Patents by Inventor Bruce C. S. Chou

Bruce C. S. Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230261013
    Abstract: The invention provides a photoelectric sensor including a substrate and multiple pixel structures. The pixel structures are disposed on the substrate and arranged in an array. Each of the pixel structures includes a transistor and a photodiode. The photodiode includes a first electrode, a photosensitive layer, and a second electrode. The first electrode and the transistor are laterally arranged side by side. A first part of the photosensitive layer is disposed on the first electrode, and a second part of the photosensitive layer extends from the first part to above the transistor. The second electrode is disposed on the photosensitive layer, and is located above the first electrode and the transistor.
    Type: Application
    Filed: November 27, 2020
    Publication date: August 17, 2023
    Applicant: Egis Technology Inc.
    Inventors: Bruce C. S. Chou, Chen-Chang Huang, Chen-Chih Fan
  • Publication number: 20230181067
    Abstract: An in-cell optical biometrics sensor includes: a display unit sets each including one or multiple display units; optical sensing cells respectively disposed in gaps between the display unit sets; and optical modules respectively disposed adjacently to the optical sensing cells, wherein each optical module includes a light shielding layer for shielding stray light, and the optical sensing cells sense biometrics characteristics of an object through the optical modules. Thus, the optical biometrics sensor can be integrated in a display panel to provide partial or full-display optical biometrics characteristics sensing functions.
    Type: Application
    Filed: September 11, 2020
    Publication date: June 15, 2023
    Inventors: CHEN-CHIH FAN, CHENCHANG HUANG, BRUCE C.S. CHOU
  • Publication number: 20230132008
    Abstract: The present disclosure provides an optical sensor, an optical distance sensing module and a fabricating method thereof. According to the embodiments of the present disclosure, the optical sensor includes an optical sensing layer, a light transmitting layer and a light blocking layer. The optical sensing layer includes an array of optical sensing elements, the light transmitting layer is coated on the optical sensing layer, and the light blocking layer includes one or more light incident holes and is coated on the light transmitting layer. The optical sensing layer, the light transmitting layer and the light blocking layer are packaged as a wafer die. Light passes through the light incident holes and transmits through the light transmitting layer to irradiate on the array of optical sensing elements. The optical sensor effectively reduces the thickness, size and weight of the optical sensor, thereby expanding the application range of the optical sensor.
    Type: Application
    Filed: August 11, 2022
    Publication date: April 27, 2023
    Inventors: Chen-Chih Fan, Bruce C. S. Chou
  • Publication number: 20230076799
    Abstract: An electronic device with a fingerprint sensor and a high resolution display adapted to each other includes a display and a fingerprint sensor. The display has display pixels. A transversal pitch P is formed between adjacent two of the display pixels. The fingerprint sensor senses a fingerprint of a finger disposed on or above the display. The fingerprint sensor is a BSI fingerprint sensor and includes a sensing chip and an optical module. The sensing chip has sensing cells each having a transversal dimension A. The optical module disposed between the sensing chip and the display has a magnification power M, where A x M ? P, and A > 5 ┬Ám.
    Type: Application
    Filed: July 8, 2020
    Publication date: March 9, 2023
    Inventors: BRUCE C. S. CHOU, Wan-Ting CHIEN
  • Publication number: 20230063838
    Abstract: A light-receiving cell and an optical biometrics sensor using the same are provided. The light-receiving cell for converting optical energy into electrical energy includes: one or multiple main light-receiving regions; and a connection region directly connected to the one or multiple main light-receiving regions to form an area-reduced light-receiving region, wherein the light-receiving region has one or multiple area reduced parts to decrease junction capacitance and increase a sensing voltage signal.
    Type: Application
    Filed: August 12, 2021
    Publication date: March 2, 2023
    Inventors: BRUCE C. S. CHOU, CHENCHANG HUANG, CHEN-CHIH FAN
  • Patent number: 11545612
    Abstract: A pseudo-piezoelectric d33 device includes a nano-gap, and a pair of integral and substantially parallel electrodes having a first sensing electrode and a second sensing electrode. The first sensing electrode and the second sensing electrode constitute a receiver. The nano-gap is disposed between the first sensing electrode and the second sensing electrode. An initial height of the nano-gap is smaller than or equal to 100 nanometers. The nano-gap is formed after a thermal reaction between a semiconductor material and a metal material to form a semiconductor-metal compound. The first sensing electrode of the receiver includes the semiconductor-metal compound to provide an integral capacitive sensing electrode to sense a capacitance change with the second sensing electrode and generate a sensing signal.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: January 3, 2023
    Assignee: MAY SUN TECHNOLOGY CO., LTD.
    Inventor: Bruce C. S. Chou
  • Publication number: 20220301337
    Abstract: A fingerprint sensing module suitable for receiving a sensing light beam and an electronic device is provided. The fingerprint sensing module includes a sensing element, a light transmitting layer disposed on the sensing element, a micro-lens layer disposed on the light transmitting layer, and a first light shielding layer disposed in the light transmitting layer and including multiple first openings arranged in an array. Positions of the first openings in odd-numbered rows are the same, and those in even-numbered rows are the same. Positions the first openings in the odd-numbered rows are different from those in the even-numbered rows. A sensing light beam includes multiple first light beams incident to a part of a sensing unit in a first transmission direction and multiple second light beams incident to another part of the sensing unit in a second transmission direction. The first transmission direction is different from the second transmission direction.
    Type: Application
    Filed: April 29, 2020
    Publication date: September 22, 2022
    Applicants: Egis Technology Inc.
    Inventors: Yu-Hsiang Huang, Chen-Chih Fan, Yu-Kuo Cheng, Bruce C. S. Chou
  • Publication number: 20220299361
    Abstract: A light sensing module including a photodiode array substrate, a distance increasing layer, and a light converging element array is provided. The photodiode array substrate includes a plurality of light sensing units arranged in an array and a circuit region. The circuit region is disposed on the periphery of the light sensing units. Each of the light sensing units includes a plurality of adjacent photodiodes arranged in an array. The distance increasing layer is disposed on the photodiode array substrate. The light converging element array is disposed on the distance increasing layer, and includes a plurality of light converging units arranged in an array. Reflected light from an outside is converged by the light converging elements on the light sensing units, respectively.
    Type: Application
    Filed: October 13, 2021
    Publication date: September 22, 2022
    Applicant: Egis Technology Inc.
    Inventors: Chen-Chih Fan, Bruce C. S. Chou
  • Publication number: 20220293657
    Abstract: An integrated optical sensor includes a substrate, an optical module layer and micro lenses. The substrate has sensing pixels. The optical module layer is disposed on the substrate. The micro lenses are disposed on the optical module layer. A thickness of the optical module layer defines a focal length of the micro lenses, and the sensing pixels sense object light of an object, which is focused by the micro lenses and optically processed by the optical module layer. The optical module layer includes a metal light shielding layer and an inter-metal dielectric layer disposed above the metal light shielding layer. The object light reaches the sensing pixels through apertures of the metal light shielding layer. A method of manufacturing the integrated optical sensor is also provided.
    Type: Application
    Filed: March 18, 2020
    Publication date: September 15, 2022
    Inventors: Bruce C. S. CHOU, Chen-Chih FAN
  • Publication number: 20220254185
    Abstract: A fingerprint sensing device and an operation method thereof are provided. The fingerprint sensing device includes a sensing pixel array and a processing circuit. The sensing pixel array senses a finger during a fingerprint sensing period to obtain a fingerprint sensing signal. At least one pixel area of the sensing pixel array further continuously senses the finger during the fingerprint sensing period to obtain a physiological characteristic signal. The processing circuit is coupled to the sensing pixel array. The processing circuit generates a fingerprint image according to the fingerprint sensing signal, and generates physiological characteristic information according to the physiological characteristic signal.
    Type: Application
    Filed: January 20, 2022
    Publication date: August 11, 2022
    Applicant: Egis Technology Inc.
    Inventors: Bruce C. S. Chou, Tong-Long Fu
  • Patent number: 11398111
    Abstract: An integrated spectrum sensing device for real-finger judgement includes a fingerprint sensing array, an optical unit and a signal processing unit. The fingerprint sensing array optically coupled to the optical unit includes multiple spectrum detecting units receiving light from a finger through the optical unit to detect spectrum distributions or variations outputted from the finger to obtain multiple sets of heterogeneous spectrum data. The signal processing unit electrically coupled to the spectrum detecting units performs measurement domain analysis according to the sets of heterogeneous spectrum data to judge whether the finger is real. A sensing method is also disclosed.
    Type: Grant
    Filed: January 5, 2021
    Date of Patent: July 26, 2022
    Assignee: EGIS TECHNOLOGY INC.
    Inventors: Bruce C. S. Chou, Tong-Long Fu
  • Patent number: 11288893
    Abstract: A touch display device with a fingerprint anti-spoofing function and an associated fingerprint anti-spoofing method are provided, where the touch display device may include a touch display panel and a processing circuit. The touch display panel may include a plurality of display units and one or more codebooks, where each of the display units includes a sensor unit, and the one or more codebooks may make the sensor units receive sensing information of an object which is put on the touch display panel. In addition, the processing circuit may obtain the sensing information from the sensor units, and determine whether the object is a real finger based on the sensing information and reference information.
    Type: Grant
    Filed: October 19, 2020
    Date of Patent: March 29, 2022
    Assignee: Egis Technology Inc.
    Inventors: Tung-Yu Wu, Tang-Hung Po, Yu-Hsuan Lin, Bruce C. S. Chou
  • Publication number: 20220082663
    Abstract: A TOF optical sensing module includes: a substrate; a cap including a body and a receiving window, a transmitting window and a stopper structure all connected to the body defining a chamber with the body; and a transceiving unit being disposed in the chamber, outputting detection light and receiving sensing light through the receiving window, wherein the stopper structure divides the chamber into a receiving chamber and an emitting chamber, which are respectively disposed beneath the receiving window and the transmitting window and dis-communicated from each other, in conjunction with the transceiving unit. The transceiving unit includes a light reference region including: at least a reference pixel disposed beneath the stopper structure; and a light-guiding structure optically coupled to the reference pixel and the emitting chamber, so that the reference pixel receives reference light through the emitting chamber and the light-guiding structure to generate an electric reference signal.
    Type: Application
    Filed: August 27, 2021
    Publication date: March 17, 2022
    Inventors: BRUCE C. S. CHOU, CHEN-CHIH FAN
  • Publication number: 20220082670
    Abstract: A TOF optical sensing module includes: a substrate; a cap having a body and a receiving window and a transmitting window both connected to the body, wherein the body and the substrate commonly define a chamber; and a transceiving unit being disposed in the chamber and including: a light sensing region being disposed beneath the receiving window and including an angular sensing-end light-guiding structure and at least a sensing pixel, wherein the angular sensing-end light-guiding structure is configured to stop reference light, coming from the chamber and a location below the transmitting window, from entering the sensing pixel, but allow sensing light to be received by the sensing pixel through the receiving window to generate an electric sensing signal.
    Type: Application
    Filed: August 27, 2021
    Publication date: March 17, 2022
    Inventors: Bruce C.S. CHOU, CHEN-CHIH FAN
  • Publication number: 20220082672
    Abstract: A TOF optical sensing module to be disposed below a protection cover plate includes: a substrate; a cap having a cap body, and a receiving window, a transmitting window and a stray-light guide-away structure, which are connected to the cap body, wherein the cap and the substrate commonly define a chamber body; and a transceiving unit, which is disposed on the substrate, in the chamber body, outputs detection light through the transmitting window, and receives sensing light through the receiving window. The stray-light guide-away structure is disposed between an outer side between the protection cover plate and the cap body and between the transmitting window and the receiving window, and stops stray light from entering the transceiving unit through the receiving window.
    Type: Application
    Filed: June 25, 2021
    Publication date: March 17, 2022
    Inventors: BRUCE C.S. CHOU, CHEN-CHIH FAN
  • Publication number: 20210296565
    Abstract: A pseudo-piezoelectric d33 device includes a nano-gap, and a pair of integral and substantially parallel electrodes having a first sensing electrode and a second sensing electrode. The first sensing electrode and the second sensing electrode constitute a receiver. The nano-gap is disposed between the first sensing electrode and the second sensing electrode. An initial height of the nano-gap is smaller than or equal to 100 nanometers. The nano-gap is formed after a thermal reaction between a semiconductor material and a metal material to form a semiconductor-metal compound. The first sensing electrode of the receiver includes the semiconductor-metal compound to provide an integral capacitive sensing electrode to sense a capacitance change with the second sensing electrode and generate a sensing signal.
    Type: Application
    Filed: June 7, 2021
    Publication date: September 23, 2021
    Inventor: BRUCE C. S. CHOU
  • Publication number: 20210271851
    Abstract: An integrated spectrum sensing device for real-finger judgement includes a fingerprint sensing array, an optical unit and a signal processing unit. The fingerprint sensing array optically coupled to the optical unit includes multiple spectrum detecting units receiving light from a finger through the optical unit to detect spectrum distributions or variations outputted from the finger to obtain multiple sets of heterogeneous spectrum data. The signal processing unit electrically coupled to the spectrum detecting units performs measurement domain analysis according to the sets of heterogeneous spectrum data to judge whether the finger is real. A sensing method is also disclosed.
    Type: Application
    Filed: January 5, 2021
    Publication date: September 2, 2021
    Inventors: Bruce C.S. CHOU, Tong-Long FU
  • Patent number: 11061519
    Abstract: A pseudo-piezoelectric d33 vibration device includes transistors and receivers electrically connected to the transistors. Each transistor controls a corresponding one of the receivers to receive a second vibration wave, generated after an object reflects a first vibration wave, and to generate a sensing signal. Each receiver has a first electrode, a second electrode and a nano-gap, which is created between the first and second electrodes after a semiconductor-metal compound is formed. A display integrating the pseudo-piezoelectric d33 vibration device is also provided.
    Type: Grant
    Filed: April 27, 2020
    Date of Patent: July 13, 2021
    Assignee: MAY SUN TECHNOLOGY CO., LTD.
    Inventor: Bruce C. S. Chou
  • Publication number: 20210209327
    Abstract: A touch display device with a fingerprint anti-spoofing function and an associated fingerprint anti-spoofing method are provided, where the touch display device may include a touch display panel and a processing circuit. The touch display panel may include a plurality of display units and one or more codebooks, where each of the display units includes a sensor unit, and the one or more codebooks may make the sensor units receive sensing information of an object which is put on the touch display panel. In addition, the processing circuit may obtain the sensing information from the sensor units, and determine whether the object is a real finger based on the sensing information and reference information.
    Type: Application
    Filed: October 19, 2020
    Publication date: July 8, 2021
    Inventors: Tung-Yu Wu, Tang-Hung Po, Yu-Hsuan Lin, Bruce C. S. Chou
  • Patent number: 10854567
    Abstract: Embodiments of the present disclosure include a semiconductor device and methods of forming a semiconductor device. An embodiment is a method of forming a semiconductor device, the method comprising forming a conductive pad in a first substrate, forming an interconnecting structure over the conductive pad and the first substrate, the interconnecting structure comprising a plurality of metal layers disposed in a plurality of dielectric layers, bonding a die to a first side of the interconnecting structure, and etching the first substrate from a second side of the interconnecting structure, the etching exposing a portion of the conductive pad.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: December 1, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shang-Yun Hou, Sao-Ling Chiu, Ping-Kang Huang, Wen-Hsin Wei, Wen-Chih Chiou, Shin-Puu Jeng, Bruce C. S. Chou