Abstract: A copper base alloy is disclosed which exhibits improved resistance to crack propagation during hot processing as well as good mechanical properties. The alloy comprises from about 4.0 to about 11.0% tin, from about 0.01 to about 0.3% phosphorus, from about 1.0 to about 5.0% of a material selected from the group consisting of iron and a mixture of iron and cobalt, up to about 0.4% chromium, balance essentially copper. The alloy of the present invention possesses a substantially non-dendritic grain structure in the cast condition which contributes to said resistance to crack propagation.

Abstract: New and improved copper base alloys, characterized by a combination of high electrical conductivity and excellent strength properties, consisting essentially of 0.8- 5% by weight of titanium as a first component, a portion of which may be a like element such as zirconium or hafnium or both, 1.2- 5% by weight of antimony as a second component, part of which may be replaced by one or more of the elements arsenic, phosphorus, silicon, germanium and tin, with the atomic ratio of the total titanium and like elements, to antimony and like elements, being not more than 10% above 5:3, and the balance essentially copper.

Abstract: A process of heat treating and mechanically working copper base alloys containing chromium, zirconium and vanadium is disclosed. The combination of alloying ingredients, hot and cold rolling, annealing and aging steps increases both the strength and electrical conductivity properties of the alloy without excessive cold working or aging.

Abstract: New and improved copper base alloys, characterized by a combination of high electrical conductivity and excellent strength properties, consisting essentially of 0.8 - 5% by weight of titanium, a portion of which may be a like element such as zirconium or hafnium or both, 1.2 - 5% by weight of antimony, part of which may be replaced by one or more of the elements arsenic, phosphorus, silicon, germanium and tin, with the atomic ratio of the total titanium, and like elements, to antimony, and like elements, being 5:3 or somewhat less, and the balance essentially copper. The desired properties are attained by the proper application of mechanical processing steps and thermal treatments.