and an optical receiver assembly coupled with the semiconductor substrate, the optical receiver assembly including a photodetector device coupled with the surface of the semiconductor substrate, wherein the one or more optical alignment features facilitate precise optical alignment between a lens assembly and the photodetector device when the lens assembly is coupled with the semiconductor substrate using the one or more optical alignment features. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: December 8, 2011
    Date of Patent: August 4, 2015
    Assignee: Intel Corporation
    Inventors: John Heck, Ansheng Liu, Brian H. Kim
  • Publication number: 20150028432
    Abstract: A Micro Electro Mechanical systems (MEMS) device includes a solder bump on a substrate, a CMOS-MEMS die comprising a CMOS die and a MEMS die, and stud bumps on the CMOS die. The MEMS die is disposed between the CMOS die and the substrate. The stud bumps and the solder bumps are positioned to provide an electrical connection between the CMOS die and the substrate.
    Type: Application
    Filed: July 24, 2013
    Publication date: January 29, 2015
    Inventors: Brian H. Kim, Haijun She, Mozafar Maghsoudnia
  • Publication number: 20140270655
    Abstract: Methods, apparatuses, and systems related to optical connector assemblies are described. In some embodiments, the connector assemblies may include an optical assembly, having an optical interconnect and an optical module, to be coupled with a host electrical connector. The connector assembly may further include springs, disposed on the optical interconnect or the host electrical connector, to facilitate a coupling of the optical interconnect with the optical module. Other embodiments are described and claimed.
    Type: Application
    Filed: March 12, 2013
    Publication date: September 18, 2014
    Inventors: Simon S. Lee, Brian H. Kim, Jennie Lou H. De Quinto
  • Publication number: 20140175477
    Abstract: Methods and systems may provide an alignment scheme for components that may reduce positional deviation between the components. The method may include placing a first component on top of a substrate, wherein the first component includes a receiving alignment feature, and coupling a second component to the first component, wherein the coupling includes inserting a protruding alignment feature of the second component into the receiving alignment feature of the first component. In one example, the first component includes an edge-emitting semiconductor die and the second component include one or more of an optical lens and an alignment frame.
    Type: Application
    Filed: December 20, 2012
    Publication date: June 26, 2014
    Inventors: Brian H. Kim, Simon Lee
  • Patent number: 8684612
    Abstract: A photonic device assembly including a photonic device fabricated on a chip substrate, the chip substrate having a physical alignment feature fabricated therein, and a frame to couple an external optical lens or interconnect to the photonic device. The frame has a frame facet abutted to a complementary facet of the physical alignment feature. An adhesive permanently affixes the frame to the photonic device as aligned by the abutted facets. A method of forming a photonic device assembly includes microfabricating a physical alignment feature in a chip substrate of a photonic device and joining a frame to the chip substrate by abutting a facet of the coupling to a complementary facet of the fabricated physical alignment feature.
    Type: Grant
    Filed: July 1, 2011
    Date of Patent: April 1, 2014
    Assignee: Intel Corporation
    Inventor: Brian H. Kim
  • Publication number: 20130273672
    Abstract: Embodiments of the present disclosure describe semiconductor substrate techniques and configurations for an optical receiver. In one embodiment, a system includes a semiconductor substrate having one or more optical alignment features formed in a surface of the semiconductor substrate and an optical receiver assembly coupled with the semiconductor substrate, the optical receiver assembly including a photodetector device coupled with the surface of the semiconductor substrate, wherein the one or more optical alignment features facilitate precise optical alignment between a lens assembly and the photodetector device when the lens assembly is coupled with the semiconductor substrate using the one or more optical alignment features. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: December 8, 2011
    Publication date: October 17, 2013
    Inventors: John Heck, Ansheng Liu, Brian H. Kim
  • Patent number: 8373259
    Abstract: A system includes an optical transceiver assembly, including a flip chip connection of a semiconductor die with a photonic transceiver that overhangs a substrate to which it is to be connected. The assembly further includes an alignment pin that is held to the semiconductor die at a micro-engineered structure in the semiconductor die. The alignment pin provides passive alignment of the photonic transceiver with an optical lens that interfaces the photonic transceiver to one or more optical channels.
    Type: Grant
    Filed: July 27, 2010
    Date of Patent: February 12, 2013
    Assignee: Intel Corporation
    Inventors: Brian H. Kim, Simon S. Lee