Abstract: A relatively high carbon, water-atomized, steel shot is softened via annealing to render it suitable for ballistic use. The annealing preferably includes decarburization from a surface layer or throughout and preferably provides the shot with a surface Knoop hardness of less than 250.

Abstract: A relatively high carbon, water-atomized, steel shot is softened via annealing to render it suitable for ballistic use. The annealing preferably includes decarburization from a surface layer or throughout and preferably provides the shot with a surface Knoop hardness of less than 250.

Abstract: A relatively high carbon, water-atomized, steel shot is softened via annealing to render it suitable for ballistic use. The annealing preferably includes decarburization from a surface layer or throughout and preferably provides the shot with a surface Knoop hardness of less than 250.

Abstract: A relatively high carbon, water-atomized, steel shot is softened via annealing to render it suitable for ballistic use. The annealing preferably includes decarburization from a surface layer or throughout and preferably provides the shot with a surface Knoop hardness of less than 250.

Abstract: A lead free ferromagnetic article is disclosed. The article is a compacted composite having a heavy more dense constituent that is preferably ferrotungsten and a less dense second constituent that is either a metal alloy or a polymer. The ferromagnetic constituent is present in an amount sufficient to impart the article with ferromagnetism. The ferromagnetic property allows fragments of the article, such as a projectile, bullet or shaped charge liner to be separated from dirt or other environments.

Abstract: To hermetically seal an optically transparent ceramic or glass member to a metallic housing, an aperture with a diameter less than the diameter of the member is formed through the metallic housing. The member is then press-fit into the aperture, partially displacing metal from the walls of the aperture, forming an inner burr circumscribing the aperture. The walls of the aperture and the circumscribing burr are then coated with a second metal, preferably electroless nickel. The resultant seal maintains hermeticity following thermal cycling and is particularly suited for the manufacture of a hybrid electronic package having an optical or opto-electronic coupling.

Abstract: A lead-free projectile made from a composition containing about 5-25% by weight tungsten and more than about 97% by weight tungsten plus iron.

Abstract: The present invention relates to an improved chemical-mechanical polishing (CMP) method for polishing a copper coated wafer containing a copper adhesion-promoting layer and a silicon-based layer. The method polishes copper layers with high removal rates, low defect densities and reduced amounts of dishing and erosion. The method involves a two step process. The first step is to utilize a bulk copper removal slurry that rapidly removes the majority the copper on the substrate. The second step utilizes a 1:1:1 selectivity copper/tantalum/silicon dioxide (Cu/Ta/SiO.sub.2) slurry that has approximately the same polishing rates for the copper layer, the adhesion-promoting layer and the silicon-based substrate. The second slurry reduces the amount of dishing and erosion that occurs in the copper trenches and dense copper arrays.

Abstract: To hermetically seal an optically transparent ceramic or glass member to a metallic housing, an aperture with a diameter less than the diameter of the member is formed through the metallic housing. The member is then press-fit into the aperture, partially displacing metal from the walls of the aperture, forming an inner burr circumscribing the aperture. The walls of the aperture and the circumscribing burr are then coated with a second metal, preferably electroless nickel. The resultant seal maintains hermeticity following thermal cycling and is particularly suited for the manufacture of a hybrid electronic package having an optical or opto-electronic coupling.

Abstract: There is provided a lead-free projectile, such as a bullet or a ballistic shot, formed by liquid phase sintering or liquid phase bonding of a first particulate having a density greater than lead, a second, ductile, particulate having a melting temperature in excess of 400.degree. C. and a binder having a fluidity temperature that is less than the melting temperature of the second particulate. Unlike solid phase sintering that tends to produce articles having a porosity of about 20%, by volume, liquid phase sintering and liquid phase bonding achieve close to 0% porosity. Reducing the porosity level decreases the amount of high density, first particulate, required to achieve a density close to that of lead. Since the high density particulate tends to be the most expensive component of the projectile, this significantly reduces the cost of the projectile. The reduced porosity also allows for an increase in the amount of the second, ductile, component.

Abstract: A process for making lead-free projectiles such as bullets using liquid metal infiltration to make a projectile having a density similar to lead.

Abstract: A composite lead-free bullet is disclosed comprising a heavy constituents selected from the group of tungsten, tungsten carbide, carballoy, and ferro-tungsten and a second binder constituent consisting of either a metal alloy or a plastic blend.

Abstract: A composite lead-free bullet is disclosed comprising a heavy constituents selected from the group of tungsten, tungsten carbide, carballoy, and ferro-tungsten and a second binder constituent consisting of either a metal alloy or a plastic blend.

Abstract: There is provided a composite copper alloy having a copper alloy core and a modified surface layer containing a nitride or carbide film. Alternatively, the modified surface layer may contain a carbo-nitride film. The alloy is formed by reacting a copper alloy with nitrogen, carbon or a nitrogen/carbon mixture at elevated temperatures. The resultant surface layer improves the tribological and mechanical properties of the alloy while maintaining useful electrical conductivity.

Abstract: There is provided an electronic package assembly having a leadframe and buffer bonded to a metallic base. To reduce the stress generated by the coefficient of thermal expansion mismatch, the buffer is mounted on a pedestal. The cross sectional area of the pedestal is less than that of the buffer, such that the at least a portion of the buffer overhangs the pedestal.

Abstract: There is provided a composite copper alloy having a copper alloy core and a modified surface layer containing a nitride or carbide film. Alternatively, the modified surface layer may contain a carbo-nitride film. The alloy is formed by reacting a copper alloy with nitrogen, carbon or a nitrogen/carbon mixture at elevated temperatures. The resultant surface layer improves the tribological and mechanical properties of the alloy while maintaining useful electrical conductivity.

Abstract: The average diameter of atomized droplets is reduced thereby reducing both the frequency of collisions between droplets as well as the turbulence at the liquid/solid interface. Reducing the porosity of a spray cast deposit leads to improvements in both the ductility and the electrical conductivity of the deposit.

Abstract: Selective heating of edge and near-edge portions of a strip material is used to increase the ductility of the strip material at these portions and to improve the cold rollability and/or strip annealability of the strip material. The selective heating may be performed either by radiant heating or by induction heating.

Abstract: A process and apparatus for forming an as-rolled composite metal panel comprised of at least two sheets of metal having a bond therebetween which can be broken by inflation to form a desired pattern of tubular passageways. The deformation of the sheets of metal during inflation is limited by a maximum aspect ratio. Inflation is provided using an inflation needle having a cross section which is a part or full oval. A fixture is provided for limiting the peeling apart of the composite metal panel upon insertion of the inflation needle.

Abstract: A high conductivity high temperature copper alloy containing mischmetal, phosphorus and magnesium with specific ratios among them. The alloy is free from internal copper oxides and may be annealed at elevated temperatures in hydrogen atmospheres without embrittlement. Strengths on the order of 80 KSI and conductivities on the order of 90% IACS are obtainable in cold worked material.