Abstract: A liquid interface diffusion bonded composition comprises a metal honeycomb core such as a titanium honeycomb core and a metal facing sheet such as a titanium facing sheet bonded thereto. The composition is prepared by a method comprising: (a) providing a metal honeycomb core having a faying surface and a metal facing sheet having a faying surface; (b) placing together the honeycomb core faying surface and the facing sheet faying surface, and providing therebetween a metal foil typically formed by a rapid solidification process or a melt spinning process, with the metal foil comprising about 10.5-12.5 wt. % zirconium, about 20-24 wt. % copper, about 10.5-16 wt. % nickel, and the balance being titanium; (c) subjecting the faying surfaces and metal foil therebetween to sufficient positive pressure to maintain position and alignment for joining; and (d) heating the faying surfaces and metal foil therebetween in a protective atmosphere to a temperature in the range of 1700-1800 degrees F.

Abstract: An interfacing device having two operational amplifiers that have been manufactured on the same IC die have high-impedance input terminals connected directly to the two conductors of a local area network digital transmission line so as not to load or otherwise upset the impedance or other parameters of the transmission line. The output terminals of the operational amplifiers are connected to and match the input impedance of a digital transmission protocol analyzer. The gain of the operational amplifiers is arranged so as to replicate at the input of the analyzer the signals appearing on the local area network transmission line.

Abstract: A sheet of Ti 6-2-2-2-2 alloy having a starting thickness of between approximately 0.040 inches and 0.187 inches is thermomechanically treated at a temperature of between approximately 1500 degrees F. and 1750 degrees F. at a mechanical strain rate in the range of between approximately 1.times.10.sup.-4 and 1.times.10.sup.-2 inch per inch per second to produce a formed part having a tensile strength which is approximately 33% greater than untreated rolled Ti 6-2-2-2-2 alloy sheet or plate.

Abstract: A high strength, light weight stabilized skin structure having spaced skin sheets and a plurality of hollow metal spheres filling the space between the skins. The spheres and skins are bonded together, resulting in a unitary structure. The spheres typically have outside diameters of from about 0.005 to 0.5 inch, with tall thicknesses of about 0.0005 to 0.005 inch. Spheres of different sizes may be used, with smaller or heavier wall thickness spheres in high load areas, such as insert attachment points, and larger spheres in lightly loaded areas. The spheres preferably have a surface coating of a brazing material and are bonded together and to the skins by furnace brazing.

Abstract: A method of diffusion brazing two or more titanium alloy metal parts, such as sheets, thick sections or a honeycomb core to one or two face sheets, to form a unitary panel. A low melting copper-nickel layer is interposed between the faying surfaces of two parts to be bonded. The layer may be a foil placed between the surfaces or may be a layer plated onto one or both surfaces. The assembly is heated to at least the eutectic melting temperature of the base metal-interlayer eutectic point for a time sufficient to permit effective wetting and diffusion bonding of the surfaces. The assembly is held at the elevated temperature a sufficient additional time so as to allow isothermal solidification to occur. The assembly is then cooled, resulting in a unitary structure. This method is particularly effective with titanium aluminides face sheets and a titanium aluminide or other titanium base honeycomb core and with an interlayer consisting essentially of nickel and copper.

Abstract: The disclosure relates to a method of joining titanium and titanium based alloys to columbium at low pressure and low temperature, wherein a titanium foil is electroplated with layers of copper and nickel with a columbium sheet then being placed in intimate contact with the exposed layer. The materials are then heated in a vacuum to a temperature above the Ti-Cu-Ni eutectic temperature and below the beta-transus of the titanium material to provide a joining of titanium to columbium without materially altering the mechanical properties of the materials involved.

Abstract: The disclosure relates to a method of joining nickel and nickel based alloys to columbium at low pressure and low temperature, wherein a thin titanium brazing foil is provided, with or without a copper coating electroplated thereon. The layers or foils of the metals to be joined are placed in intimate contact with opposite sides of the brazing foil under pressure and heated in a vacuum to a temperature above the eutectic of the metals being used and below 2000.degree. F. and preferably below 1950.degree. F. to provide the bond.

Abstract: The disclosure relates to a method of bonding columbium to columbium wherein a brazing foil of titanium which has been coated with either a layer of copper or a layer of nickel or layers of copper and then nickel, preferably on both sides of the foil, is disposed between the columbium sheets or the like to be joined. The columbium are placed in intimate contact with opposite sides of the foil and heated to a temperature above the eutectic point of the eutectics of the metals of the foil and no higher than about 1750.degree. F. for about 90 minutes and then cooled to provide the desired bond.

Abstract: A process for selectively electroplating the nodes of dimpled titanium material. A sheet of clean dimpled titanium material is placed on a electrolyte saturated absorbent fabric covered block of conductive material. A flat sheet of metal, such as, stainless steel is placed on the opposite surface of the dimpled sheet to provide dead weight to hold only the nodes of the dimpled sheet in contact the absorbent material the dimpled sheet serving as one electrode for the electroplating process. The conductive block being the other electrode. Current is then passed through the electrolyte solution between the electrodes causing only the nodes to become plated. The electrolyte may contain, for example, copper or nickel in solution. A plating mask in the form of a frame may be placed between the flat sheet of metal and the dimpled sheet to provide uniform plating of the node surfaces.

Abstract: An electronic organ having solo, accompaniment, and pedal keyboards, or manuals, and adjustable into different modes of playing for at least the accompaniment keyboard.In a first playing mode, the accompaniment keyboard plays in a conventional manner with each key of the keyboard which is depressed actuating a respective keyer.In a second selectable playing mode, the keys of the accompaniment keyboard are disabled for actuating keyers in a conventional manner and, instead, a selected group of the keys, referred to as "chord playing" keys, are made effective for playing chords by having each of the chord playing keys actuate a respective group of keyers while the key is depressed.In a third playing mode, the keys of the accompaniment manual are disabled for actuating respective keyers and, instead, the same group of "chord playing" keys referred to above are enabled for actuating the keyers pertaining to respective chords singly, or in groups, sequentially at predetermined time intervals.