Patents by Inventor Brian Samuel Beaman
Brian Samuel Beaman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9814140Abstract: A printed circuit board assembly and method of assembly is provided for a printed circuit board having a top and bottom surface with at least one edge portion having a rounded surface extending from the top surface to a point below the top surface and at least one electrical contact pad located on the top surface and extending over the edge portion rounded surface to a point below the top surface.Type: GrantFiled: April 5, 2016Date of Patent: November 7, 2017Assignee: International Business Machines CorporationInventor: Brian Samuel Beaman
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Patent number: 9693457Abstract: A printed circuit board assembly and method of assembly is provided for a printed circuit board having a top and bottom surface with at least one edge portion having a rounded surface extending from the top surface to a point below the top surface and at least one electrical contact pad located on the top surface and extending over the edge portion rounded surface to a point below the top surface.Type: GrantFiled: December 13, 2013Date of Patent: June 27, 2017Assignee: International Business Machines CorporationInventor: Brian Samuel Beaman
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Patent number: 9549469Abstract: A printed circuit board assembly and method of assembly is provided for a printed circuit board having a top and bottom surface with at least one edge portion having a rounded surface extending from the top surface to a point below the top surface and at least one electrical contact pad located on the top surface and extending over the edge portion rounded surface to a point below the top surface.Type: GrantFiled: December 13, 2013Date of Patent: January 17, 2017Assignee: International Business Machines CorporationInventor: Brian Samuel Beaman
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Patent number: 9484649Abstract: An electromechanical assembly includes a socket housing having a cavity for seating an integrated circuit and a first plurality of electrical contacts in the cavity to electrically connect an integrated circuit seated in the socket housing with a circuit board upon which the electromechanical assembly is mounted. The socket housing has a supporting body on a different plane than a bottom surface of the cavity. The socket housing has a second plurality of electrical contacts that form a first row across the supporting body and a third plurality of electrical contacts that form a second row across the supporting body. The socket housing has alignment elements. The electromechanical assembly also includes a card edge connector having slots that accept the alignment elements of the socket housing, a fourth plurality of electrical contacts that form a third row, and a fifth plurality of electrical contacts that form a fourth row.Type: GrantFiled: January 30, 2015Date of Patent: November 1, 2016Assignee: Lenovo Enterprise Solutions (Singapore) PTE. LTD.Inventors: Brian Samuel Beaman, Wen Hsin Chen
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Publication number: 20160249454Abstract: A printed circuit board assembly and method of assembly is provided for a printed circuit board having a top and bottom surface with at least one edge portion having a rounded surface extending from the top surface to a point below the top surface and at least one electrical contact pad located on the top surface and extending over the edge portion rounded surface to a point below the top surface.Type: ApplicationFiled: April 5, 2016Publication date: August 25, 2016Inventor: Brian Samuel Beaman
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Publication number: 20160226166Abstract: An electromechanical assembly includes a socket housing having a cavity for seating an integrated circuit and a first plurality of electrical contacts in the cavity to electrically connect an integrated circuit seated in the socket housing with a circuit board upon which the electromechanical assembly is mounted. The socket housing has a supporting body on a different plane than a bottom surface of the cavity. The socket housing has a second plurality of electrical contacts that form a first row across the supporting body and a third plurality of electrical contacts that form a second row across the supporting body. The socket housing has alignment elements. The electromechanical assembly also includes a card edge connector having slots that accept the alignment elements of the socket housing, a fourth plurality of electrical contacts that form a third row, and a fifth plurality of electrical contacts that form a fourth row.Type: ApplicationFiled: January 30, 2015Publication date: August 4, 2016Inventors: Brian Samuel Beaman, Wen Hsin Chen
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Patent number: 9404942Abstract: Coaxial probe structures include a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.Type: GrantFiled: February 7, 2014Date of Patent: August 2, 2016Assignee: GLOBALFOUNDRIES INC.Inventors: Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Yun-Hsin Liao, Daniel Peter Morris, Da-Yuan Shih
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Publication number: 20140191775Abstract: The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.Type: ApplicationFiled: February 7, 2014Publication date: July 10, 2014Applicant: International Business Machines CorporationInventors: Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Yun-Hsin Liao, Daniel Peter Morris, Da-Yuan Shih
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Patent number: 8754666Abstract: Structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.Type: GrantFiled: March 21, 2008Date of Patent: June 17, 2014Assignee: International Business Machines CorporationInventors: Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Yun-Hsin Liao, Daniel Peter Morris, Da-Yuan Shih
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Publication number: 20140158403Abstract: A printed circuit board assembly and method of assembly is provided for a printed circuit board having a top and bottom surface with at least one edge portion having a rounded surface extending from the top surface to a point below the top surface and at least one electrical contact pad located on the top surface and extending over the edge portion rounded surface to a point below the top surface.Type: ApplicationFiled: December 13, 2013Publication date: June 12, 2014Applicant: International Business Machines CorporationInventor: Brian Samuel Beaman
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Publication number: 20140158404Abstract: A printed circuit board assembly and method of assembly is provided for a printed circuit board having a top and bottom surface with at least one edge portion having a rounded surface extending from the top surface to a point below the top surface and at least one electrical contact pad located on the top surface and extending over the edge portion rounded surface to a point below the top surface.Type: ApplicationFiled: December 13, 2013Publication date: June 12, 2014Applicant: International Business Machines CorporationInventor: Brian Samuel Beaman
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Patent number: 8677617Abstract: A printed circuit board assembly and method of assembly is provided for a printed circuit board having a top and bottom surface with at least one edge portion having a rounded surface extending from the top surface to a point below the top surface and at least one electrical contact pad located on the top surface and extending over the edge portion rounded surface to a point below the top surface.Type: GrantFiled: April 28, 2010Date of Patent: March 25, 2014Assignee: International Business Machines CorporationInventor: Brian Samuel Beaman
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Patent number: 8491772Abstract: The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.Type: GrantFiled: August 21, 2009Date of Patent: July 23, 2013Assignee: International Business Machines CorporationInventors: Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Yun-Hsin Liao, Daniel Peter Morris, Da-Yuan Shih
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Patent number: 8486250Abstract: The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.Type: GrantFiled: February 1, 2002Date of Patent: July 16, 2013Assignee: International Business Machines CorporationInventors: Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Yun-Hsin Liao, Daniel Peter Morris, Da-Yuan Shih
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Publication number: 20100052715Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.Type: ApplicationFiled: August 27, 2009Publication date: March 4, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Maurice Heathcote Norcott, Da-Yuan Shih, George Frederick Walker
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Publication number: 20100045320Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.Type: ApplicationFiled: August 27, 2009Publication date: February 25, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Maurice Heathcote Norcott, Da-Yuan Shih, George Frederick Walker
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Publication number: 20100045266Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.Type: ApplicationFiled: August 27, 2009Publication date: February 25, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Maurice Heathcote Norcott, Da-Yuan Shih, George Frederick Walker
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Publication number: 20100045321Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.Type: ApplicationFiled: August 27, 2009Publication date: February 25, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Maurice Heathcote Norcott, Da-Yuan Shih, George Frederick Walker
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Publication number: 20100045318Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.Type: ApplicationFiled: August 27, 2009Publication date: February 25, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Maurice Heathcote Norcott, Da-Yuan Shih, George Frederick Walker
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Publication number: 20100045324Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.Type: ApplicationFiled: August 27, 2009Publication date: February 25, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Maurice Heathcote Norcott, Da-Yuan Shih, George Frederick Walker