Patents by Inventor Bruce C. Beihoff
Bruce C. Beihoff has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6972957Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: December 18, 2002Date of Patent: December 6, 2005Assignee: Rockwell Automation Technologies, Inc.Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Andreas A. Meyer, Neil Gollhardt, Daniel G. Kannenberg
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Patent number: 6965514Abstract: An electric vehicle drive includes a support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EM/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: December 23, 2002Date of Patent: November 15, 2005Assignee: Rockwell Automation Technologies, Inc.Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Andreas A. Meyer, Neil Gollhardt, Daniel G. Kannenberg
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Patent number: 6940715Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: September 16, 2003Date of Patent: September 6, 2005Assignee: Rockwell Automation Technologies, Inc.Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Andreas A. Meyer, Neil Gollhardt, Daniel G. Kannenberg
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Patent number: 6909614Abstract: A multi-layer power backplane system is disclosed for use with various power electronic and other systems. The power backplane includes multiple mechanical, conductor and isolation layers which serve to route power to and from various components. The layers are isolated from one another by support/isolation panels which may receive conductors used to route power. Data signals may also be routed through the system. The system accommodates fluid cooling of the electronic components by an additional layer of conduit support and isolation. The overall system provides a high degree of flexibility and modularity in defining a power backplane for a wide range of circuitry and components which may be mounted thereto once the power backplane is designed and assembled.Type: GrantFiled: September 30, 2003Date of Patent: June 21, 2005Assignee: Rockwell Automation Technologies, Inc.Inventors: Bruce C. Beihoff, Dennis L. Kehl, Timothy A. Roebke, Lee A. Gettelfinger
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Patent number: 6909607Abstract: A thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as between component layers and between the circuits and the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: December 18, 2002Date of Patent: June 21, 2005Assignee: Rockwell Automation Technologies, Inc.Inventors: Lawrence D. Radosevich, Daniel G. Kannenberg, Steven C. Kaishian, Bruce C. Beihoff
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Patent number: 6898072Abstract: A terminal structure provides interfacing with power electronics circuitry and external circuitry. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the terminal structure and the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: December 23, 2002Date of Patent: May 24, 2005Assignee: Rockwell Automation Technologies, Inc.Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Mark G. Phillips, Dennis L. Kehl, Steven C. Kaishian, Daniel G. Kannenberg
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Patent number: 6865080Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: December 23, 2002Date of Patent: March 8, 2005Assignee: Rockwell Automation Technologies, Inc.Inventors: Lawrence D. Radosevich, Andreas A. Meyer, Bruce C. Beihoff, Daniel G. Kannenberg
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Publication number: 20040066643Abstract: EMI shielding is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: ApplicationFiled: September 16, 2003Publication date: April 8, 2004Inventors: Bruce C. Beihoff, Dennis L. Kehl, Lee A. Gettelfinger, Steven C. Kaishian, Mark G. Phillips, Lawrence D. Radosevich
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Publication number: 20040061989Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: ApplicationFiled: September 16, 2003Publication date: April 1, 2004Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Andreas A. Meyer, Neil Gollhardt, Daniel G. Kannenberg
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Publication number: 20030151893Abstract: A thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support, which may be controlled in a closed-loop manner. Interfacing between circuits, circuit mounting structure, and the support provide for greatly enhanced cooling. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: ApplicationFiled: December 23, 2002Publication date: August 14, 2003Inventors: Andreas A. Meyer, Lawrence D. Radosevich, Bruce C. Beihoff, Dennis L. Kehl, Daniel G. Kannenberg
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Publication number: 20030133282Abstract: EMI shielding is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: ApplicationFiled: December 23, 2002Publication date: July 17, 2003Inventors: Bruce C. Beihoff, Dennis L. Kehl, Lee A. Gettelfinger, Steven C. Kaishian, Mark G. Phillips, Lawrence D. Radosevich
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Publication number: 20030133283Abstract: EMI shielding in an electric vehicle drive is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: ApplicationFiled: September 23, 2002Publication date: July 17, 2003Inventors: Bruce C. Beihoff, Dennis L. Kehl, Lee A. Gettelfinger, Steven C. Kaishian, Mark G. Phillips, Lawrence D. Radosevich
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Publication number: 20030133319Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: ApplicationFiled: December 23, 2002Publication date: July 17, 2003Inventors: Lawrence D. Radosevich, Andreas A. Meyer, Bruce C. Beihoff, Daniel G. Kannenberg
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Publication number: 20030132040Abstract: An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as between component layers and between the circuits and the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: ApplicationFiled: December 9, 2002Publication date: July 17, 2003Inventors: Lawrence D. Radosevich, Andreas A. Meyer, Daniel G. Kannenberg, Steven C. Kaishian, Bruce C. Beihoff
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Publication number: 20030133268Abstract: A thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as between component layers and between the circuits and the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: ApplicationFiled: December 18, 2002Publication date: July 17, 2003Inventors: Lawrence D. Radosevich, Daniel G. Kannenberg, Steven C. Kaishian, Bruce C. Beihoff
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Publication number: 20030132041Abstract: An electric vehicle drive includes a support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EM/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: ApplicationFiled: September 23, 2002Publication date: July 17, 2003Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Andreas A. Meyer, Neil Gollhardt, Daniel G. Kannenberg
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Publication number: 20030133267Abstract: A terminal structure provides interfacing with power electronics circuitry and external circuitry. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the terminal structure and the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: ApplicationFiled: December 23, 2002Publication date: July 17, 2003Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Mark G. Phillips, Dennis L. Kehl, Steven C. Kaishian, Daniel G. Kannenberg
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Publication number: 20030133257Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: ApplicationFiled: December 18, 2002Publication date: July 17, 2003Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Andreas A. Meyer, Neil Gollhardt, Daniel G. Kannenberg
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Publication number: 20030132042Abstract: A terminal structure for vehicle drive power electronics circuits reduces the need for a DC bus and thereby the incidence of parasitic inductance. The structure is secured to a support that may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as by direct contact between the terminal assembly and AC and DC circuit components. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: ApplicationFiled: September 23, 2002Publication date: July 17, 2003Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Mark G. Phillips, Dennis L. Kehl, Steven C. Kaishian, Daniel G. Kannenberg
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Publication number: 20030133259Abstract: An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support, which may be controlled in a closed-loop manner. Interfacing between circuits, circuit mounting structure, and the support provide for greatly enhanced cooling. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: ApplicationFiled: December 16, 2002Publication date: July 17, 2003Inventors: Andreas A. Meyer, Lawrence D. Radosevich, Bruce C. Beihoff, Dennis L. Kehl, Daniel G. Kannenberg