Patents by Inventor Bruce C. Beihoff

Bruce C. Beihoff has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9027371
    Abstract: An appliance system that includes an appliance group containing at least two appliances, a first appliance designed to perform a first consumer function related to the first appliance and a second appliance that is separate from the first appliance and designed to perform a second consumer function related to the second appliance. The appliance system also includes a thermal energy generator, typically a heat pump, where the thermal energy heats at least one thermal energy bearing fluid and is operably connected to the first and second appliances to deliver thermal energy to the first and second appliances simultaneously or at different times via one or more of the thermal energy bearing fluids.
    Type: Grant
    Filed: June 27, 2011
    Date of Patent: May 12, 2015
    Assignee: Whirlpool Corporation
    Inventors: Bruce C. Beihoff, Nihat O. Cur, Kirk M. Dunsbergen, Joel A. Luckman, Richard A. Sunshine, Tao Xie
  • Patent number: 8915104
    Abstract: An appliance system that includes an appliance group containing at least two appliances, a first appliance designed to perform a first consumer function related to the first appliance and a second appliance that is separate from the first appliance and designed to perform a second consumer function related to the second appliance. The appliance system also includes a thermal energy generator, typically a heat pump, where the thermal energy heats at least one thermal energy bearing fluid and is operably connected to the first and second appliances to deliver thermal energy to the first and second appliances simultaneously or at different times via one or more of the thermal energy bearing fluids.
    Type: Grant
    Filed: August 18, 2010
    Date of Patent: December 23, 2014
    Inventors: Bruce C. Beihoff, Nihat O. Cur, Kirk M. Dunsbergen, Joel A. Luckman, Richard A. Sunshine, Tao Xie
  • Patent number: 8844160
    Abstract: A modular system according to one embodiment of the invention for treating a fabric load comprises a first module and a second module. The first module can include a chamber having an interior for holding a fabric load, and the second module can have at least one of a fluid delivery system, a fluid removal system, and a fluid recycling system. The modular system can further include conduits for coupling the systems of the second module with the first module.
    Type: Grant
    Filed: September 29, 2010
    Date of Patent: September 30, 2014
    Assignee: Whirlpool Corporation
    Inventors: Bruce C. Beihoff, Karl D. McAllister, Janice M. Kaeding, Tremitchell Wright, Alexander V. Minkin, Joel A. Luckman, Colleen M. Doyle
  • Publication number: 20110252835
    Abstract: An appliance system that includes an appliance group containing at least two appliances, a first appliance designed to perform a first consumer function related to the first appliance and a second appliance that is separate from the first appliance and designed to perform a second consumer function related to the second appliance. The appliance system also includes a thermal energy generator, typically a heat pump, where the thermal energy heats at least one thermal energy bearing fluid and is operably connected to the first and second appliances to deliver thermal energy to the first and second appliances simultaneously or at different times via one or more of the thermal energy bearing fluids.
    Type: Application
    Filed: June 27, 2011
    Publication date: October 20, 2011
    Applicant: WHIRLPOOL CORPORATION
    Inventors: BRUCE C. BEIHOFF, NIHAT O. CUR, KIRK M. DUNSBERGEN, JOEL A. LUCKMAN, RICHARD A. SUNSHINE, TAO XIE
  • Publication number: 20110041564
    Abstract: An appliance system that includes an appliance group containing at least two appliances, a first appliance designed to perform a first consumer function related to the first appliance and a second appliance that is separate from the first appliance and designed to perform a second consumer function related to the second appliance. The appliance system also includes a thermal energy generator, typically a heat pump, where the thermal energy heats at least one thermal energy bearing fluid and is operably connected to the first and second appliances to deliver thermal energy to the first and second appliances simultaneously or at different times via one or more of the thermal energy bearing fluids.
    Type: Application
    Filed: August 18, 2010
    Publication date: February 24, 2011
    Applicant: WHIRLPOOL CORPORATION
    Inventors: BRUCE C. BEIHOFF, NIHAT O. CUR, KIRK M. DUNSBERGEN, JOEL A. LUCKMAN, RICHARD A. SUNSHINE, TAO XIE
  • Publication number: 20110016928
    Abstract: A modular system according to one embodiment of the invention for treating a fabric load comprises a first module and a second module. The first module can include a chamber having an interior for holding a fabric load, and the second module can have at least one of a fluid delivery system, a fluid removal system, and a fluid recycling system. The modular system can further include conduits for coupling the systems of the second module with the first module.
    Type: Application
    Filed: September 29, 2010
    Publication date: January 27, 2011
    Applicant: WHIRLPOOL CORPORATION
    Inventors: Bruce C. Beihoff, Karl D. McAllister, Janice M. Kaeding, Tremitchell Wright, Alexander V. Minkin, Joel A. Luckman, Colleen M. Doyle
  • Publication number: 20100018262
    Abstract: A modular system according to one embodiment of the invention for treating fabric load comprises a first module and a second module. The first module can include a chamber having an interior for holding a fabric load, and the second module can have at least one of a fluid delivery system, a fluid removal system, and a fluid recycling system. The modular system can further include conduits for coupling the systems of the second module with the first module.
    Type: Application
    Filed: September 30, 2009
    Publication date: January 28, 2010
    Applicant: WHIRLPOOL CORPORATION
    Inventors: BRUCE C. BEIHOFF, KARL D. MCALLISTER, JANICE M. KAEDING, TREMITCHELL WRIGHT, ALEXANDER V. MINKIN, JOEL A. LUCKMAN, COLLEEN M. DOYLE
  • Patent number: 7450388
    Abstract: EMI shielding is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
    Type: Grant
    Filed: September 16, 2003
    Date of Patent: November 11, 2008
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Bruce C. Beihoff, Dennis L. Kehl, Lee A. Gettelfinger, Steven C. Kaishian, Mark G. Phillips, Lawrence D. Radosevich
  • Publication number: 20080156034
    Abstract: A distributed refrigeration appliance system for use in a residential kitchen and other locations in a dwelling and includes multiple separate refrigeration appliance modules, a central cooling system and a cooling circuit. The system can also include one or more satellite stations having a heat exchanger and arranged for supplying chilled air to one or more refrigeration appliance modules. One or more refrigeration appliance modules can include a thermal cascade cooling device to cool the module to lower temperatures than the cooling circuit can attain. One or more refrigeration appliance modules can be refrigeration/storage modules that can provide refrigerated, unconditioned or heated storage space. The central cooling system can be a vapor compression system having a refrigerant circuit connecting the modules. Alternately, the central cooling system can cool a secondary cooling medium circuit.
    Type: Application
    Filed: June 28, 2007
    Publication date: July 3, 2008
    Applicant: WHIRLPOOL CORPORATION
    Inventors: NIHAT O. CUR, STEVEN JOHN KUEHL, JOHN JOSEPH VONDERHAAR, BRUCE C. BEIHOFF
  • Publication number: 20070163096
    Abstract: A fabric revitalizing appliance comprises a fabric treatment chamber; a dehydration system for dehydrating a fabric load within the fabric treatment chamber; and a fluid management system. The fluid management system comprises a fluid storage system configured to store at least one fluid; a fluid conditioning system configured to create a conditioned fluid from the fluid of the fluid storage system; a fluid transport system fluidly connecting the fluid storage system and the fluid conditioning system; and a fluid delivery system fluidly coupled to the fluid conditioning system and configured to deliver the conditioned fluid to the fabric treatment chamber.
    Type: Application
    Filed: July 7, 2006
    Publication date: July 19, 2007
    Inventors: Karl D. McAllister, Bruce C. Beihoff, Alexander V. Minkin, Joel A. Luckman, Tremitchell Wright
  • Publication number: 20070151041
    Abstract: A method for revitalizing a fabric load with a revitalization system comprises selecting a revitalization program from a plurality of programs and operating the revitalization system in accordance with the selected revitalization program. The programs can include at least one of a fluid insertion step; a fabric relative motion step; a fluid extraction step; a fabric refreshing step; a fabric reshaping step; a light cleaning step; a water extraction operation, a relative motion operation; a fabric air flow operation; a cooling operation; a fluid insertion operation; and a fabric fluid absorption operation.
    Type: Application
    Filed: July 7, 2006
    Publication date: July 5, 2007
    Inventors: Karl D. McAllister, Tremitchell Wright, Donald M. Tomasi, Bruce C. Beihoff, Alexander V. Minkin, Joel A. Luckman
  • Patent number: 7212407
    Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
    Type: Grant
    Filed: December 6, 2005
    Date of Patent: May 1, 2007
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Andreas A. Meyer, Neil Gollhardt, Daniel G. Kannenberg
  • Patent number: 7187548
    Abstract: A thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support, which may be controlled in a closed-loop manner. Interfacing between circuits, circuit mounting structure, and the support provide for greatly enhanced cooling. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
    Type: Grant
    Filed: December 23, 2002
    Date of Patent: March 6, 2007
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Andreas A. Meyer, Lawrence D. Radosevich, Bruce C. Beihoff, Dennis L. Kehl, Daniel G. Kannenberg
  • Patent number: 7177153
    Abstract: An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as between component layers and between the circuits and the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
    Type: Grant
    Filed: December 9, 2002
    Date of Patent: February 13, 2007
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Lawrence D. Radosevich, Andreas A. Meyer, Daniel G. Kannenberg, Steven C. Kaishian, Bruce C. Beihoff
  • Patent number: 7142434
    Abstract: EMI shielding in an electric vehicle drive is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
    Type: Grant
    Filed: December 26, 2002
    Date of Patent: November 28, 2006
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Bruce C. Beihoff, Dennis L. Kehl, Lee A. Gettelfinger, Steven C. Kaishian, Mark G. Phillips, Lawrence D. Radosevich
  • Patent number: 7095612
    Abstract: A terminal structure provides interfacing with power electronics circuitry and external circuitry. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the terminal structure and the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
    Type: Grant
    Filed: August 25, 2004
    Date of Patent: August 22, 2006
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Mark G. Phillips, Dennis L. Kehl, Steven C. Kaishian, Daniel G. Kannenberg
  • Patent number: 7061775
    Abstract: EMI shielding is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
    Type: Grant
    Filed: December 23, 2002
    Date of Patent: June 13, 2006
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Bruce C. Beihoff, Dennis L. Kehl, Lee A. Gettelfinger, Steven C. Kaishian, Mark G. Phillips, Lawrence D. Radosevich
  • Patent number: 7032695
    Abstract: A terminal structure for vehicle drive power electronics circuits reduces the need for a DC bus and thereby the incidence of parasitic inductance. The structure is secured to a support that may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as by direct contact between the terminal assembly and AC and DC circuit components. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
    Type: Grant
    Filed: September 23, 2002
    Date of Patent: April 25, 2006
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Mark G. Phillips, Dennis L. Kehl, Steven C. Kaishian, Daniel G. Kannenberg
  • Patent number: 7016192
    Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
    Type: Grant
    Filed: September 16, 2003
    Date of Patent: March 21, 2006
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Andreas A. Meyer, Neil Gollhardt, Daniel G. Kannenberg
  • Patent number: 6982873
    Abstract: An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support, which may be controlled in a closed-loop manner. Interfacing between circuits, circuit mounting structure, and the support provide for greatly enhanced cooling. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
    Type: Grant
    Filed: December 16, 2002
    Date of Patent: January 3, 2006
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Andreas A. Meyer, Lawrence D. Radosevich, Bruce C. Beihoff, Dennis L. Kehl, Daniel G. Kannenberg