Abstract: A pattern of electrodes, with electrical lead lines to the electrodes, are arried by a thin-film membrane mounted on a frame. The pattern corresponds to a test point pattern on a circuit to be tested. The lead lines go to edge connectors on the frame. In order to test a circuit, the membrane is pushed against the test points by air pressure, such that capacitive coupling occurs between the electrodes and the test points.

Abstract: A pattern of electrodes, with electrical lead lines to the electrodes, are arried by a thin-film membrane mounted on a frame. The pattern corresponds to a test point pattern on a circuit to be tested. The lead lines go to edge connectors on the frame. In order to test a circuit, the membrane is pushed against the test points by air pressure, such that capacitive coupling occurs between the electrodes and the test points.

Abstract: A pattern of electrodes, with electrical lead lines to the electrodes, are arried by a thin-film membrane mounted on a frame. The pattern corresponds to a test point pattern on a circuit to be tested. The lead lines go to edge connectors on the frame. In order to test a circuit, the membrane is pushed against the test points by air pressure, such that capacitive coupling occurs between the electrodes and the test points.

Abstract: A pattern of electrodes, with electrical lead lines to the electrodes, are arried by a thin-film membrane mounted on a frame. The pattern corresponds to a test point pattern on a circuit to be tested. The lead lines go to edge connectors on the frame. In order to test a circuit, the membrane is pushed against the test points by air pressure, such that capacitive coupling occurs between the electrodes and the test points.

Abstract: In order to ensure total bonding together of two-dimensional arrays of inm bumps on circuit boards, additional bumps are placed on each board in a triangular pattern which contains the array of that board. Opposing sets of thrusters are used to move the boards and their bumps toward each other, after the arrays are aligned with the boards juxtaposed and substantially parallel to each other. As corresponding sets of additional bumps touch each other, the set of thrusters moving the boards at those points hold their positions, until all sets of additional bumps are in touch; all of the thrusters of at least one board are then simultaneously energized until a predetermined pressure is achieved between the boards.

Abstract: An insulating layer on the surface of a slab of photo-responsive semicondor material is treated to produce a pattern of projections or mesas. The treatment includes the steps of producing a mask on the insulating layer using electron-beam lithography, etching holes in the layer through the mask, stripping the mask, and finishing with the usual electrical conductors on the insulating layer. An alternate embodiment etches the surface of the slab to produce a scrabrous surface, then coats with aluminum oxide and electrical conductors.

Abstract: A two-dimensional array of small, thin, flexible, metalized mirrors are mted atop supports on one side of a photoelectric layer. A visible light or infrared image on the other side of the layer induces an electron image (charge pattern) beneath the mirrors. The mirrors deflect towards the layer in accordance with the charge pattern. Light projected onto the mirrors is reflected and forms an image dependent on the deflections thereof.

Abstract: A method of producing a tunnel emitter photocathode consisting of heating a emiconductor layer and then depositing a layer of aluminum oxide on one side thereof at a rapid rate and then baking out the wafer in a hydrogen gas atmosphere. After depositing electrical contacts on each side of the wafer, a metallic emitter layer is evaporated over the aluminum oxide layer with the metallic emitter layer treated with a low work function material such as cesium and oxygen to further increase the emission efficiency.