Abstract: A photonic device assembly including a photonic device fabricated on a chip substrate, the chip substrate having a physical alignment feature fabricated therein, and a frame to couple an external optical lens or interconnect to the photonic device. The frame has a frame facet abutted to a complementary facet of the physical alignment feature. An adhesive permanently affixes the frame to the photonic device as aligned by the abutted facets. A method of forming a photonic device assembly includes microfabricating a physical alignment feature in a chip substrate of a photonic device and joining a frame to the chip substrate by abutting a facet of the coupling to a complementary facet of the fabricated physical alignment feature.

Abstract: Embodiments of the present disclosure describe semiconductor substrate techniques and configurations for an optical receiver. In one embodiment, a system includes a semiconductor substrate having one or more optical alignment features formed in a surface of the semiconductor substrate and an optical receiver assembly coupled with the semiconductor substrate, the optical receiver assembly including a photodetector device coupled with the surface of the semiconductor substrate, wherein the one or more optical alignment features facilitate precise optical alignment between a lens assembly and the photodetector device when the lens assembly is coupled with the semiconductor substrate using the one or more optical alignment features. Other embodiments may be described and/or claimed.

Abstract: A system includes an optical transceiver assembly, including a flip chip connection of a semiconductor die with a photonic transceiver that overhangs a substrate to which it is to be connected. The assembly further includes an alignment pin that is held to the semiconductor die at a micro-engineered structure in the semiconductor die. The alignment pin provides passive alignment of the photonic transceiver with an optical lens that interfaces the photonic transceiver to one or more optical channels.

Abstract: A photonic device assembly including a photonic device fabricated on a chip substrate, the chip substrate having a physical alignment feature fabricated therein, and a frame to couple an external optical lens or interconnect to the photonic device. The frame has a frame facet abutted to a complementary facet of the physical alignment feature. An adhesive permanently affixes the frame to the photonic device as aligned by the abutted facets. A method of forming a photonic device assembly includes microfabricating a physical alignment feature in a chip substrate of a photonic device and joining a frame to the chip substrate by abutting a facet of the coupling to a complementary facet of the fabricated physical alignment feature.

Abstract: A system includes an optical transceiver assembly, including a flip chip connection of a semiconductor die with a photonic transceiver that overhangs a substrate to which it is to be connected. The assembly further includes an alignment pin that is held to the semiconductor die at a micro-engineered structure in the semiconductor die. The alignment pin provides passive alignment of the photonic transceiver with an optical lens that interfaces the photonic transceiver to one or more optical channels.

Abstract: Methods of aligning lens carriers and ferrules with alignment frames during assembly of optical cable connectors are disclosed. In one aspect, a method may include coupling an alignment frame with a circuit substrate, aligning a lens carrier with the alignment frame, and aligning a ferrule with the alignment frame. Other methods, apparatus, and systems incorporating the apparatus are also disclosed.

Abstract: Methods of aligning lens carriers and ferrules with alignment frames during assembly of optical cable connectors are disclosed. In one aspect, a method may include coupling an alignment frame with a circuit substrate, aligning a lens carrier with the alignment frame, and aligning a ferrule with the alignment frame. Other methods, apparatus, and systems incorporating the apparatus are also disclosed.

Abstract: A monolithic cable assembly includes a communication cable and cable connectors coupled to either end of the communication cable. The communication cable includes at least one optical communication channel. The cable connectors include a physical end connector for electrically coupling to a data device connector, optoelectronic components for converting data signals between an electrical realm and an optical realm, and a passively aligned integrated lens cover. The integrated lens cover includes at least one optical pathway for coupling optical data signals between the at least one optical communication channel and the optoelectronic components.

Abstract: A transceiver is disclosed. The transceiver includes a carrier assembly having active components to transmit and receive optical input/output (I/O); and a connector, coupled to the carrier assembly to couple optical I/O between the active components and a waveguide.

Abstract: Methods of aligning lens carriers and ferrules with alignment frames during assembly of optical cable connectors are disclosed. In one aspect, a method may include coupling an alignment frame with a circuit substrate, aligning a lens carrier with the alignment frame, and aligning a ferrule with the alignment frame. Other methods, apparatus, and systems incorporating the apparatus are also disclosed.

Abstract: Methods of aligning lens carriers and ferrules with alignment frames during assembly of optical cable connectors are disclosed. In one aspect, a method may include coupling an alignment frame with a circuit substrate, aligning a lens carrier with the alignment frame, and aligning a ferrule with the alignment frame. Other methods, apparatus, and systems incorporating the apparatus are also disclosed.

Abstract: A monolithic cable assembly includes a communication cable and cable connectors coupled to either end of the communication cable. The communication cable includes at least one optical communication channel. The cable connectors include a physical end connector for electrically coupling to a data device connector, optoelectronic components for converting data signals between an electrical realm and an optical realm, and a passively aligned integrated lens cover. The integrated lens cover includes at least one optical pathway for coupling optical data signals between the at least one optical communication channel and the optoelectronic components.

Abstract: An optical module that may be used in small-form factor pluggable applications includes a delatching/latching mechanism. The optical module may be an optical transceiver, for example, and the delatching/latching mechanism may allow for improved insertion and removal of the optical module from a cage in a computer board assembly. A latching assembly that assists in latching and delatching may include a latching member having a slotted mating element that is in contact with, and rotates relative to a substantially-fixed pivot element. Rotation may be achieved via a rotatable actuator having a cam engaging a cam follower. Numerous example biasing apparatuses are described to bias the latching assembly to its latched position and to promote contact between the mating element and the pivot element.

Abstract: A method and apparatus for ensuring that two guide pins with a centerline in a module (e.g., a fiber optic module) mate with two holes in a connector. A connector guide positioner is provided to position a connector guide in an aligned orientation with respect to the guide pins. When in the aligned orientation, the centerline of the connector guide is in alignment with the centerline of the two guide pins of the module, thereby ensuring that the two holes of the connector mate with the two guide pins when the connector is inserted into the receptacle.

Abstract: A method and apparatus for ensuring that two guide pins with a centerline in a module (e.g., a fiber optic module) mate with two holes in a connector. A connector guide positioner is provided to position a connector guide in an aligned orientation with respect to the guide pins. When in the aligned orientation, the centerline of the connector guide is in alignment with the centerline of the two guide pins of the module, thereby ensuring that the two holes of the connector mate with the two guide pins when the connector is inserted into the receptacle.

Abstract: Packaging for components of an optical module. The packaging includes a flexible circuit coupled to two stiffeners. The packaging has a first sub-assembly with the first stiffener for receiving a first component. The packaging also has a second sub-assembly with the second stiffener for receiving a second component and for coupling to an external circuit. The packaging has a flexible portion with a first end for coupling to the first sub-assembly and a second end for coupling to the second sub-assembly. The flexible portion allows the first sub-assembly to be oriented with respect to the second sub-assembly to form an angle that is greater than zero degrees and less than 180 degrees.

Abstract: Packaging for components of an optical module. The packaging includes a flexible circuit coupled to two stiffeners. The packaging has a first sub-assembly with the first stiffener for receiving a first component. The packaging also has a second sub-assembly with the second stiffener for receiving a second component and for coupling to an external circuit. The packaging has a flexible portion with a first end for coupling to the first sub-assembly and a second end for coupling to the second sub-assembly. The flexible portion allows the first sub-assembly to be oriented with respect to the second sub-assembly to form an angle that is greater than zero degrees and less than 180 degrees.

Abstract: A silicon standoff acts as a shim during reflow between a module and a printed circuit board. The silicon standoff is attached to a flexible circuit. A ball grid array interposes the connection pads of the module and the printed circuit board. The height of the standoff is determined based on the amount of ball collapse that is desired. During reflow, the silicon standoff will not collapse, therefore the ball grid array can only collapse as far as the standoff allows before contacting the printed circuit board.