Abstract: The disclosure relates to a fingerprint sensing device and an electronic apparatus including the fingerprint sensing device. In one aspect, the fingerprint sensing device includes: a substrate, including a first surface and a second surface that are opposite to each other; a piezoelectric transducer, disposed on the first surface of the substrate; and a circuit board, disposed opposite to the piezoelectric transducer in a short side direction of the substrate. The circuit board is electrically connected to the first surface of the substrate by wire bonding, and a distance between the circuit board and the piezoelectric transducer is less than 2 mm. According to the disclosure, a reduction in the size of the fingerprint sensing device can be achieved.

Abstract: The embodiments of the present disclosure provide a biometric detection sensor and a signal processing method thereof. The biometric detection sensor includes an array of detection pixels, the signal processing method includes: acquiring a first detection signal of each detection pixel in the array of detection pixels; for each detection pixel of at least part of detection pixels, processing the first detection signal of the detection pixel based on a reference signal to obtain a detection processing signal of the detection pixel, wherein a resolution of the detection processing signal is lower than that of the first detection signal; and outputting the detection processing signals of the at least part of detection pixels in the array of detection pixels, wherein the detection processing signals are used for biometric identification. The signal processing method can effectively reduce the amount of data for the processor to receive and process during biometric identification.

Abstract: A heterogeneously substrate-bonded optical assembly includes a processor chip, an optical chip and a molding compound layer. The processor chip includes: a processor circuit; reader circuits electrically connected to the processor circuit; a first protection layer disposed on the processor circuit and the reader circuits; and first vias penetrating through first protection layer and being electrically connected to the reader circuit. The optical chip includes: a second protection layer bonded to the first protection layer; second vias penetrating through the second protection layer and being bonded to the first vias; and optical pixels electrically connected to the reader circuit respectively through the second vias and the first vias. The molding compound layer surrounds the optical chip and is disposed on the first protection layer. A method of manufacturing the optical assembly applicable to high-resolution applications is also disclosed.

Abstract: The embodiments of the present disclosure provide a biometric detection sensor and a signal processing method thereof. The biometric detection sensor includes an array of detection pixels, the signal processing method includes: acquiring a first detection signal of each detection pixel in the array of detection pixels; for each detection pixel of at least part of detection pixels, processing the first detection signal of the detection pixel based on a reference signal to obtain a detection processing signal of the detection pixel, wherein a resolution of the detection processing signal is lower than that of the first detection signal; and outputting the detection processing signals of the at least part of detection pixels in the array of detection pixels, wherein the detection processing signals are used for biometric identification. The signal processing method can effectively reduce the amount of data for the processor to receive and process during biometric identification.

Abstract: A biometrics sensor includes: a digital light-emitting module including a first region and a second region, wherein the first region outputs incident light; and a sensing module disposed below the digital light-emitting module, wherein in a first mode, the second region does not output light having a wavelength the same as a wavelength of the incident light, so that the digital light-emitting module provides a defective optical field to irradiate an object disposed above the digital light-emitting module, and light generated by the object responsive to the defective optical field is received by the sensing module.

Abstract: The invention provides a photoelectric sensor including a substrate and multiple pixel structures. The pixel structures are disposed on the substrate and arranged in an array. Each of the pixel structures includes a transistor and a photodiode. The photodiode includes a first electrode, a photosensitive layer, and a second electrode. The first electrode and the transistor are laterally arranged side by side. A first part of the photosensitive layer is disposed on the first electrode, and a second part of the photosensitive layer extends from the first part to above the transistor. The second electrode is disposed on the photosensitive layer, and is located above the first electrode and the transistor.

Abstract: A light sensing module including a photodiode array substrate, a distance increasing layer, and a light converging element array is provided. The photodiode array substrate includes a plurality of light sensing units arranged in an array and a circuit region. The circuit region is disposed on the periphery of the light sensing units. Each of the light sensing units includes a plurality of adjacent photodiodes arranged in an array. The distance increasing layer is disposed on the photodiode array substrate. The light converging element array is disposed on the distance increasing layer, and includes a plurality of light converging units arranged in an array. Reflected light from an outside is converged by the light converging elements on the light sensing units, respectively.

Abstract: The present disclosure provides an optical sensor, an optical distance sensing module and a fabricating method thereof. According to the embodiments of the present disclosure, the optical sensor includes an optical sensing layer, a light transmitting layer and a light blocking layer. The optical sensing layer includes an array of optical sensing elements, the light transmitting layer is coated on the optical sensing layer, and the light blocking layer includes one or more light incident holes and is coated on the light transmitting layer. The optical sensing layer, the light transmitting layer and the light blocking layer are packaged as a wafer die. Light passes through the light incident holes and transmits through the light transmitting layer to irradiate on the array of optical sensing elements. The optical sensor effectively reduces the thickness, size and weight of the optical sensor, thereby expanding the application range of the optical sensor.

Abstract: An electronic device with a fingerprint sensor and a high resolution display adapted to each other includes a display and a fingerprint sensor. The display has display pixels. A transversal pitch P is formed between adjacent two of the display pixels. The fingerprint sensor senses a fingerprint of a finger disposed on or above the display. The fingerprint sensor is a BSI fingerprint sensor and includes a sensing chip and an optical module. The sensing chip has sensing cells each having a transversal dimension A. The optical module disposed between the sensing chip and the display has a magnification power M, where A x M ? P, and A > 5 µm.

Abstract: A light-receiving cell and an optical biometrics sensor using the same are provided. The light-receiving cell for converting optical energy into electrical energy includes: one or multiple main light-receiving regions; and a connection region directly connected to the one or multiple main light-receiving regions to form an area-reduced light-receiving region, wherein the light-receiving region has one or multiple area reduced parts to decrease junction capacitance and increase a sensing voltage signal.

Abstract: A pseudo-piezoelectric d33 device includes a nano-gap, and a pair of integral and substantially parallel electrodes having a first sensing electrode and a second sensing electrode. The first sensing electrode and the second sensing electrode constitute a receiver. The nano-gap is disposed between the first sensing electrode and the second sensing electrode. An initial height of the nano-gap is smaller than or equal to 100 nanometers. The nano-gap is formed after a thermal reaction between a semiconductor material and a metal material to form a semiconductor-metal compound. The first sensing electrode of the receiver includes the semiconductor-metal compound to provide an integral capacitive sensing electrode to sense a capacitance change with the second sensing electrode and generate a sensing signal.

Abstract: A light sensing module including a photodiode array substrate, a distance increasing layer, and a light converging element array is provided. The photodiode array substrate includes a plurality of light sensing units arranged in an array and a circuit region. The circuit region is disposed on the periphery of the light sensing units. Each of the light sensing units includes a plurality of adjacent photodiodes arranged in an array. The distance increasing layer is disposed on the photodiode array substrate. The light converging element array is disposed on the distance increasing layer, and includes a plurality of light converging units arranged in an array. Reflected light from an outside is converged by the light converging elements on the light sensing units, respectively.

Abstract: A fingerprint sensing module suitable for receiving a sensing light beam and an electronic device is provided. The fingerprint sensing module includes a sensing element, a light transmitting layer disposed on the sensing element, a micro-lens layer disposed on the light transmitting layer, and a first light shielding layer disposed in the light transmitting layer and including multiple first openings arranged in an array. Positions of the first openings in odd-numbered rows are the same, and those in even-numbered rows are the same. Positions the first openings in the odd-numbered rows are different from those in the even-numbered rows. A sensing light beam includes multiple first light beams incident to a part of a sensing unit in a first transmission direction and multiple second light beams incident to another part of the sensing unit in a second transmission direction. The first transmission direction is different from the second transmission direction.

Abstract: An integrated optical sensor includes a substrate, an optical module layer and micro lenses. The substrate has sensing pixels. The optical module layer is disposed on the substrate. The micro lenses are disposed on the optical module layer. A thickness of the optical module layer defines a focal length of the micro lenses, and the sensing pixels sense object light of an object, which is focused by the micro lenses and optically processed by the optical module layer. The optical module layer includes a metal light shielding layer and an inter-metal dielectric layer disposed above the metal light shielding layer. The object light reaches the sensing pixels through apertures of the metal light shielding layer. A method of manufacturing the integrated optical sensor is also provided.

Abstract: A fingerprint sensing device and an operation method thereof are provided. The fingerprint sensing device includes a sensing pixel array and a processing circuit. The sensing pixel array senses a finger during a fingerprint sensing period to obtain a fingerprint sensing signal. At least one pixel area of the sensing pixel array further continuously senses the finger during the fingerprint sensing period to obtain a physiological characteristic signal. The processing circuit is coupled to the sensing pixel array. The processing circuit generates a fingerprint image according to the fingerprint sensing signal, and generates physiological characteristic information according to the physiological characteristic signal.

Abstract: An integrated spectrum sensing device for real-finger judgement includes a fingerprint sensing array, an optical unit and a signal processing unit. The fingerprint sensing array optically coupled to the optical unit includes multiple spectrum detecting units receiving light from a finger through the optical unit to detect spectrum distributions or variations outputted from the finger to obtain multiple sets of heterogeneous spectrum data. The signal processing unit electrically coupled to the spectrum detecting units performs measurement domain analysis according to the sets of heterogeneous spectrum data to judge whether the finger is real. A sensing method is also disclosed.

Abstract: A touch display device with a fingerprint anti-spoofing function and an associated fingerprint anti-spoofing method are provided, where the touch display device may include a touch display panel and a processing circuit. The touch display panel may include a plurality of display units and one or more codebooks, where each of the display units includes a sensor unit, and the one or more codebooks may make the sensor units receive sensing information of an object which is put on the touch display panel. In addition, the processing circuit may obtain the sensing information from the sensor units, and determine whether the object is a real finger based on the sensing information and reference information.

Abstract: A TOF optical sensing module includes: a substrate; a cap including a body and a receiving window, a transmitting window and a stopper structure all connected to the body defining a chamber with the body; and a transceiving unit being disposed in the chamber, outputting detection light and receiving sensing light through the receiving window, wherein the stopper structure divides the chamber into a receiving chamber and an emitting chamber, which are respectively disposed beneath the receiving window and the transmitting window and dis-communicated from each other, in conjunction with the transceiving unit. The transceiving unit includes a light reference region including: at least a reference pixel disposed beneath the stopper structure; and a light-guiding structure optically coupled to the reference pixel and the emitting chamber, so that the reference pixel receives reference light through the emitting chamber and the light-guiding structure to generate an electric reference signal.

Abstract: A pseudo-piezoelectric d33 device includes a nano-gap, and a pair of integral and substantially parallel electrodes having a first sensing electrode and a second sensing electrode. The first sensing electrode and the second sensing electrode constitute a receiver. The nano-gap is disposed between the first sensing electrode and the second sensing electrode. An initial height of the nano-gap is smaller than or equal to 100 nanometers. The nano-gap is formed after a thermal reaction between a semiconductor material and a metal material to form a semiconductor-metal compound. The first sensing electrode of the receiver includes the semiconductor-metal compound to provide an integral capacitive sensing electrode to sense a capacitance change with the second sensing electrode and generate a sensing signal.

Abstract: A pseudo-piezoelectric d33 vibration device includes transistors and receivers electrically connected to the transistors. Each transistor controls a corresponding one of the receivers to receive a second vibration wave, generated after an object reflects a first vibration wave, and to generate a sensing signal. Each receiver has a first electrode, a second electrode and a nano-gap, which is created between the first and second electrodes after a semiconductor-metal compound is formed. A display integrating the pseudo-piezoelectric d33 vibration device is also provided.