Patents by Inventor Brian LYNN ROWDEN

Brian LYNN ROWDEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • FLEXIBLE POWER CONNECTOR
    Publication number: 20130029531
    Abstract: A flexible power connector is presented.
    Type: Application
    Filed: July 31, 2011
    Publication date: January 31, 2013
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Eladio Clemente Delgado, Richard Alfred Beaupre, Brian Lynn Rowden
  • HIGH MELTING POINT SOLDERING LAYER AND FABRICATION METHOD FOR THE SAME, AND SEMICONDUCTOR DEVICE
    Publication number: 20120112201
    Abstract: A high melting point soldering layer includes a low melting point metal layer, a first high melting point metal layer disposed on a surface of the low melting point metal layer, and a second high melting point metal layer disposed at a back side of the low melting point metal layer. The low melting point metal layer, the first high melting point metal layer, and the second high melting point metal layer are mutually alloyed by transient liquid phase bonding, by annealing not less than a melting temperature of the low melting point metal layer, diffusing the metal of the low melting point metal layer into an alloy of the first high melting point metal layer and the second high melting point metal layer. The high melting point soldering layer has a higher melting point temperature than that of the low melting point metal layer.
    Type: Application
    Filed: November 9, 2010
    Publication date: May 10, 2012
    Applicants: Board of Trustees of the Univ. of Arkansas, acting for&on behalf of the Univ. of Arkansas,Fayetevill, ROHM CO., LTD.
    Inventors: Takukazu OTSUKA, Keiji OKUMURA, Brian LYNN ROWDEN