Abstract: An appliance system that includes an appliance group containing at least two appliances, a first appliance designed to perform a first consumer function related to the first appliance and a second appliance that is separate from the first appliance and designed to perform a second consumer function related to the second appliance. The appliance system also includes a thermal energy generator, typically a heat pump, where the thermal energy heats at least one thermal energy bearing fluid and is operably connected to the first and second appliances to deliver thermal energy to the first and second appliances simultaneously or at different times via one or more of the thermal energy bearing fluids.

Abstract: An appliance system that includes an appliance group containing at least two appliances, a first appliance designed to perform a first consumer function related to the first appliance and a second appliance that is separate from the first appliance and designed to perform a second consumer function related to the second appliance. The appliance system also includes a thermal energy generator, typically a heat pump, where the thermal energy heats at least one thermal energy bearing fluid and is operably connected to the first and second appliances to deliver thermal energy to the first and second appliances simultaneously or at different times via one or more of the thermal energy bearing fluids.

Abstract: A modular system according to one embodiment of the invention for treating a fabric load comprises a first module and a second module. The first module can include a chamber having an interior for holding a fabric load, and the second module can have at least one of a fluid delivery system, a fluid removal system, and a fluid recycling system. The modular system can further include conduits for coupling the systems of the second module with the first module.

Abstract: An appliance system that includes an appliance group containing at least two appliances, a first appliance designed to perform a first consumer function related to the first appliance and a second appliance that is separate from the first appliance and designed to perform a second consumer function related to the second appliance. The appliance system also includes a thermal energy generator, typically a heat pump, where the thermal energy heats at least one thermal energy bearing fluid and is operably connected to the first and second appliances to deliver thermal energy to the first and second appliances simultaneously or at different times via one or more of the thermal energy bearing fluids.

Abstract: An appliance system that includes an appliance group containing at least two appliances, a first appliance designed to perform a first consumer function related to the first appliance and a second appliance that is separate from the first appliance and designed to perform a second consumer function related to the second appliance. The appliance system also includes a thermal energy generator, typically a heat pump, where the thermal energy heats at least one thermal energy bearing fluid and is operably connected to the first and second appliances to deliver thermal energy to the first and second appliances simultaneously or at different times via one or more of the thermal energy bearing fluids.

Abstract: A modular system according to one embodiment of the invention for treating a fabric load comprises a first module and a second module. The first module can include a chamber having an interior for holding a fabric load, and the second module can have at least one of a fluid delivery system, a fluid removal system, and a fluid recycling system. The modular system can further include conduits for coupling the systems of the second module with the first module.

Abstract: A modular system according to one embodiment of the invention for treating fabric load comprises a first module and a second module. The first module can include a chamber having an interior for holding a fabric load, and the second module can have at least one of a fluid delivery system, a fluid removal system, and a fluid recycling system. The modular system can further include conduits for coupling the systems of the second module with the first module.

Abstract: EMI shielding is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Abstract: A distributed refrigeration appliance system for use in a residential kitchen and other locations in a dwelling and includes multiple separate refrigeration appliance modules, a central cooling system and a cooling circuit. The system can also include one or more satellite stations having a heat exchanger and arranged for supplying chilled air to one or more refrigeration appliance modules. One or more refrigeration appliance modules can include a thermal cascade cooling device to cool the module to lower temperatures than the cooling circuit can attain. One or more refrigeration appliance modules can be refrigeration/storage modules that can provide refrigerated, unconditioned or heated storage space. The central cooling system can be a vapor compression system having a refrigerant circuit connecting the modules. Alternately, the central cooling system can cool a secondary cooling medium circuit.

Abstract: A fabric revitalizing appliance comprises a fabric treatment chamber; a dehydration system for dehydrating a fabric load within the fabric treatment chamber; and a fluid management system. The fluid management system comprises a fluid storage system configured to store at least one fluid; a fluid conditioning system configured to create a conditioned fluid from the fluid of the fluid storage system; a fluid transport system fluidly connecting the fluid storage system and the fluid conditioning system; and a fluid delivery system fluidly coupled to the fluid conditioning system and configured to deliver the conditioned fluid to the fabric treatment chamber.

Abstract: A method for revitalizing a fabric load with a revitalization system comprises selecting a revitalization program from a plurality of programs and operating the revitalization system in accordance with the selected revitalization program. The programs can include at least one of a fluid insertion step; a fabric relative motion step; a fluid extraction step; a fabric refreshing step; a fabric reshaping step; a light cleaning step; a water extraction operation, a relative motion operation; a fabric air flow operation; a cooling operation; a fluid insertion operation; and a fabric fluid absorption operation.

Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Abstract: A thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support, which may be controlled in a closed-loop manner. Interfacing between circuits, circuit mounting structure, and the support provide for greatly enhanced cooling. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Abstract: An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as between component layers and between the circuits and the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Abstract: EMI shielding in an electric vehicle drive is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Abstract: A terminal structure provides interfacing with power electronics circuitry and external circuitry. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the terminal structure and the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Abstract: EMI shielding is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Abstract: A terminal structure for vehicle drive power electronics circuits reduces the need for a DC bus and thereby the incidence of parasitic inductance. The structure is secured to a support that may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as by direct contact between the terminal assembly and AC and DC circuit components. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Abstract: An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support, which may be controlled in a closed-loop manner. Interfacing between circuits, circuit mounting structure, and the support provide for greatly enhanced cooling. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.